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Ichitani, JP
Katsumi Ichitani, Chiba JP
| Patent application number | Description | Published |
|---|---|---|
| 20090028210 | METAL SURFACE TEMPERATURE MEASURING INSTRUMENT - A metal surface temperature measuring device includes: a container to contain a coolant; a measurement target; a heater to heat the measurement target; a moving mechanism for moving the measurement target; and a thermometer to measure the surface temperature of the measurement target. A main body of the measurement target is formed of silver or copper, and a surface of the main body is coated with a thin film of pure iron or an iron alloy at a thickness of 1 to 100 μm. Further, at least the container, the heater, and the measurement target are disposed in a chamber of an inert gas atmosphere. | 01-29-2009 |
| 20090056834 | HEAT TREATMENT OIL COMPOSITION - The heat-treating oil composition of the present invention is characterized by comprising a mixed base oil containing a low-boiling base oil having a 5% distillation temperature of from 300 to 400° C. in an amount of not less than 5% by mass but less than 50% by mass, and a high-boiling base oil having a 5% distillation temperature of 500° C. or higher in an amount of more than 50% by mass but not more than 95% by mass. There is provided a quenching oil composition capable of exhibiting a less fluctuation in hardness or quenching distortion of a metal material treated therewith even when a large number of the metal materials are quenched therewith at the same time. | 03-05-2009 |
| 20100186853 | HEAT-TREATMENT OIL COMPOSITION - To provide a heat treatment oil composition which is obtained by mixing a base oil, (A) a metallic detergent-dispersant and (B) an aliphatic carboxylic acid having from 6 to 30 carbon atoms, has high cooling capacity, and is excellent in cooling capability although the composition has a high flash point. | 07-29-2010 |
Kazuhiro Ichitani, Kodaira JP
| Patent application number | Description | Published |
|---|---|---|
| 20090091031 | Semiconductor device - A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon. | 04-09-2009 |
Koji Ichitani, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20080257462 | ALUMINUM ALLOY MATERIAL FOR HIGH-TEMPERATURE/HIGH-SPEED MOLDING, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING A MOLDED ARTICLE OF AN ALUMINUM ALLOY - An aluminum alloy material for high-temperature/high-speed molding containing 2.0 to 8.0 mass % of Mg, 0.05 to 1.0 mass % of Mn, 0.01 to 0.3 mass % of Zr, 0.06 to 0.4 mass % of Si and 0.06 to 0.4 mass % of Fe, with the balance being made of aluminum and inevitable impurities; an aluminum alloy material for high-temperature/high-speed molding containing 2.0 to 8.0% of Mg, 0.05 to 1.5% of Mn and 0.05 to 0.4% of Cr, Fe being restricted to 0.4% or less and Si being restricted to 0.4% or less, the grain diameter of a Cr-base intermetallic compound formed by melt-casting being 20 μm or less, and grains of intermetallic compounds with a grain diameter in the range from 50 to 1,000 nm as Mn-base and Cr-base precipitates being present in a distribution density of 350,000 grains/mm | 10-23-2008 |
Koji Ichitani, Chiyoda-Ku JP
| Patent application number | Description | Published |
|---|---|---|
| 20090148721 | ALUMINUM ALLOY SHEET FOR COLD PRESS FORMING, METHOD OF MANUFACTURING THE SAME, AND COLD PRESS FORMING METHOD FOR ALUMINUM ALLOY SHEET - An Al—Mg—Si based aluminum alloy sheet having undergone normal-temperature aging (or being in a underaged state) after a solution treatment thereof is, before press forming, subjected to a heating treatment (partial reversion heating treatment) in which the alloy sheet is partially heated to a temperature in the range of 150 to 350° C. for a time of not more than 5 minutes so that the difference in strength (difference in 0.2% proof stress) between the heated part and the non-heated part will be not less than 10 MPa. The alloy sheet thus treated is subjected to cold press forming in the condition where the heated part with low strength is put in contact with a wrinkle holding-down appliance of the press and the non-heated part with high strength is put in contact with the shoulder part (radius) of the punch. In the partial reversion heating treatment, the temperature rise rate and the cooling rate in cooling down to 100° C. or below are set to be not less than 30° C./min. Further, the period for which the alloy sheet is left to stand at normal temperature after the partial reversion heating treatment until the cold press forming is set to be within 30 days. | 06-11-2009 |
Masahiro Ichitani, Kodaira JP
| Patent application number | Description | Published |
|---|---|---|
| 20090091031 | Semiconductor device - A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon. | 04-09-2009 |
