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| 20080249223 | Sheet composition of thermoplastic polyolefin elastomer for water based coating treatment - The present invention relates to a thermoelastic polyolefin-based elastomer sheet composition for water based coating treatment, which comprises a partially crosslinked thermoelastic polyolefin-based elastomer resin, a non-crosslinked thermoelastic polyolefin-based elastomer resin, a polypropylene resin, an ethylene octene rubber resin, a linear low density polyethylene resin, polyethylene master batch containing a lubricant, and an inorganic filler, the composition being useful for vehicular inner parts (e.g., crash pad) due to its superior elongation, heat resistance, humidity resistance and molding property. | 10-09-2008 |
| 20100007162 | APPARATUS AND METHOD FOR MANUFACTURING SUPER HIGH FLUIDITY URETHANE-BASED SPHERICAL FINE POWDER - The present invention provides an apparatus and method for manufacturing super high fluidity urethane-based spherical fine powder for powder slush molding by melting and mixing a super high fluidity urethane-based thermoplastic resin at high temperature, passing the thermoplastic resin through micro-sized fine holes to be extruded into a fine diameter, cutting the extruded thermoplastic resin into spherical fine powder having a uniform particle size, and drying the cut spherical fine powder. | 01-14-2010 |
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| 20080308845 | Heterogeneous Group IV Semiconductor Substrates - Embodiments of the present invention include heterogeneous substrates, integrated circuits formed on such heterogeneous substrates. The heterogeneous substrates according to certain embodiments of the present invention include a first Group IV semiconductor layer (e.g., silicon), a second Group IV pattern (e.g., a silicon-germanium pattern) that includes a plurality of individual elements on the first Group IV semiconductor layer, and a third Group IV semiconductor layer (e.g., a silicon epitaxial layer) on the second Group IV pattern and on a plurality of exposed portions of the first Group IV semiconductor layer. The second Group IV pattern may be removed in embodiments of the present invention. In these and other embodiments of the present invention, the third Group IV semiconductor layer may be planarized. | 12-18-2008 |
| 20090130826 | Method of Forming a Semiconductor Device Having a Strained Silicon Layer on a Silicon-Germanium Layer - A method of forming a semiconductor device having a strained silicon (Si) layer on a silicon germanium (SiGe) layer is provided. The method includes preparing a silicon substrate. A SiGe layer is formed on the silicon substrate. At least a part of the SiGe layer has a first dislocation density. A strained Si layer having a second dislocation density lower than the first dislocation density is formed on the SiGe layer. | 05-21-2009 |
| 20100041201 | Methods of Fabricating MOS Transistors Having Recesses with Elevated Source/Drain Regions - Methods of fabricating metal-oxide-semiconductor (MOS) transistors having elevated source/drain regions are provided. The MOS transistors formed by these methods may include a gate pattern formed to cross over a predetermined region of a substrate. Recessed regions are provided in the substrate adjacent to the gate pattern. Epitaxial layers are provided on bottom surfaces of the recessed regions. High concentration impurity regions are provided in the epitaxial layers. The recessed regions may be formed using a chemical dry etching techniques. | 02-18-2010 |
| 20100159689 | SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS WITH STRESS BUFFER SPACERS AND METHODS OF FABRICATING THE SAME - A semiconductor device includes an inorganic insulating layer on a semiconductor substrate, a contact plug that extends through the inorganic insulating layer to contact the semiconductor substrate and a stress buffer spacer disposed between the node contact plug and the inorganic insulating layer. The device further includes a thin-film transistor (TFT) disposed on the inorganic insulating layer and having a source/drain region extending along the inorganic insulating layer to contact the contact plug. The device may further include an etch stop layer interposed between the inorganic insulating layer and the semiconductor substrate. | 06-24-2010 |
| 20110300704 | SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS WITH STRESS BUFFER SPACERS AND METHODS OF FABRICATING THE SAME - A semiconductor device includes an inorganic insulating layer on a semiconductor substrate, a contact plug that extends through the inorganic insulating layer to contact the semiconductor substrate and a stress buffer spacer disposed between the node contact plug and the inorganic insulating layer. The device further includes a thin-film transistor (TFT) disposed on the inorganic insulating layer and having a source/drain region extending along the inorganic insulating layer to contact the contact plug. The device may further include an etch stop layer interposed between the inorganic insulating layer and the semiconductor substrate. | 12-08-2011 |
