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I-Ching
I-Ching Chen, Huwei Township TW
| Patent application number | Description | Published |
|---|---|---|
| 20110261348 | Optical Calibration and Testing Device for Machine Tools - An optical calibration and testing device for machine tools includes a light source unit, a beam splitter, and at least one photo detector. The light source emits a laser light hitting the beam splitter and is split into two beams. One is perpendicular to the foundation of the light source unit, and the other is parallel with the foundation so as to test straightness, inclination angle, verticalness, vertical column inclination, vertical column parallelism and guide bar inclination of a machine tool. If there is no tested error, the position of the testing light spot coincides with that of the initial light spot. If there is an error, the position of testing light spot varies according to the error. | 10-27-2011 |
I-Ching Chou, Tainan Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080197260 | COMPUTER HOUSING - A computer housing includes: a housing body; a first supporting plate mounted in the housing body; a second supporting plate mounted in the housing body and cooperating with the first supporting plate to define a mounting space therebetween; and an operating lever pivoted to the second supporting plate, formed with an engaging tongue, and rotatable relative to the second supporting plate between a first angular position, in which the engaging tongue extends into the mounting space for retaining a box-like device in the mounting space, and a second angular position, in which the engaging tongue is disposed outside of the mounting space for permitting removal of the box-like device. | 08-21-2008 |
I-Ching Lin, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20080299769 | SEMICONDUCTOR FABRICATION METHOD SUITABLE FOR MEMS - A method includes depositing a layer of a sacrificial material in a first region above a substrate. The first region of the substrate is separate from a second region of the substrate, where a corrosion resistant film is to be provided above the second region. The corrosion resistant film is deposited, so that a first portion of the corrosion resistant film is above the sacrificial material in the first region, and a second portion of the corrosion resistant film is above the second region. The first portion of the corrosion resistant film is removed by chemical mechanical polishing. The sacrificial material is removed from the first region using an etching process that selectively etches the sacrificial material, but not the corrosion resistant film. | 12-04-2008 |
| 20110244676 | CHEMICAL MECHANICAL POLISHING (CMP) PROCESSING OF THROUGH-SILICON VIA (TSV) AND CONTACT PLUG SIMULTANEOUSLY - A method includes forming conductive material in a contact hole and a TSV opening, and then performing one step to remove portions of the conductive material outside the contact hole and the TSV opening to leave the conductive material in the contact hole and the TSV opening, thereby forming a contact plug and a TSV structure, respectively. In some embodiments, the removing step is performed by a CMP process. | 10-06-2011 |
I-Ching Wei, Tao-Yuan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090262053 | RESISTIVE MODULE, VOLTAGE DIVIDER AND RELATED LAYOUT METHODS - The present invention includes a resistive module, the resistive module including a plurality of nodes and at least a resistive component. The plurality of nodes include an input terminal and an output terminal of the resistive module; the resistive component is electronically connected between the input terminal and the output terminal of the resistive module to thereby make the input terminal and the output terminal have a specified resistive value therebetween. In addition, the resistive component is electrically connected between two nodes of a node pair among the nodes, and each resistive component has a corresponding predetermined resistive value. | 10-22-2009 |
I-Ching Wu, Solana Beach, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100076560 | Interspinous Stabilization Device - An interspinous stabilization device includes: (1) a supporting member with a top surface and a bottom surface both being configured to engage spinous processes; (2) two side members connected to the supporting member; (3) a fastener attached to the side members; and optionally (4) two extendable arms each secured on one of the side members. | 03-25-2010 |