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Il-Woo
Il-Woo Ha, Daegu KR
| Patent application number | Description | Published |
|---|---|---|
| 20090026854 | CONNECTION STRUCTURE AND METHOD OF CONNECTING FIELD COIL AND LEAD WIRES IN VEHICLE ALTERNATOR - A connection structure and a connection method of connecting field coils and lead wires in a vehicle alternator. The connection structure includes a rotor assembly, a rear fan, and a rotor insulator. The rotor assembly includes a rotor shaft, a spool bobbin, and rotor segments. In the connection structure, a soldering or welding process is performed on twisted parts, which are formed by twisting field coils and lead wires around each other, the twisted parts are bent in the guide pockets of the rotor insulator, epoxy is applied to the outer surfaces of the twisted parts and the inner surfaces of guide pockets, and the rear fan is coupled to the front of the rotor insulator so that the inner surfaces of the protrusion hubs of the rear fan are in close contact with the guide pockets of the rotor insulator. | 01-29-2009 |
Il-Woo Jung, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20100133588 | SEMICONDUCTOR DEVICE HAVING DUMMY POWER LINE - A semiconductor device includes a plurality of circuit blocks respectively arranged both in a first direction and in a second direction that intersects the first direction. A plurality of signal lines extend in one direction of the first direction and the second direction to correspond to and extend over the circuit blocks arranged in the one direction among the plurality of circuit blocks, the signal lines being spaced apart in the other direction of the first direction and the second direction. A plurality of power lines are arranged over the circuit blocks, each power line extending along at least one of the signal lines in the one direction. A dummy power line is arranged between one of the power lines and a signal line adjacent to the one of the power lines in the other direction. | 06-03-2010 |
Il-Woo Kim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20080283494 | METHOD OF MANUFACTURING THERMAL INKJET PRINTHEAD - A method of manufacturing a thermal inkjet printhead. The method includes forming on a substrate a chamber layer having an ink chamber, forming a sacrificial layer on the chamber layer wherein the sacrificial layer fills the ink chamber, and planarizing a top surface of the sacrificial layer and of the chamber layer using a primary Chemical Mechanical Polishing (CMP) process until the sacrificial layer and the chamber layer attain a desired height, wherein a slurry is used in the primary CMP process that includes polishing particles having an average particle size of 500 nm˜2 μm. | 11-20-2008 |
| 20100028812 | METHOD OF MANUFACTURING INKJET PRINTHEAD - Disclosed is a method of manufacturing an inkjet printhead. The method includes: forming a chamber layer comprising a plurality of ink chambers on a substrate; forming a sacrificial layer comprising water soluble polymer on the chamber layer so as to fill the ink chambers; forming a nozzle layer comprising a plurality of nozzles on the sacrificial layer and the chamber layer; forming an ink feed hole for ink supply in the substrate; and removing the sacrificial layer. The sacrificial layer and the chamber layer may be planarized using a chemical mechanical polishing (CMP) process. The CMP process may utilize a hard polishing, in which an oil based slurry along with polishing pad of hard material to reduce the occurrences of dishing phenomenon. | 02-04-2010 |
Il-Woo Kim, Hwaseong-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110117721 | METHOD OF FORMING ISOLATION LAYER STRUCTURE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THE SAME - An isolation layer structure includes first to fourth oxide layer patterns. The first and third oxide layer patterns are sequentially formed in a first trench defined by a first recessed top surface of a substrate and sidewalls of gate structures on the substrate in a first region. The first trench has a first width, and the first and third oxide layer patterns have no void therein. The second and fourth oxide layer patterns are sequentially formed in a second trench defined by a second recessed top surface of the substrate and sidewalls of gate structures on the substrate in a second region. The second trench has a second width larger than the first width, and the fourth oxide layer pattern has a void therein. | 05-19-2011 |
Il-Woo Park, Yongin-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090073595 | METHOD AND APPARATUS FOR EDITING MASS MULTIMEDIA DATA - A method and apparatus for editing multimedia data stored in a disk. The method generates a Block Allocation Table (BAT) in the disk, wherein the BAT records a connection relationship between each of blocks based on a connection relationship between each of data stored in the respective blocks generated by dividing storage space of the disk having a predetermined size; and revises the connection relationship, which is between each of the blocks and is recorded in the BAT, when the connection relationship between each of the blocks is changed. | 03-19-2009 |
| 20110179146 | METHOD AND APPARATUS FOR REPRODUCING CONTENT IN MULTIMEDIA DATA PROVIDING SYSTEM - A content reproducing method is provided for continuously reproducing content being reproduced by a client device in another client device in a multimedia data providing system including a server for providing content and a plurality of client devices for reproducing the content provided by the server. The method includes reproducing, by a first device, multimedia content being streamed by a content server; and transmitting, by the first device, a first request message for continuously reproducing content being reproduced by the first device in another device and an IDentification (ID) of the first device to another device using local area communication in order to continuously reproduce the content being reproduced by the first device in another device. | 07-21-2011 |
Il-Woo Park, Suwon-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110248299 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention relates to a light emitting diode package and a method of fabricating the same capable of uniformly distributing a fluorescent substance in a molding member by including a light emitting diode chip on a package substrate and the molding member having a molding resin, a fluorescent substance and nano particles, which is arranged on the package substrate, with covering the light emitting diode chip. | 10-13-2011 |