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Imai, Hitachinaka

Eiji Imai, Hitachinaka JP

Patent application numberDescriptionPublished
20080239319INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.10-02-2008
20100195095FOREIGN MATTER INSPECTION METHOD AND FOREIGN MATTER INSPECTION APPARATUS - In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.08-05-2010
20100208251INSPECTION APPARATUS AND INSPECTION METHOD - An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage,a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.08-19-2010
20110109901FOREIGN MATTER INSPECTION APPARATUS - Selection with alignment marks of an optimal template, its identification and similarity judgment are conducted by a calculation function of a correlation value provided to a foreign matter inspection apparatus. In other words, the foreign matter inspection apparatus includes unit for registering feature points of alignment marks formed on a surface of an inspected object, unit for collecting image data of the alignment marks formed on the surface of the inspected object and a data processor for extracting a feature point from the image data and calculating a correlation value of both feature points, and registers the image data of the alignment mark on the basis of a threshold value of the correlation value.05-12-2011
20110267605FOREIGN MATTER INSPECTION METHOD AND FOREIGN MATTER INSPECTION APPARATUS - In a foreign matter inspection apparatus comprising: irradiating unit for irradiating inspection light to an inspection area of an article to be inspected; intensity detecting unit for detecting intensity of either reflected light or scattered light, which is generated from the inspection area by irradiating thereto the inspection light; position detecting unit for detecting a position of either the reflected light or the scattered light within the inspection area; and deciding unit for deciding whether or not a foreign matter is present within the inspection area; the foreign matter inspection apparatus is comprised of: display unit capable of displaying thereon both a threshold image in which the threshold value is indicated over an entire area of the inspection area, and a detection sensitivity image indicated by being converted from the threshold image.11-03-2011

Patent applications by Eiji Imai, Hitachinaka JP

Masato Imai, Hitachinaka JP

Patent application numberDescriptionPublished
20090088941Vehicle Speed Control System - A vehicle speed control system includes a road shape recognition unit which recognizes a road shape, a target speed setting unit which sets a target speed according to the road shape, a speed control unit which controls the host vehicle's speed according to the target speed, a parameter detecting unit which detects at least one of parameters representing the driver's steering rotation, a yaw rate of the host vehicle, and a lateral acceleration of the host vehicle, and a first acceleration determining unit which, after the speed control unit has decelerated, determines whether or not to accelerate the host vehicle according to reference parameters based on a road shape and the host vehicle's speed and parameters detected by the parameter detecting unit, wherein if the first acceleration determining unit has determined to accelerate, the target speed setting unit sets a target speed of the host vehicle according to a predetermined acceleration.04-02-2009
20100332127Lane Judgement Equipment and Navigation System - There is provided lane judgement equipment that is capable of quickly and accurately judging the lane that a vehicle is traveling in on a road with plural lanes in each direction. Lane judgement equipment 12-30-2010
20110169958Lane Determining Device and Navigation System - Provided is a lane determining device that is capable of quickly and accurately determining the lane traveled by a host vehicle traveling on a road with a plurality of lanes in each direction. A lane determining device that determines the lane traveled by the host vehicle traveling on a road with a plurality of lanes in each direction comprises: road geometry obtaining means that obtains road geometry; imaging means that images the road; division line recognition means that recognizes a division line from an image imaged by the imaging means; first path computation means that computes a path of the host vehicle by repeatedly computing a distance from the division line recognized by the division line recognition means to the imaging means; second path computation means that computes a path of the host vehicle based on the road geometry obtained by the road geometry obtaining means and on autonomous navigation; third path computation means that computes a path of the host vehicle based on a first path computed by the first path computation means and on a second path computed by the second path computation means; and traveled lane determination means that determines the lane traveled by the host vehicle based on a third path computed by the third path computation means.07-14-2011

Patent applications by Masato Imai, Hitachinaka JP