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Ichiryu, JP
Akira Ichiryu, Tokyo JP
| Patent application number | Description | Published |
|---|---|---|
| 20110013342 | METHOD FOR PRODUCING DIELECTRIC FILM AND METHOD FOR PRODUCING CAPACITOR LAYER-FORMING MATERIAL USING THE METHOD FOR PRODUCING DIELECTRIC FILM - An object of the present invention is to provide a method for producing a dielectric film excellent in the deposition stability in forming a high-density dielectric film by an electrophoresis method using a dielectric particle-dispersed slurry in which dielectric particles are dispersed. In order to achieve the object, a method for producing a dielectric film using an electrophoresis method comprising arranging a cathode electrode and an anode electrode in a dielectric particle-dispersed slurry in which the dielectric particles are dispersed and carrying out electrolysis to form a dielectric film on one of the electrodes, wherein the dielectric particles contained in the dielectric particle-dispersed slurry are the calcined dielectric particles. | 01-20-2011 |
Dai Ichiryu, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100046339 | OPTICAL DISC RECORDING/REPRODUCTION APPARATUS - The present invention solves the problems that, in a detection circuit which is mostly configured by analog circuits, the chip size cannot be reduced even using a highly-precise processing, there are many external capacitors and terminals thereof, a plurality of high-speed and large-scale AD converters are required for digitization, the detection precision of a small amplitude signal superimposed on an RF signal is deteriorated, and high-speed sample/hold is required. | 02-25-2010 |
| 20100195467 | OPTICAL DISC RECORDING/REPRODUCING APPARATUS - There is provided an optical disc recording/reproducing apparatus which can reduce the chip size using the high-miniaturization process and can enhance the detection accuracy. A signal which is obtained by amplitude-adjusting a header region in a reproduced signal detected by an optical pickup ( | 08-05-2010 |
Ken Ichiryu, Sagamihara-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090199610 | ACTUATOR, PARALLEL LINK MECHANISM USING THE SAME, AND LONG MATERIAL BENDING DEVICE - The dimensions of the fitting part of an actuator are to be dramatically reduced while enabling control items such as a driving motor and a position sensor of standard designs to be fitted around outside the actuator. To achieve this purpose, the actuator is provided with a trunnion type universal joint including: a fitting shaft, holding members and a rotary block having a nut arranged in it; a ball screw that is screwed into the nut of the universal joint and, being operationally linked to a driving power source, can move the nut back and forth; and a ball screw guide that is provided on the universal joint and guides the back-and-forth moving direction of the ball screw. | 08-13-2009 |
Miwa Ichiryu, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20110006439 | SEMICONDUCTOR DEVICE, BASIC CELL, AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A first wiring ( | 01-13-2011 |
Miwa Ichiryu, Hirakata-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20090138840 | CELL, STANDARD CELL, STANDARD CELL LIBRARY, A PLACEMENT METHOD USING STANDARD CELL, AND A SEMICONDUCTOR INTEGRATED CIRCUIT - A cell according to the present invention comprises a plurality of terminals capable of transmitting an input signal or an output signal and serving as a minimum unit in designing a semiconductor integrated circuit, wherein the plurality of terminals is located on routing grids lined in a Y direction which is a direction vertical to a power-supply wiring of the cell used in automatic placement & routing and has a shape extended in an X direction which is a direction in parallel with the power-supply wiring, more specifically such a shape that, for example, a longer-side dimension of the terminal is equal to “a routing grid interval in the X direction+a wiring width. According to the constitution, a cell area is reduced, which advantageously leads to the reduction of a chip area. | 05-28-2009 |
Takashi Ichiryu, Moriguchi-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20080210458 | Flexible substrate, multilayer flexible substrate and process for producing the same - A flexible substrate comprises: | 09-04-2008 |
Yoshikatsu Ichiryu, Osaka JP
| Patent application number | Description | Published |
|---|---|---|
| 20100267919 | PROCESS FOR PRODUCTION OF CYCLIC POLYORGANOSILOXANE, CURING AGENT, CURABLE COMPOSITION, AND CURED PRODUCT OF THE CURABLE COMPOSITION - An object of the invention is to provide a curing agent and a curable composition capable of forming a cured product, which is applicable for optical material and which has excellent heat and light transparency and crack resistance, and a cured product obtained by curing the same. Moreover, an object of the invention is to provide a method for producing with use of the components of the curing agent a cyclic polyorganosiloxane having a specific structure, in a selective manner and in high yield. In order to attain the objects, a curable composition including, as essential components, (A) an organic compound including at least two carbon-carbon double bonds that are reactive with a SiH group, (B) a compound having at least two SiH groups per molecule, and (C) a hydrosilylation catalyst, uses a modified polyorganosiloxane compound having at least two SiH groups per molecule as the compound having at least two SiH groups, which modified polyorganosiloxane compound is a reaction product of a specific cyclic polyorganosiloxane. | 10-21-2010 |
Yoshikatsu Ichiryu, Settsu-Shi JP
| Patent application number | Description | Published |
|---|---|---|
| 20100222525 | CURABLE COMPOSITION - Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds: | 09-02-2010 |