| Patent application number | Description | Published |
|---|
| 20100006231 | ULTRASONIC BONDING APPARATUS - An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge. | 01-14-2010 |
| 20100006621 | ULTRASONIC BONDING APPARATUS - An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector. | 01-14-2010 |
| 20100024667 | PRESSURE-HEATING APPARATUS AND METHOD - A pressure-heating apparatus includes: a stage configured to place an object to be pressure-heated thereon; a pressure-heating head arranged to oppose to the stage; and a pressure drive mechanism configured to movably support the pressure-heating head relative to said stage. The pressure-heating head includes: a plurality of pressure-heating tools; a holder configured to independently accommodate each of the pressure-heating tools; a single heater block configured to contact with ends of the pressure-heating tools to transmit a heat; and a plurality of supporters configured to independently and movably support the pressure-heating tools relative to the holder, respectively. | 02-04-2010 |
| 20100038406 | ULTRASONIC BONDING APPARATUS - An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table. | 02-18-2010 |
| 20100122457 | APPLICATION METHOD AND APPARATUS FOR RESIN - An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed. | 05-20-2010 |
| 20100132187 | PART MOUNTING APPARATUS AND METHOD - A part mounting apparatus mounts a plurality of mounting parts to a board. The board is placed on a placement stage. A first part support part supports a first mounting part. A second part support part supports a second mounting part. A first camera image-recognizes the first mounting part supported by the first part support part from above, and image-recognizes a mounting surface of the board placed on the placement stage from above the first part support part. A second camera image-recognizes the second mounting part supported by the second part support part from underneath. | 06-03-2010 |
| 20100325884 | MOUNTING APPARATUS AND MOUNTING METHOD - A mounting apparatus includes a stage device on which an installation substrate and a component are placed, a suction head provided vertically above the stage device, the suction unit moving in a direction perpendicular to the stage device, a contact attached to the suction head that comes into contact with an electrode of the component, a camera provided vertically above the suction head, the camera moving in a direction perpendicular to the suction head, and a control unit that controls operation of the stage device, operation of the suction head, application of electricity to the contact, and operation of the camera. | 12-30-2010 |
