Imazato, JP
Aritoshi Imazato, Saitama JP
Patent application number | Description | Published |
---|---|---|
20090078230 | CYLINDER HEAD OIL PASSAGE STRUCTURE - An oil communication passage ( | 03-26-2009 |
20110005500 | TIMING TRANSMISSION MECHANISM IN ENGINE - A timing transmission mechanism (T | 01-13-2011 |
Hideo Imazato, Matsuura-Shi JP
Patent application number | Description | Published |
---|---|---|
20090014122 | Heat Resistant Laminated Conveyor Belt and Manufacturing Method Thereof - Provided are a heat resistant laminated conveyor belt and manufacturing method thereof by which a belt surface pressure when a liner and corrugated core paper are pressed and bonded together can be increased to thereby enhance a bonding performance. The heat resistant laminated conveyor belt comprises a belt core layer | 01-15-2009 |
20120108133 | HEAT-RESISTANT LAMINATED CONVEYER BELT - A heat-resistant laminated conveyer belt includes a fluororesin-coated core and a reinforcement layer which is formed on the core through an adhesive layer. The core is obtained by impregnating an aramid fiber woven fabric in a fluororesin dispersion and drying and sintering the fabric. The reinforcement layer is obtained by impregnating an aramid fiber woven fabric to which stretch properties are applied in a fluororesin dispersion and drying and sintering the fabric. The aramid fiber woven fabric of the core is a woven fabric by a plain-weave seamless loom or a circular loom. The aramid fiber woven fabric of the core includes an S-twist weft yarn and a Z-twist weft yarn which are alternatively arranged. | 05-03-2012 |
20150217490 | HEAT-RESISTANT LAMINATED CONVEYER BELT - A heat-resistant laminated conveyer belt includes a fluororesin-coated core and a reinforcement layer which is formed on the core through an adhesive layer. The core is obtained by impregnating an aramid fiber woven fabric in a fluororesin dispersion and drying and sintering the fabric. The reinforcement layer is obtained by impregnating an aramid fiber woven fabric to which stretch properties are applied in a fluororesin dispersion and drying and sintering the fabric. The aramid fiber woven fabric of the core is a woven fabric by a plain-weave seamless loom or a circular loom. The aramid fiber woven fabric of the core includes an S-twist weft yarn and a Z-twist weft yarn which are alternatively arranged. | 08-06-2015 |
Hiromasa Imazato, Matsudo-Shi JP
Patent application number | Description | Published |
---|---|---|
20110158842 | PROCESS FOR MANUFACTURING COMPOSITE SINTERED MACHINE COMPONENTS - In a process for manufacturing composite sintered machine components, the composite sintered machine component has an approximately cylindrical inner member and an approximately disk-shaped outer member, the inner member has pillars arranged in a circumferential direction at equal intervals and a center shaft hole surrounded by the pillars, and the outer member has holes corresponding to the pillars of the inner member and a center shaft hole corresponding to the center shaft hole of the inner member and connected to the holes. The process comprises compacting the inner member and the outer member individually using an iron-based alloy powder or an iron-based mixed powder so as to obtain compacts of the inner member and the outer member, tightly fitting the pillars of the inner member into the holes of the outer member, and sintering the inner member and the outer member while maintaining the above condition so as to bond them together. A circumferential side surface facing a circumferential direction of the pillar of the inner member and a circumferential side surface facing a circumferential direction of the hole of the outer member are interference fitted at 0 to 0.03 mm of the interference. A radial side surface facing a radial direction of the pillar of the inner member and a radial side surface facing a radial direction of the hole of the outer member are fitted so as to be one of being interference fitted at not more than 0.01 mm of the interference and being through fitted. | 06-30-2011 |
Katsuhiro Imazato, Hyogo JP
Patent application number | Description | Published |
---|---|---|
