Patent application number | Description | Published |
20130206466 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a core substrate having a through-hole formed through the substrate, an interlayer insulation layer formed on the substrate and having a via conductor formed through the insulation layer, and a conductor layer formed on the insulation layer and connected to the via in the insulation layer. The substrate has multiplayer insulation structure, outer power layer formed on surface of the structure, outer ground layer formed on opposite surface of the structure, inner power layer formed inside the structure and inner ground layer formed inside the structure, each of the inner layers has tapered end having angle satisfying 2.808-15-2013 | |
20130213694 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board. | 08-22-2013 |
20130215586 | WIRING SUBSTRATE - A wiring substrate includes a motherboard including insulation layers, conductive layers and interlayer connection conductors, a packaging substrate mounted to the motherboard and having through-hole conductors, pads positioned to mount a semiconductor, uppermost via conductors connecting the through-hole conductors and the pads for the semiconductor, pads positioned to connect a motherboard and lowermost via conductors connecting the through-hole conductors and the pads for the motherboard, and bonding members interposed between the motherboard and packaging substrate and connecting the pads for the motherboard and an outermost conductive layer of the motherboard facing the packaging substrate. The pads for the motherboard, lowermost via conductors, through-hole conductors, uppermost via conductors, bonding members and interlayer connection conductors include a pad, a lowermost via conductor, a through-hole conductor, a bonding member and a stacked interlayer connection conductor structure which are positioned to align in a straight line. | 08-22-2013 |
20130219714 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate. | 08-29-2013 |
20130219890 | THERMAL COLLECTOR TUBE, THERMAL COLLECTOR AND CONCENTRATED SOLAR POWER GENERATION SYSTEM - A thermal collector tube includes a main body portion that houses a heat medium, and a coating layer provided on an outside surface of the main body portion. The coating layer has a radiation rate of 0.70 to 0.98 at room temperature and at a wavelength of 1 μm to 15 μm. The thermal collector tube is used in concentrated solar power generation in which solar light is collected using reflecting mirrors, the collected solar light is converted into heat using a thermal collector having the thermal collector tube, and power is generated using the heat. | 08-29-2013 |
20130220309 | THERMAL RECEIVER AND SOLAR THERMAL POWER GENERATION DEVICE - A thermal receiver includes a heat absorption body and a support body. The heat absorption body is made of at least one honeycomb unit having a plurality of flow paths arranged for circulation of a heat medium. The support body supports the heat absorption body and allows circulation of the heat medium. The heat absorption body includes silicon carbide and is supported at a position away from an inner surface of the support body by a predetermined distance. | 08-29-2013 |
20130221518 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first buildup layer laminated on a first surface of the core substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on a second surface of the core substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost conductive layer of the first buildup layer includes pads positioned to mount a semiconductor device on a surface of the first buildup layer, and the outermost interlayer resin insulation layer of the first buildup layer has a thermal expansion coefficient which is set lower than a thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer. | 08-29-2013 |
20130223033 | PRINTED WIRING BOARD, INDUCTOR COMPONENT, AND METHOD FOR MANUFACTURING INDUCTOR COMPONENT - A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole. | 08-29-2013 |