I-Jen
I-Jen Chen, Taipei City TW
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20160112995 | METHOD AND APPARATUS FOR ENHANCING CHANNEL CAPACITY AND SPECTRAL EFFICIENCY IN A WIRELESS COMMUNICATION SYSTEM - A method and apparatus of a UE are disclosed. In one embodiment, the method includes the UE receiving a superposed signal from a BS. The method also includes the UE receiving a signaling from the BS and getting information from the signaling about a first standard modulation scheme for demodulation and a specific indication of how to retrieve at least one transport block from the demodulation output. In addition, the method includes the UE demodulating the superposed signal received from the BS according to the first standard modulation scheme, retrieving at least one transport block from the demodulation output according to the specific indication, and ignoring other portion(s) of the demodulation output. | 04-21-2016 |
I-Jen Hsu, Tao-Yuan TW
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20090033916 | System and Method for Measuring Interferences - A system and method for measuring interferences are disclosed. The system is based on the concept of a composite interferometer. The sample is measured while a simultaneous compensation of the phase deviation due to the relative displacement of the optical delay component between the measurements at different pixels of the sample is performed. In the application of profilometry, the information of the surface profile of a material is obtained from the phase shift of the interference signal. By using the proposed compensation mechanism, an axial resolution at nanometer scale can be achieved. For the measurement of a thin film, a polarized probe beam is oblique incident on the sample. The system can perform a simultaneous measurement of the refractive index and the thickness of the thin film. From the ratio of the intensities of the interferograms of TE and TM waves as well as the phase shifts of the interferograms, the refractive index and the thickness of the thin film can then be obtained simultaneously. | 02-05-2009 |
I-Jen Hsu, Chung Li TW
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20110181890 | IMAGING AND MEASURING APPARATUS FOR SURFACE AND INTERNAL INTERFACE OF OBJECT - The present invention provides an imaging and measuring apparatus for the surface and the internal interface of an object, which comprises a broadband wave source, a wave-splitting structure, a wave-delaying device, a reflecting component, and a sensor. The broadband wave source transmits a broadband incident wave. The wave-splitting structure splits the broadband incident wave into a first incident beam, a second incident beam, and a third incident beam. The first incident beam is illuminated on an object under test, which reflects a measuring beam. The wave-delaying device receives the second incident beam and reflects a reference beam. The reflecting component receives the third incident beam and reflects a calibration beam. The sensor receives a first interference signal of the measuring beam and the reference beam, and a second interference signal of the reference beam and the calibration beam. By means of the broadband incident wave, the morphologies of the surface and the internal interface of the object can be imaged and measured in a non-destructive way. In addition, by means of the calibration beam, the accuracy of imaging and measuring the surface and the internal interface of the object can be improved. | 07-28-2011 |
I-Jen Hsu, Taoyuan County TW
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20130010304 | OPTICAL TOMOGRAPHY SYSTEM - An optical tomography system is provided. The optical tomography system includes a light source emitting a light beam. A beamsplitter splits the light beam into a first reference light beam and a first sample light beam. The first reference light beam is incident to an optical delay device, and the first sample light beam is incident to a focusing device, focused to a sample. A second reference light beam reflected from the optical delay device and a second sample light beam reflected from the sample are incident through the beamsplitter to a detection device. Different portions of the second reference light beam along a first dimension have different optical path lengths. | 01-10-2013 |