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Imazato, JP
Aritoshi Imazato, Saitama JP
| Patent application number | Description | Published |
|---|---|---|
| 20090078230 | CYLINDER HEAD OIL PASSAGE STRUCTURE - An oil communication passage ( | 03-26-2009 |
| 20110005500 | TIMING TRANSMISSION MECHANISM IN ENGINE - A timing transmission mechanism (T | 01-13-2011 |
Hideo Imazato, Matsuura-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090014122 | Heat Resistant Laminated Conveyor Belt and Manufacturing Method Thereof - Provided are a heat resistant laminated conveyor belt and manufacturing method thereof by which a belt surface pressure when a liner and corrugated core paper are pressed and bonded together can be increased to thereby enhance a bonding performance. The heat resistant laminated conveyor belt comprises a belt core layer | 01-15-2009 |
Hiromasa Imazato, Matsudo-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20110158842 | PROCESS FOR MANUFACTURING COMPOSITE SINTERED MACHINE COMPONENTS - In a process for manufacturing composite sintered machine components, the composite sintered machine component has an approximately cylindrical inner member and an approximately disk-shaped outer member, the inner member has pillars arranged in a circumferential direction at equal intervals and a center shaft hole surrounded by the pillars, and the outer member has holes corresponding to the pillars of the inner member and a center shaft hole corresponding to the center shaft hole of the inner member and connected to the holes. The process comprises compacting the inner member and the outer member individually using an iron-based alloy powder or an iron-based mixed powder so as to obtain compacts of the inner member and the outer member, tightly fitting the pillars of the inner member into the holes of the outer member, and sintering the inner member and the outer member while maintaining the above condition so as to bond them together. A circumferential side surface facing a circumferential direction of the pillar of the inner member and a circumferential side surface facing a circumferential direction of the hole of the outer member are interference fitted at 0 to 0.03 mm of the interference. A radial side surface facing a radial direction of the pillar of the inner member and a radial side surface facing a radial direction of the hole of the outer member are fitted so as to be one of being interference fitted at not more than 0.01 mm of the interference and being through fitted. | 06-30-2011 |
Katsuhiro Imazato, Kobe JP
| Patent application number | Description | Published |
|---|---|---|
| 20110265351 | SHOE SOLE COMPONENT - There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at −10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan δ (−20° C. to 40° C.) at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan δ (−20° C.)/tan δ (40° C.) at a frequency of 10 Hz is 0.7 to 1.3. | 11-03-2011 |
Katsuhiro Imazato, Kobe-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100154253 | OUTER SOLE AND SHOES - The present invention provides an outer sole light in weight and excellent in abrasion resistance. | 06-24-2010 |
Katsuhiro Imazato, Hyogo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080229622 | Shoe Sole Component - There is provided a shoe sole component that has properties such as strength and cushioning property that are suppressed from being changed even under a wide temperature range from severe cold at −10° C. or lower to high temperature conditions exceeding 30° C. A shoe sole component includes a cross-linked foam of a resin composition, the resin composition containing a thermoplastic polyolefin resin, in which tan δ [−20° C. to 40° C.] at a frequency of 10 Hz measured according to JIS K 7244-4 is 0.01 to 0.5, and tan δ [−20° C.]/tan δ [40° C.] at a frequency of 10 Hz is 0.7 to 1.3. | 09-25-2008 |
Masaharu Imazato, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090279265 | ELECTRONIC DEVICE MOUNTING APPARATUS AND RESONANCE SUPPRESSION METHOD THEREOF - A heat sink plate is mounted on an electronic device for heat radiation of the electronic device. When the fundamental wave or a harmonic wave of the clock signal of the electronic device is coincide with the size of the heat sink plate, the heat sink plate resonates and large clock signal harmonic wave noise is radiated. For suppressing the noise, a dielectric strip is mounted on an edge portion of the heat sink plate. By this dielectric strip, the resonance frequency of the heat sink plate varies so that the resonance can be suppressed. | 11-12-2009 |
| 20100096174 | FILTER CIRCUIT ELEMENT AND ELECTRONIC CIRCUIT DEVICE - A plurality of vias is disposed side by side on a multilayer board. A first via which is one of the vias disposed at one outer portion is electrically connected to a first outgoing line provided on the multilayer board. A second via at the other outer portion is electrically connected to a second outgoing line provided on the multilayer board. A plurality of the vias is connected to a first fixed potential layer (a ground layer, for example) of the multilayer board. At least one second fixed potential layer is provided, with a plurality of the vias through a clearance and having the same potential as that of the first fixed potential layer, as an inner layer of the multilayer board between the first and second outgoing lines and the fixed potential layer. Therefore, a BPF whose rate of occupied area is low is formed on the multilayer board without additional production processes. | 04-22-2010 |
Masaharu Imazato, Minato-Ku JP
| Patent application number | Description | Published |
|---|---|---|
| 20100061072 | MULTI-LAYER PRINTED CIRCUIT BOARD - Ground via provided in an end portion of a multi-layer printed circuit board so as to suppress a leakage of magnetic field from the end portion of the board causes a problem that a digital circuit of high density cannot be mounted on the board due to necessity of area for locating the ground via. Further, a case of using solder plating for the end portion of the board causes a problem that manufacturing process is added and that numbers of days and costs for manufacturing the multi-layer printed circuit board are increased. | 03-11-2010 |
| 20100091462 | ELECTRONIC DEVICE-MOUNTED APPARATUS AND NOISE SUPPRESSION METHOD FOR SAME - A noise electric current flowing through a heat sink is efficiently discharged to the ground of a printed circuit board to reduce levels of clock signal harmonic noises generated from the heat sink. An electronic device-installed apparatus is provided with a printed circuit board ( | 04-15-2010 |
Toshiyuki Imazato, Nagasaki JP
| Patent application number | Description | Published |
|---|---|---|
| 20100307429 | WELDING STRUCTURE OF TUBE STUBS AND TUBE HEADER - In order to provide a welding structure of a tube header and tube stubs which successfully improves the durability thereof against creep and fatigue damage of the tube stubs without interposing a component of a different material between the tube header and the tube stubs, i.e. requiring additional components, a welding structure of the present invention comprises: a tube header ( | 12-09-2010 |