Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Idaka
Mamoru Idaka, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20090078687 | Laser Processing Apparatus, Processed Data Generating Method, and Computer Program - The present invention aims to rapidly and easily create processed data for scan controlling a laser light beam, and to create the processed data for the laser processing apparatus at high precision. A setting plane corresponding to a scanning region of a laser marker is displayed on a processed data generating device. A user operates the processed data generating device to arrange the processing pattern on the setting plane. Here, a marker head coincides an optical axis of the laser light beam L on a position corresponding to the reference point of the processing pattern, and photographs a work W with a camera which light receiving axis is coaxial with the optical axis of the laser light beam L. A photographed image monitor displays the photographed image along with a symbol indicating the position of the light receiving axis of the camera. | 03-26-2009 |
| 20120061360 | Method Of And System For Setting Laser Processing Conditions, Laser Processing System, Computer Program For Setting Laser Processing Conditions, Computer Readable Medium and Recording Device On Which Laser Processing Conditions Are Recorded - A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone. | 03-15-2012 |
| 20120062972 | Method Of And System For Setting Laser Processing Conditions, Laser Processing System, Computer Program For Setting Laser Processing Conditions, Computer Readable Medium and Recording Device On Which Laser Processing Conditions Are Recorded - A method of setting processing data for a computer-assisted laser processing apparatus is disclosed, along with a system for setting a laser processing data. The method comprises a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, a function of generating processing data representing the processing conditions for the object, and a function of visually displaying a two dimensional representation of the processing data on a display screen and a function of setting a three-dimensional profile of a object and a processing pattern as processing conditions, wherein it is enabled to set the three-dimensional profile and the processing pattern while displaying the object in two dimensions on the display screen disposed within a processing zone. | 03-15-2012 |
Toshiaki Idaka, Kanagawa-Ken JP
| Patent application number | Description | Published |
|---|---|---|
| 20090283874 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device manufacturing method in which a silicon nitride film is formed to cover an n-channel transistor formed on a semiconductor substrate and to apply a tensile stress in a channel length direction to a channel of the n-channel transistor, the method includes: forming a first-layer silicon nitride film above the n-channel transistor; irradiating the first-layer silicon nitride film with ultraviolet radiation; and after the ultraviolet irradiation, forming at least one silicon nitride film thinner than the first-layer silicon nitride film above the first-layer silicon nitride film. Silicon nitride films formed to apply the tensile stress is formed by respective steps. | 11-19-2009 |
| 20100320512 | Semiconductor device manufacturing method and semiconductor device - Disclosed is a semiconductor device manufacturing method in which a silicon nitride film is formed to cover an n-channel transistor formed on a semiconductor substrate and to apply a tensile stress in a channel length direction to a channel of the n-channel transistor, the method includes: forming a first-layer silicon nitride film above the n-channel transistor; irradiating the first-layer silicon nitride film with ultraviolet radiation; and after the ultraviolet irradiation, forming at least one silicon nitride film thinner than the first-layer silicon nitride film above the first-layer silicon nitride film. Silicon nitride films formed to apply the tensile stress is formed by respective steps. | 12-23-2010 |
Toshiaki Idaka, Kanagawa JP
| Patent application number | Description | Published |
|---|---|---|
| 20090203201 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes forming a dielectric film containing a porogen material above a substrate; removing a portion of the porogen material contained in the dielectric film so as to make a concentration of the porogen material higher in a part on a lower side of the dielectric film than in another part on a higher side of the dielectric film; forming an opening halfway in the dielectric film from which a portion of the porogen material has been removed to leave the dielectric film below a bottom of the opening; removing or polymerizing a remainder of the porogen material contained in the dielectric film; and etching the bottom of the opening after removing or polymerizing the remainder of the porogen material. | 08-13-2009 |
Yuujirou Idaka, Saitama-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20120105666 | IMAGING APPARATUS AND IMAGING METHOD - An imaging apparatus includes an image sensor, an AD conversion unit, a clamp processing unit, and a video signal correction unit. The clamp processing unit is configured to clamp to a black level, an image signal of an effective pixel region or an optical-black region of the image sensor after having been digitally converted by the AD conversion unit, by evaluating a difference from a signal of the optical-black region. The video signal correction unit is configured to calculate signal information of a part or whole of the optical-black region of an image signal of the image sensor; and, independently for each color of the video signal, to calculate correction amount of a video signal using the signal information, and to carry out correction by subtracting calculated correction amount from the image signal before clamping operation performed by the clamp processing unit. | 05-03-2012 |