Motokuni Ichitani, Shiga JP
| Patent application number | Description | Published |
|---|---|---|
| 20100112480 | METHOD FOR PRODUCTION OF CROSSLINKED POLYVINYL ACETAL RESIN, AND CROSSLINKED POLYVINYL ACETAL RESIN - An object of the present invention is to provide a method for producing a cross-linked polyvinyl acetal resin, which can provide a cross-linked polyvinyl acetal resin having high mechanical strength and excellent solvent resistance by a simple method without a cross-linking agent, and can solve such problems as sheet attack, insufficient strength, and instability of viscosity for a long-time storage, and another object of the present invention is to provide a cross-linked polyvinyl acetal resin produced by the above method for producing a cross-linked polyvinyl acetal resin. The method for producing a cross-linked polyvinyl acetal resin comprises the step of irradiating a polyvinyl acetal resin at least having structural units represented by the following formulas (1) to (4) with ultraviolet light having a wavelength in a range of 200 to 365 nm, | 05-06-2010 |
| 20110049434 | POLYVINYL ACETAL RESIN COMPOSITION - It is an object of the present invention to provide a polyvinyl acetal resin composition capable of giving a ceramic green sheet which has sufficient flexibility and is hardly damaged even when being formed into a thin film, when the polyvinyl acetal resin composition is used as a binder for a ceramic green sheet. It is another object of the present invention to provide a ceramic slurry, a ceramic paste, a ceramic green sheet, a conductive paste and an interlayer film for laminated glass for automobiles, each produced by using the polyvinyl acetal resin composition. | 03-03-2011 |
Rumiko Ichitani, Kodaira JP
| Patent application number | Description | Published |
|---|---|---|
| 20090091031 | Semiconductor device - A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon. | 04-09-2009 |
Sachiyo Ichitani, Kodaira JP
| Patent application number | Description | Published |
|---|---|---|
| 20090091031 | Semiconductor device - A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon. | 04-09-2009 |
Shuji Ichitani, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20090116070 | IMAGE PROCESSING METHOD AND DEVICE - An image processing method for forming a color conversion table to convert plural input colors into output colors, the method including the steps of: extracting color values of plural gray scales wherein in input and output characteristic data, a signal value of one color is variable and signal values of other colors are fixed; creating a model with which difference values between input and output color values are outputted by inputting the extracted color values; and estimating the output color values corresponding to the input color values to create the color conversion table to convert plural input colors into output colors, after shifting the color values by adding or subtracting the difference values which are obtained by inputting the color values into the model with respect to every output color values. | 05-07-2009 |
| 20100249621 | BLOOD FLUIDITY MEASUREMENT APPARATUS AND BLOOD FLUIDITY MEASUREMENT METHOD - Deformability of blood cells is quantified in a short time. A blood fluidity measurement apparatus is provided with a TV camera which photographs a stream of blood in either two areas of the internal area, entrance area, and exit area of a gate, an image processing part which calculates the velocity of the blood cells contained in the blood from the image taken by the TV camera, and a deformability calculation means which calculates the deformability of the blood cells a blood fluidity from the velocity. | 09-30-2010 |
| 20100260391 | BLOOD FLUIDITY MEASUREMENT SYSTEM AND BLOOD FLUIDITY MEASUREMENT METHOD - Blood fluidity is measured in a short time. A blood fluidity measurement system, which measures blood fluidity by flowing blood into a channel, is equipped with a TV camera which photographs the blood stream in the channel and an image processing part which detects the state of the blood stream in the channel as blood fluidity from the image taken by the TV camera. | 10-14-2010 |
| 20110038524 | BLOOD AGGREGATION ABILITY MEASURING APPARATUS - To quantify the aggregation ability of various types of blood cells respectively within a short period of time. An apparatus for achieving the above-described object, which includes: a TV camera for taking an image of blood flow; an image processing section for identifying the types of blood cells contained in a blood cell retention part, in which blood cells are retained, from a blood flow image taken by the TV camera; and an aggregation ability calculation device for calculating at least one of the area, cell count and position of blood cells of each type as the aggregation ability of blood. | 02-17-2011 |