| Patent application number | Description | Published |
|---|
| 20090085199 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD LOCK SUBASSEMBLY - An integrated circuit package system includes: providing a substrate; attaching an integrated circuit over the substrate; attaching an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slot; and forming a package encapsulation over the integrated circuit subassembly system, the perforated interposer, the integrated circuit, and the substrate with the slot filled with the package encapsulation. | 04-02-2009 |
| 20090108428 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A CONDUCTOR-FREE RECESS - A mountable integrated circuit package system includes: providing a carrier; mounting a first integrated circuit device over the carrier; mounting a substrate over the first integrated circuit device with the substrate having a conductor-free recess; connecting a first electrical interconnect under the conductor-free recess electrically connecting the carrier and the first integrated circuit device; and forming a package encapsulation over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate. | 04-30-2009 |
| 20090127715 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSION - A mountable integrated circuit package system includes: mounting a first integrated circuit device over a carrier; mounting a second integrated circuit device over the first integrated circuit device includes: attaching the second integrated circuit device to a first substrate side of a substrate, and connecting a first electrical interconnect between the second integrated circuit device and a second substrate side of the substrate through an opening in the substrate. The mountable integrated circuit package system further including: forming a package encapsulation over the first integrated circuit device and the carrier with the substrate partially exposed. | 05-21-2009 |
| 20090166834 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER - A mountable integrated circuit package system includes: forming a base integrated circuit package system includes: providing a first substrate, and forming a package encapsulation having a cavity over the first substrate with the first substrate partially exposed within the cavity; and mounting an interposer including a central aperture over the package encapsulation and the first substrate with the central aperture over the cavity. | 07-02-2009 |
| 20090166835 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERPOSER - An integrated circuit package system including: providing a base substrate; coupling a base integrated circuit on the base substrate; forming a double side molded interposer unit over the base integrated circuit including: providing an interposer substrate having an interposer top and an interposer bottom, mounting a first integrated circuit to the interposer bottom and electrically connected thereto, mounting a second integrated circuit to the interposer top and electrically connected thereto, and molding a first chip cover on the first integrated circuit and a second chip cover on the second integrated circuit; and coupling an external component to the double side molded interposer unit. | 07-02-2009 |
| 20090236720 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STEP MOLD RECESS - An integrated circuit package system includes: providing a stackable integrated circuit package system having a base encapsulation and a recess therein; stacking a top integrated circuit package system, having a top encapsulation with a protruding portion, with the stackable integrated circuit package system with the protruding portion aligned and matched within the recess; and connecting the top integrated circuit package system and the stackable integrated circuit package system. | 09-24-2009 |
| 20100046183 | INTEGRATED CIRCUIT PACKAGE SYSTEM - An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer. | 02-25-2010 |
| 20100123233 | INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF PACKAGE STACKING - A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device. | 05-20-2010 |
| 20100301469 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure. | 12-02-2010 |