| 20120034746 | Methods of Fabricating MOS Transistors Having Recesses With Elevated Source/Drain Regions - Methods of fabricating metal-oxide-semiconductor (MOS) transistors having elevated source/drain regions are provided. The MOS transistors formed by these methods may include a gate pattern formed to cross over a predetermined region of a substrate. Recessed regions are provided in the substrate adjacent to the gate pattern. Epitaxial layers are provided on bottom surfaces of the recessed regions. High concentration impurity regions are provided in the epitaxial layers. The recessed regions may be formed using a chemical dry etching techniques. | 02-09-2012 |
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| 20090020871 | SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAME - A semiconductor chip having a solder bump and a method of fabricating the same are provided. Conventionally, an inter-metallic compound (IMC) unexpectedly grows at an interface of the solder bump by means of heat generated during operation of the semiconductor chip, thereby weakening mechanical property of the semiconductor chip. To solve this drawback, the semiconductor chip includes at least one metal adhesion layer formed on an electrode pad of the semiconductor chip, an interlayer isolation layer formed on the metal adhesion layer, at least one penetration layer formed on the interlayer isolation layer and penetrating into the solder bump, and the solder bump formed on the penetration layer. Thereby, materials of the penetration layer penetrate into the solder bump to change the solder bump into a multi-component solder bump, so that the growth of the IMC is suppressed, and the reliability of the semiconductor chip can be improved. | 01-22-2009 |
| 20100230810 | FLIP CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - There is provide a flip chip semiconductor package comprising: an electrode pad formed a semiconductor substrate; a lower metal bonding layer formed on the electrode pad; an upper metal bonding layer formed on the lower metal bonding layer and having a post shape of a predetermined height; and a conductive bump formed on the upper metal bonding layer, and a solder bump covers at least partially the surface of the upper metal bonding layer. An insulating layer for electrode reconfiguration is formed around the electrode pad on the substrate, and the insulating layer has a predetermined thickness to prevent the penetration of a particles from the solder bump. The semiconductor package may further comprise an oxidation preventing layer between the solder bump and the upper metal bonding layer. In accordance with the present invention, there is realized the flip chip semiconductor package which improves the adhesive strength of the solder bump and which more improves the reliability in the flip chip bump structure of fine pitches. | 09-16-2010 |
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| 20080288096 | Digital media player with circuitry for avoiding refreshing a database of metadata associated with digital media content - A digital media player with circuitry for avoiding refreshing a database of metadata associated with digital media content is disclosed. In one embodiment, a digital media player storing a database of metadata associated with digital media content determines whether a removable memory device was connected with the digital media player while the digital media player was powered down. The digital media player refreshes the database only if it is determined that the removable memory device was connected with the digital media player while the digital media player was powered down. In another embodiment, the digital media player determines whether the digital media content stored on the removable memory device changed since the database was last updated. The digital media player refreshes the database if it is determined that the digital media content stored on the removable memory device changed since the database was last updated. | 11-20-2008 |
| 20080288097 | Method for improving a digital media player experience - A method for improving a digital media player experience is disclosed. In one embodiment, a digital media player storing a media transfer protocol database determines that digital media content stored on a removable memory device connected with the digital media player changed since the media transfer protocol database was last updated. The digital media player then refreshes the media transfer protocol database with metadata associated with the digital media content stored in the removable memory device. In another embodiment, a digital media player stores digital media content in the removable memory device, stores auxiliary information associated with the digital media content in a memory of the digital media player, and stores the auxiliary information in the removable memory device. In this way, the auxiliary information is portable with the removable memory device and accessible by a second digital player when the removable memory device is placed in communication with the second digital player. | 11-20-2008 |
