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Iku
Iku Higashidani, Hitachi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090255710 | Solar cell lead wire and production method therefor and solar cell using same - A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto. | 10-15-2009 |
| 20100018748 | Solar cell lead wire and method of manufacturing the same - A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling. | 01-28-2010 |
| 20100218981 | Solar cell lead, method of manufacturing the same, and solar cell using the same - A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120° C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness. | 09-02-2010 |
Iku Kouzai, Mie JP
| Patent application number | Description | Published |
|---|---|---|
| 20090259006 | PROPYLENE POLYMER, METHOD FOR PRODUCTION OF THE PROPYLENE POLYMER, PROPYLENE POLYMER COMPOSITION, AND MOLDED ARTICLE MANUFACTURED FROM THE COMPOSITION - Disclosed is a production method of polypropylene having high MFR value and excellent product qualities with high productivity. The method enables to produce a propylene polymer by a gas phase process where the reaction heat is removed mainly by the heat of vaporization of liquefied propylene. The method is characterized by using a solid catalyst component (A) which is prepared by contacting components (A1), (A2) and (A3) shown below. Further disclosed are: a propylene polymer produced by the method; a propylene polymer composition; and a molded body of the composition. Component (A1): a solid component containing titanium, magnesium and a halogen as essential components. Component (A2): a vinyl silane compound. Component (A3): an organosilicon compound having an alkoxy group (A3a) and/or a compound having at least two ether bonds (A3b). | 10-15-2009 |
| 20100099811 | PROPYLENE-BASED POLYMER AND PRODUCTION METHOD THEREFOR, PROPYLENE-BASED POLYMER COMPOSITION AND MOLDED BODY MADE THEREOF - Disclosed is a production method of polypropylene having high MFR value and excellent product qualities with high productivity. The method enables to produce a propylene polymer by a gas phase process where the reaction heat is removed mainly by the heat of vaporization of liquefied propylene. The method is characterized by using a solid catalyst component (A) which is prepared by contacting components (A1), (A2) and (A3) shown below. Further disclosed are: a propylene polymer produced by the method; a propylene polymer composition; and a molded body of the composition. Component (A1): a solid component containing titanium, magnesium and a halogen as essential components. Component (A2): a vinyl silane compound. Component (A3): an organosilicon compound having an alkoxy group (A3 | 04-22-2010 |
Iku Kuo, Thaipao City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090038626 | Refractive vision correction for preventing presbyopia - The present invention relates to a refractive vision correction for preventing presbyopia; in particular, to the common refractive vision correction of dealing with myopia, hyperopia or astigmatism such as the problems of seeing for far distance objects, which is applied to and within a corresponding area of the center of the cornea when the pupil is in a size which is under normal light condition, and furthermore, other circular wavy corrections are orderly applied in accordance with different presbyopia degree to the scope beyond said corresponding area and overlapped by another corresponding area of the cornea when the pupil is in its most dilation; therefore, the present invention of pre-performing the circular wavy corrections can provide the patient with plural number of different curves of correction for preventing presbyopia when the patient get older with failing eyesight. The different curves of correction can appropriately improve and remedy the vision for the patient to see nearby objects when in different age with different presbyopia degree and achieve the expected goal of preventing presbyopia. | 02-12-2009 |
| 20090043292 | Method for Preventing and Correcting Presbyopia - A method for preventing and correcting presbyopia includes steps of forming a refractive correction surface for treating myopia, hyperopia or astigmatism to improve vision of distant objects in a central portion of the cornea of an eyeball corresponding in size and position to the pupil of the eyeball under a normal lighting condition; and successively forming lens-like refractive correction surfaces adaptive to presbyopia of different degrees in another portion of the cornea corresponding in size and position to the pupil dilating to the largest extent excluding an area occupied by the pupil under the normal lighting condition. Thus, when a person treated with the method grows older and experiences degenerate eye functions, the pre-formed lens-like refractive correction surfaces having different curvatures can correct presbyopia of different degrees at different ages and adequately improve vision of nearby objects, thereby achieving the intended effect of preventing presbyopia. | 02-12-2009 |
Iku Tokihisa, Ibi-Gun JP
| Patent application number | Description | Published |
|---|---|---|
| 20100122839 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a pad formed on the first interlayer resin insulation layer, a solder resist layer formed on the first interlayer resin insulation layer and the pad, a protective film formed on a portion of the pad exposed by an opening of the solder resist layer, and a coating layer formed between the pad and the solder resist layer. The pad mounts an electronic component. The coating layer has a metal layer and a coating film. The metal layer is formed on the surface of the pad and the coating film is formed on the metal layer. | 05-20-2010 |
| 20100126758 | MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board including a first interlayer resin insulation layer, a first conductive circuit formed on the first interlayer resin insulation layer, a second interlayer resin insulation layer formed on the first interlayer resin insulation layer and the first conductive circuit and having an opening portion exposing a portion of the first conductive circuit, a second conductive circuit formed on the second interlayer resin insulation layer, a via conductor formed in the opening portion of the second interlayer resin insulation layer and connecting the first conductive circuit and the second conductive circuit, and a coating layer having a metal layer and a coating film and formed between the first conductive circuit and the second interlayer resin insulation layer. The metal layer is formed on the surface of the first conductive circuit and the coating film is formed on the metal layer. | 05-27-2010 |