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Igaue, JP

Futoshi Igaue, Itami-Shi JP

Patent application numberDescriptionPublished
20080298156SEMICONDUCTOR DEVICE UNDERGOING DEFECT DETECTION TEST - A semiconductor device has a first operation mode and a second operation mode in which power supply with a higher voltage value than that in the first operation mode is provided. The semiconductor device includes a memory portion having memory cells for storing data and a power supply circuit portion supplying a first voltage and a second voltage to the memory portion. The memory portion writes or reads data to or from the memory cells based on the first voltage and the second voltage, and the power supply circuit portion provides a smaller voltage difference between the first voltage and the second voltage in the second operation mode as compared with the voltage difference in the first operation mode.12-04-2008
20100109761SEMICONDUCTOR DEVICE INCLUDING INTERNAL VOLTAGE GENERATION CIRCUIT - A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.05-06-2010

Patent applications by Futoshi Igaue, Itami-Shi JP

Masahiko Igaue, Tokyo JP

Patent application numberDescriptionPublished
20110061903Multilayered printed wiring board and method for manufacturing the same - A multilayered printed wiring board includes a flexible wiring board with wiring layers on both main surfaces thereof; a rigid wiring board with wiring layers on both main surfaces thereof and formed opposite to the flexible wiring board under the condition that an area of the main surface of the rigid wiring board is smaller than an area of the main surface of the flexible wiring board; and an electric/electronic component embedded in the rigid wiring board.03-17-2011

Mitsutaka Igaue, Utsunomiya-Shi JP

Patent application numberDescriptionPublished
20100024558METHOD OF EVALUATION USING ULTRASONIC WAVES - The intensity of first reflected ultrasonic waves reflected from an end of a first electrode tip is measured while the electrode tip is separated from a workpiece. The intensity of second reflected waves reflected from the end of the electrode tip is measured while the electrode tip contacts with the workpiece. Based on the above intensities, an intensity ratio (reflectance) and the fraction of the waves entering the workpiece are determined from the following equations.02-04-2010

Mitsutaka Igaue, Tochigi JP

Patent application numberDescriptionPublished
20080307630Hemming Working Method and Working Apparatus - A moving die is held by a robot and made to approach a vehicle, and a positioning pin is inserted into a positioning hole of the vehicle. The moving die is brought into a floating state of being displaceable relative to the vehicle by reducing a force of the robot for maintaining an attitude thereof. In a state of holding the moving die by the robot, a surface of the moving die is brought into contact with the vehicle by an adsorbing mechanism including an adsorbing portion of an elastic member provided to the moving die. The moving die and the robot are cut to be separated.12-18-2008
20090031812Spot welding inspecting apparatus - A spot welding inspecting apparatus is provided with: a gun chip; a signal transmitting part; an ultrasonic sensor; an inner cylinder; a through hole; a partitioning cylinder; a first flow path; a second flow path; and a third flow path.02-05-2009

Mitsutaka Igaue, Tochigi-Ken JP

Patent application numberDescriptionPublished
20080203708Interior Material and Laser Beam Processing Method for the Same - A front face distance is obtained by measuring the position of a front face of an instrument panel held by an end effecter of a robot. An error on an optical axis, at the position of the front face is obtained based on the front face distance. Based on the error, the position of the instrument panel is adjusted so that a focal point of a laser meets the position at a predetermined depth defined with the front face as the standard. A back face of the instrument panel is irradiated with a laser to form a fine hole of a fragile section.08-28-2008

Takamitsu Igaue, Kagawa JP

Patent application numberDescriptionPublished
20100144909METHOD FOR PRODUCING FUNCTIONAL MATERIAL, FUNCTIONAL MATERIAL, SHEET-LIKE STRUCTURE AND SANITARY PRODUCT - Provided is a method for producing a functional material, including the steps of: bringing a polyvalent metal cation aqueous solution into contact with a base material; bringing a polyanion aqueous solution containing a functional component into contact with the base material previously in contact with the polyvalent metal cation aqueous solution to bond the polyvalent metal cations and the polyanions to each other, and thereby forming an insoluble compound containing the functional component; and drying the base material including the insoluble compound.06-10-2010