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Indyk
Benjamin Indyk, San Diego, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110131520 | System and method for transferring media content from a mobile device to a home network - A system and a method transfer media content from a mobile device to a home network. A media application on the mobile device may be enabled to share media content with rendering devices in the home network. A user may enable and disable transfer of the media content from the media application to a target rendering device. Further, the media application may indicate visually the target rendering device and whether the media content is currently being transferred. Still further, the user may select a new target rendering device. Moreover, the media application may indicate network errors or other problems which may prevent the rendering of the media content and may enable the user to correct the network errors or the other problems. | 06-02-2011 |
Gal Indyk, Kiryat Tivon IL
| Patent application number | Description | Published |
|---|---|---|
| 20080224470 | Connecting Elements For Construction - New and unique connecting elements are engage in a versatile manner to construct modular constructions such as construction for exhibition, furniture, platforms, toys, displays etc. The modular construction is mobile and easy to handle. | 09-18-2008 |
| 20090311038 | METHOD OF CONFIGURING A CONSTRUCTION - The invention discloses a method of configuring a construction made of plurality of straight rods and a plurality of connecting elements comprising providing a plurality of agents connecting the plurality of agents to the straight rods wherein by rotating the agent about the rod, the rod is transformed into a rotational axle. The method further comprising adjusting an angle of the agent in respect of the rod. Rotating the agents about the rods in different angles can provide the desirable configuration of the construction. | 12-17-2009 |
Piotr Indyk, Cambridge, MA US
| Patent application number | Description | Published |
|---|---|---|
| 20080275908 | SYSTEM, METHOD AND COMPUTER-READABLE MEDIUM FOR PROVIDING PATTERN MATCHING - A system, method and computer-readable medium are disclosed for identifying representative data using sketches. The method embodiment comprises generating a plurality of vectors from a data set, modifying each of the vectors of the plurality of vectors and selecting one of the plurality of generated vectors according to a comparison of a summed distance between a modified vector associated with the selected generated vector and remaining modified vectors. Modifying the generated vectors may involve reduced each generated vector to a lower dimensional vector. The summed distance then represents a summed distance between the lower dimensional vector and remaining lower dimensional vectors. | 11-06-2008 |
| 20100057805 | System, Method and Computer-Readable Medium for Providing Pattern Matching - A system, method and computer-readable medium are disclosed for identifying representative data using sketches. The method embodiment comprises generating a plurality of vectors from a data set, modifying each of the vectors of the plurality of vectors and selecting one of the plurality of generated vectors according to a comparison of a summed distance between a modified vector associated with the selected generated vector and remaining modified vectors. Modifying the generated vectors may involve reduced each generated vector to a lower dimensional vector. The summed distance then represents a summed distance between the lower dimensional vector and remaining lower dimensional vectors. | 03-04-2010 |
Richard F. Indyk, Wappingers Falls, NY US
| Patent application number | Description | Published |
|---|---|---|
| 20080218971 | METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink. | 09-11-2008 |
| 20080310117 | METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink. | 12-18-2008 |
| 20090120999 | HIGH TIN SOLDER ETCHING SOLUTION - A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and uses an etchant composition comprising cupric ions and HCl. Cupric chloride and cupric sulfate are preferred. A preferred method regenerates cupric ions by bubbling air or oxygen through the etchant solution during the cleaning process. | 05-14-2009 |