20080229622 | Shoe Sole Component - There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at −10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan δ [−20° C. to 40° C.] at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan δ [−20° C.]/tan δ [40° C.] at a frequency of 10 Hz is 0.7 to 1.3. | 09-25-2008 |
Katsuhiro Imazato, Kobe-Shi JP
Patent application number | Description | Published |
---|---|---|
20100154253 | OUTER SOLE AND SHOES - The present invention provides an outer sole light in weight and excellent in abrasion resistance. | 06-24-2010 |
Katsuhiro Imazato, Kobe JP
Patent application number | Description | Published |
---|---|---|
20110265351 | SHOE SOLE COMPONENT - There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at −10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan δ (−20° C. to 40° C.) at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan δ (−20° C.)/tan δ (40° C.) at a frequency of 10 Hz is 0.7 to 1.3. | 11-03-2011 |
20120198722 | RUBBER MEMBER FOR LASER BONDING AND SHOE - A rubber member for laser bonding of the present invention containing a rubber ingredient and silica, wherein the silica has an average particle size of more than 50 nm and 120 nm or less, and the amount of the silica is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient, the rubber member has a laser light transmittance of 30% or more, provided that the laser light transmittance is a transmittance when the rubber member has a thickness of 2 mm and is irradiated with laser light having a wavelength of 808 nm. The silica preferably includes silica having an average particle size of more than 50 nm and 120 nm or less and silica having an average particle size of 5 nm to 50 nm, and the amount of the silica having an average particle size of more than 50 nm and 120 nm or less is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient and the amount of the silica having an average particle size of 5 nm to 50 nm is 10 parts by mass to 50 parts by mass based on 100 parts by mass of the rubber ingredient. | 08-09-2012 |
20120204446 | LAYERED PRODUCT FOR LASER BONDING, SHOE, AND PROCESS FOR PRODUCING SHOE - A laminate for laser bonding of the present invention contains a bonding sheet that is melted by irradiation of laser light and a first member laminated on one surface of the bonding sheet and formed of a thermoplastic foam. The difference between the melting point of the first member (Mfoam) and the melting point of the bonding sheet (Msheet) (Mfoam−Msheet) is −50° C. to 20° C. and the difference between the melt viscosity of the first member (Vfoam) and the melt viscosity of the bonding sheet (Vsheet) (Vfoam−Vsheet) is 3.0×10 | 08-16-2012 |
Kenta Imazato, Ehime JP
Patent application number | Description | Published |
---|---|---|
20160075823 | POLYCARBONATE MOLDED ARTICLE - A molded article such as a resin window or a lamp lens for vehicles which is formed from a polycarbonate and excellent in heat resistance, weather resistance, low water absorption, surface hardness and low-temperature impact properties. | 03-17-2016 |
Kenta Imazato, Tokyo JP
Patent application number | Description | Published |
---|---|---|
20140350208 | POLYCARBONATE RESIN - A polycarbonate resin which is excellent in heat resistance, boiling water resistance and surface hardness and has a low water absorption coefficient. | 11-27-2014 |
20150087804 | COPOLYCARBONATE - A copolycarbonate having a low water absorption coefficient and excellent heat resistance, low temperature characteristics and surface hardness. | 03-26-2015 |
Masaharu Imazato, Tokyo JP
Patent application number | Description | Published |
---|---|---|
20090279265 | ELECTRONIC DEVICE MOUNTING APPARATUS AND RESONANCE SUPPRESSION METHOD THEREOF - A heat sink plate is mounted on an electronic device for heat radiation of the electronic device. When the fundamental wave or a harmonic wave of the clock signal of the electronic device is coincide with the size of the heat sink plate, the heat sink plate resonates and large clock signal harmonic wave noise is radiated. For suppressing the noise, a dielectric strip is mounted on an edge portion of the heat sink plate. By this dielectric strip, the resonance frequency of the heat sink plate varies so that the resonance can be suppressed. | 11-12-2009 |