| 20080288098 | Method for avoiding refreshing a database of metadata associated with digital media content - A method for avoiding refreshing a database of metadata associated with digital media content is disclosed. In one embodiment, a digital media player storing a database of metadata associated with digital media content determines whether a removable memory device was connected with the digital media player while the digital media player was powered down. The digital media player refreshes the database only if it is determined that the removable memory device was connected with the digital media player while the digital media player was powered down. In another embodiment, the digital media player determines whether the digital media content stored on the removable memory device changed since the database was last updated. The digital media player refreshes the database if it is determined that the digital media content stored on the removable memory device changed since the database was last updated. | 11-20-2008 |
| 20080288099 | Digital media player with improved user experience - A digital media player with improved user experience is disclosed. In one embodiment, a digital media player storing a database of metadata associated with digital media content determines whether a removable memory device was connected with the digital media player while the digital media player was powered down. The digital media player refreshes the database only if it is determined that the removable memory device was connected with the digital media player while the digital media player was powered down. In another embodiment, the digital media player determines whether the digital media content stored on the removable memory device changed since the database was last updated. The digital media player refreshes the database if it is determined that the digital media content stored on the removable memory device changed since the database was last updated. | 11-20-2008 |
| 20110268706 | PREPARATION METHOD OF POROUS HYALURONIC ACID SPONGE FOR CELL DELIVERY SYSTEM - Provided is a preparation method of a porous hyaluronic acid sponge comprising the steps of: dissolving hyaluronic acid in an aqueous sodium hydroxide solution; adding an epoxy-based crosslinking agent to the resultant aqueous sodium hydroxide solution in which hyaluronic acid is dissolved and homogenizing the hyaluronic acid solution; hydrogelating the homogenized hyaluronic acid solution; washing the hydrogelated hyaluronic acid hydrogel with ultrapure water; swelling the washed hyaluronic acid hydrogel to attain porosity; and freeze-drying the hyaluronic acid hydrogel to obtain a porous hyaluronic acid sponge. | 11-03-2011 |
| 20110289137 | Host Device and Method for Accessing a Virtual File in a Storage Device by Bypassing a Cache in the Host Device - A host device is provided comprising an interface configured to communicate with a storage device having a public memory area and a private memory area, wherein the public memory area stores a virtual file that is associated with content stored in the private memory area. The host device also comprises a cache, a host application, and a server. The server is configured to receive a request for the virtual file from the host application, send a request to the storage device for the virtual file, receive the content associated with the virtual file from the private memory area of the storage device, wherein the content is received by bypassing the cache, generate a response to the request from the host application, the response including the content, and send the response to the host application. In one embodiment, the server is a hypertext transfer protocol (HTTP) server. | 11-24-2011 |
| 20110289178 | Host Device and Method For Accessing a Virtual File in a Storage Device by Bypassing a Cache in the Host Device - A host device is provided comprising an interface configured to communicate with a storage device having a public memory area and a private memory area, wherein the public memory area stores a virtual file that is associated with content stored in the private memory area. The host device also comprises a cache, a host application, and a server. The server is configured to receive a request for the virtual file from the host application, send a request to the storage device for the virtual file, receive the content associated with the virtual file from the private memory area of the storage device, wherein the content is received by bypassing the cache, generate a response to the request from the host application, the response including the content, and send the response to the host application. In one embodiment, the server is a hypertext transfer protocol (HTTP) server. In another embodiment, the server can determine if a request is associated with a normal user permission or a super user permission, and send a response to the host application only if it is determined that the request is associated with the normal user permission. | 11-24-2011 |
