Patent application number | Description | Published |
20090255710 | Solar cell lead wire and production method therefor and solar cell using same - A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto. | 10-15-2009 |
20100018748 | Solar cell lead wire and method of manufacturing the same - A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling. | 01-28-2010 |
20100218981 | Solar cell lead, method of manufacturing the same, and solar cell using the same - A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness. | 09-02-2010 |
20110220196 | LEAD WIRE FOR SOLAR CELL, MANUFACTURING METHOD AND STORAGE METHOD THEREOF, AND SOLAR CELL - Disclosed is a lead wire for a solar cell having excellent bondability with a solar cell. The solar cell lead wire ( | 09-15-2011 |
Patent application number | Description | Published |
20090259006 | PROPYLENE POLYMER, METHOD FOR PRODUCTION OF THE PROPYLENE POLYMER, PROPYLENE POLYMER COMPOSITION, AND MOLDED ARTICLE MANUFACTURED FROM THE COMPOSITION - Disclosed is a production method of polypropylene having high MFR value and excellent product qualities with high productivity. The method enables to produce a propylene polymer by a gas phase process where the reaction heat is removed mainly by the heat of vaporization of liquefied propylene. The method is characterized by using a solid catalyst component (A) which is prepared by contacting components (A1), (A2) and (A3) shown below. Further disclosed are: a propylene polymer produced by the method; a propylene polymer composition; and a molded body of the composition. Component (A1): a solid component containing titanium, magnesium and a halogen as essential components. Component (A2): a vinyl silane compound. Component (A3): an organosilicon compound having an alkoxy group (A3a) and/or a compound having at least two ether bonds (A3b). | 10-15-2009 |
20100099811 | PROPYLENE-BASED POLYMER AND PRODUCTION METHOD THEREFOR, PROPYLENE-BASED POLYMER COMPOSITION AND MOLDED BODY MADE THEREOF - Disclosed is a production method of polypropylene having high MFR value and excellent product qualities with high productivity. The method enables to produce a propylene polymer by a gas phase process where the reaction heat is removed mainly by the heat of vaporization of liquefied propylene. The method is characterized by using a solid catalyst component (A) which is prepared by contacting components (A1), (A2) and (A3) shown below. Further disclosed are: a propylene polymer produced by the method; a propylene polymer composition; and a molded body of the composition. Component (A1): a solid component containing titanium, magnesium and a halogen as essential components. Component (A2): a vinyl silane compound. Component (A3): an organosilicon compound having an alkoxy group (A3 | 04-22-2010 |
20150322250 | PROPYLENE-ETHYLENE COPOLYMER RESIN COMPOSITION AND MOULDED ARTICLE, FILM AND SHEET THEREOF - A propylene-ethylene copolymer resin composition including: 97 to 65 parts by weight of a propylene polymer (A) produced with a metallocene catalyst and 3 to 35 parts by weight of a propylene-ethylene copolymer (B). The copolymer (B) includes: 65 to 95% by weight of a propylene polymer component (B1) and 5 to 35% by weight of a propylene-ethylene copolymer component (B2). | 11-12-2015 |
Patent application number | Description | Published |
20100122839 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer. | 05-20-2010 |
20100126758 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer. | 05-27-2010 |
20120080400 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer. | 04-05-2012 |
20120082779 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer. | 04-05-2012 |