20100096174 | FILTER CIRCUIT ELEMENT AND ELECTRONIC CIRCUIT DEVICE - A plurality of vias is disposed side by side on a multilayer board. A first via which is one of the vias disposed at one outer portion is electrically connected to a first outgoing line provided on the multilayer board. A second via at the other outer portion is electrically connected to a second outgoing line provided on the multilayer board. A plurality of the vias is connected to a first fixed potential layer (a ground layer, for example) of the multilayer board. At least one second fixed potential layer is provided, with a plurality of the vias through a clearance and having the same potential as that of the first fixed potential layer, as an inner layer of the multilayer board between the first and second outgoing lines and the fixed potential layer. Therefore, a BPF whose rate of occupied area is low is formed on the multilayer board without additional production processes. | 04-22-2010 |
20120139657 | COMMUNICATION SYSTEM - A communication system of the present invention includes: a communication coupler that transmits a signal; and a signal transmitting apparatus that communicates by propagating, as an electromagnetic field, the signal transmitted from the communication coupler, the communication coupler includes a coupler case disposed on the signal transmitting apparatus, a noise suppressing section is provided on a lower end surface of the coupler case, the lower end surface faces the signal transmitting apparatus, and the noise suppressing section suppresses noise by creating a high impedance. | 06-07-2012 |
20120295666 | WIRELESS COMMUNICATION DEVICE, IMPEDANCE ADJUSTMENT METHOD, CASING POSITION DETECTION METHOD AND INFORMATION DISPLAY METHOD - A wireless communication device ( | 11-22-2012 |
20120299787 | RADIO COMMUNICATION APPARATUS - A radio communication apparatus ( | 11-29-2012 |
20120306705 | RADIO COMMUNICATION APPARATUS AND CURRENT REDUCING METHOD - A radio communication apparatus includes: a first casing; a second casing; a connection section that connects the first and second casings to each other to be movable; and an antenna device that operates at a predetermined communication frequency. In the radio communication apparatus, first and second states are switched between by relatively moving the first and second casings. The first state is a state in which the first and second casings are opened or closed with respect to one another, and a first conductor ( | 12-06-2012 |
20120319908 | ELECTRONIC APPARATUS - An electronic apparatus is provided which includes a first housing that is provided with a first electronic component ( | 12-20-2012 |
20130107491 | ELECTRONIC APPARATUS | 05-02-2013 |
Masaharu Imazato, Minato-Ku JP
Patent application number | Description | Published |
---|---|---|
20100061072 | MULTI-LAYER PRINTED CIRCUIT BOARD - Ground via provided in an end portion of a multi-layer printed circuit board so as to suppress a leakage of magnetic field from the end portion of the board causes a problem that a digital circuit of high density cannot be mounted on the board due to necessity of area for locating the ground via. Further, a case of using solder plating for the end portion of the board causes a problem that manufacturing process is added and that numbers of days and costs for manufacturing the multi-layer printed circuit board are increased. | 03-11-2010 |
20100091462 | ELECTRONIC DEVICE-MOUNTED APPARATUS AND NOISE SUPPRESSION METHOD FOR SAME - A noise electric current flowing through a heat sink is efficiently discharged to the ground of a printed circuit board to reduce levels of clock signal harmonic noises generated from the heat sink. An electronic device-installed apparatus is provided with a printed circuit board ( | 04-15-2010 |
Minoru Imazato, Kyoto JP
Patent application number | Description | Published |
---|---|---|
20130108978 | DENTAL TREATING APPARATUS WITH HAND PIECE | 05-02-2013 |
Toshiyuki Imazato, Nagasaki JP
Patent application number | Description | Published |
---|---|---|
20100307429 | WELDING STRUCTURE OF TUBE STUBS AND TUBE HEADER - In order to provide a welding structure of a tube header and tube stubs which successfully improves the durability thereof against creep and fatigue damage of the tube stubs without interposing a component of a different material between the tube header and the tube stubs, i.e. requiring additional components, a welding structure of the present invention comprises: a tube header ( | 12-09-2010 |