Inasaki

Ichiro Inasaki, Kanagawa JP

Patent application number	Description	Published
20100011923	METHOD OF MINIMAL QUANTITY LUBRICATION CUTTING/GRINDING PROCESSING AND OIL COMPOSITION USED THEREFOR - The present invention provides a method of minimal quantity lubrication cutting and grinding that can improve cutting and grinding properties and extend the life of tools. The minimal quantity lubrication cutting and grinding method of the present invention comprises supplying a compressed fluid containing 0.1 to 15 percent by volume of oxygen together with a cutting and grinding oil (particularly preferably an oil composition comprising an ester) to processing spots of a workpiece.	01-21-2010

Patent application number	Description	Published
20100248143	ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, AND PATTERN-FORMING METHOD USING THE SAME - Provided is an actinic ray-sensitive or radiation-sensitive resin composition, a resist film formed with the composition, and a pattern-forming method using the same. The actinic ray-sensitive or radiation-sensitive resin composition includes (P) a resin that contains the following repeating units (A), (B) and (C); and a solvent having a boiling temperature of 150° C. or less,	09-30-2010

Patent application number	Description	Published
20100248149	ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION AND RESIST FILM AND PATTERN FORMING METHOD USING THE COMPOSITION - Provided is an actinic ray-sensitive or radiation-sensitive resin composition including (P) a resin which contains (A) a repeating unit having an ionic structure moiety capable of producing an acid anion on the side chain upon irradiation with an actinic ray or radiation, wherein a cation moiety of the ionic structure moiety has an acid-decomposable group or an alkali-decomposable group.	09-30-2010