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Ihme

Andreas Ihme, Lengerich DE

Patent application numberDescriptionPublished
20100188671Weighted Sheet Inspection - An image processing system for use in a sheet-fed offset printing press inspects image data in a variable manner. and provides remediation in the event of a malfunction in order to reduce misprints, thus reducing waste and associated cost inefficiency.07-29-2010
20110035040METHOD AND A SYSTEM FOR THE EXTRAPOLATION OF DENSITOMETRIC MEASURED VALUES IN NOT MEASURED WAVELENGTH RANGES AT A PRINTING PRESS - The invention relates to a system and a method for controlling the composition of an ink mixture for at least one printing press, in which actual optical value of light are obtained, whereat the light has interacted at least with parts of the printing picture, which is generated by the printing press on the printing substrate using an ink mixture which is provided by an ink supply system and in which, due to the deviation of the actual optical value from optical reference values, a corrective ink mixture is created, which is added to the ink mixture which is provided by the ink supply system and which changes the ratio of the amounts of ink pigments therein, whereby first actual optical values are obtained inline, that is at running and just printed printing substrate, wherein these actual optical values are densitometrical values.02-10-2011
20110041712COLOUR-MANAGEMENT - The invention presents a method for controlling the composition of an ink mixture (02-24-2011
20110043556LANGUAGE AND METHOD FOR MEASURING THE VISCOSITY OF PRINTING INK DURING THE PRINTING AND INK CORRECTION PROCESS - A System and method for measuring the viscosity of printing ink during the printing and ink correction process is presented. A Printing press comprises at least one ink supply system, with which ink can be transferred from an inlet point to the printing substrate, at least one optical measuring device for measuring actual optical values of light, in which the actual optical values are from light of selected wavelength ranges and in which the light has interacted with at least parts of the printing picture, whereby the printing press further comprises an ink mass determination device for determining the weight of at least parts of the ink which is located within an ink supply system a control and evaluation device which can be provided with measured values from the optical measuring device and with measured values from the ink mass determination device and which can be used to determine the optical deviation, that is the deviation of the actual optical values from the optical reference values, which are available as light intensity values of selected wavelength ranges, and which control and evaluation device can be used to determine on the basis of the optical deviation and the values from the weighing devices, how much corrective ink having a determined composition is fed to the printing press in order to approximate the actual optical values to the optical reference values. 02-24-2011

David Ihme, Clemmons, NC US

Patent application numberDescriptionPublished
20090032968VIA CONFIGURABLE ARCHITECTURE FOR CUSTOMIZATION OF ANALOG CIRCUITRY IN A SEMICONDUCTOR DEVICE - A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.02-05-2009
20090061567VIA CONFIGURABLE ARCHITECTURE FOR CUSTOMIZATION OF ANALOG CIRCUITRY IN A SEMICONDUCTOR DEVICE - A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.03-05-2009

Patent applications by David Ihme, Clemmons, NC US

Sami Ihme, Oulu FI

Patent application numberDescriptionPublished
20090116208Electronic device electrical shielding - Disclosed herein is a shield for electrically shielding an electronic device. The shield includes a molded base and a first coating layer. The molded base includes a first portion and a second portion. The second portion comprises a resilient material connected to the first portion by being molded or extruded onto the first portion. The first coating layer is deposited on the second portion. The first coating layer includes an electrically conductive material.05-07-2009