Patent application number | Description | Published |
20090230418 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - There is provided a light emitting diode package and a method of manufacturing the same in which a light emitting diode chip is separated from phosphors, and a phosphor area is variable in shape to improve thermal balance and luminous efficiency. A light emitting diode package according to an aspect of the invention may include: a package body; at least one LED chip mounted in an area of the package body and emitting excitation light; and a lens unit separated from the LED chip by a distance and mounted on an upper surface of the package body, wherein the lens unit may include a phosphor area located at one side of a lower part thereof, absorbing the excitation light of the LED chip, and generating wavelength-converted light. According to the invention, since the lens unit corresponding to the LED chip is separated from the LED chip by the predetermined distance, there can be provided the light emitting diode package having improved luminous efficiency and reliability that the phosphors are not thermally deformed by heat generated from the LED chip. | 09-17-2009 |
20090283785 | LIGHT EMITTING DIODE PACKAGE - There is provided a light emitting diode (LED) package in which a phosphor layer encapsulating an LED chip is formed uniformly to facilitate a process. The LED package includes: a package body having a mounting area; a holding part mounted on the mounting area to expose a portion of the mounting area; an LED chip mounted on the mounting area, the LED chip surrounded by the holding part to emit light; and a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip. | 11-19-2009 |
20090322248 | LED DRIVING CIRCUIT AND LIGHT EMITTING DIODE ARRAY DEVICE - There is provided an LED driving circuit. The LED driving circuit according to an aspect of the invention may include: at least one ladder circuit including: (n−1) number (here, n is a positive integer satisfying n≧2) of first branches provided between first and second junction points, and connected in-line with each other by n number of first middle junction points, (n−1) number of second branches arranged in parallel with the first branches, and connected in-line with each other by n number of second middle junction points between the first and second junction points, and n number of middle branches connecting m-th first and second middle junction points to each other, wherein at least one LED device is disposed on each of the first, second, and middle branches. Here, the number of LED devices included in each of the first and second branches is greater than the number of LED devices included in each of the middle branches. | 12-31-2009 |
20100127300 | CERAMIC PACKAGE FOR HEADLAMP AND HEADLAMP MODUL HAVING THE SAME - Provided is a ceramic package for headlamp, and a headlamp module having the same. The ceramic package for headlamp includes a body part, a pair of internal electrodes, and an electrode exposing part. The body part has a cavity formed therein. The cavity is upwardly opened to expose a light emitting diode mounted on a mounting part. The pair of internal electrodes in the body part is electrically connected to the light emitting diode. The electrode exposing part is stepped at either side of the body part to upwardly expose the internal electrode to the outside. | 05-27-2010 |
20100128461 | LIGHT EMITTING DIODE PACKAGE - Provided is a light emitting diode (LED) package. The LED package includes a package main body, first and second electrode structures, first and second LED chips, and first and second resin packing parts. The package main body includes a concave portion and a barrier wall dividing the concave portion into at least first and second accommodation recesses. The first and second electrode structures are formed at the package main body and are exposed at bottom surfaces of the first and second accommodation recesses respectively. The first and second LED chips are electrically connected to the first and second electrode structures are respectively mounted on the bottom surfaces of the first and second accommodation recesses. The first and second resin packing parts include at least one fluorescent material and are formed in the first and second accommodation recesses for packing the first and second LED chips. | 05-27-2010 |
20100148201 | LED PACKAGE - There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section. | 06-17-2010 |
20110127912 | LED PACKAGE, LED PACKAGE MODULE HAVING THE SAME AND MANUFACTURING METHOD THEREOF, AND HEAD LAMP MODULE HAVING THE SAME AND CONTROL METHOD THEREOF - Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad. | 06-02-2011 |
20120007120 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate. | 01-12-2012 |
20120043896 | AC DRIVEN LIGHT EMITTING DEVICE - There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency. | 02-23-2012 |
20120153849 | AC DRIVEN LIGHT EMITTING DEVICE - Provided is an alternating current (AC) driven light emitting device, including: a plurality of half-wave driving units respectively having at least one light emitting diode (LED) and provided in a loop connecting respective half-wave driving unit terminals; and at least one full-wave driving unit having at least one LED and connecting one node between two of the plurality of half-wave driving units to another node between another two of the plurality of half-wave driving units, at least one of the half-wave driving unit and the full-wave driving unit having a parallel connection structure of at least two LEDs. An array of LEDs appropriate to being drivable by AC is provided to secure reliability in error in operation of some LEDs. | 06-21-2012 |
20120211780 | LED PACKAGE MODULE - An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion. | 08-23-2012 |
20120305970 | LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF - There is provided a light emitting device package including a substrate having a cavity therein; alight emitting device mounted on a bottom surface of the cavity; a first wavelength conversion part including a first phosphor for a wavelength conversion of light emitted from the light emitting device and covering the light emitting device within the cavity; and a second wavelength conversion part including a second phosphor allowing for emission of light having a wavelength different to that of the first phosphor and formed as a sheet on the first wavelength conversion part. | 12-06-2012 |
20130320293 | SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor light emitting device package includes a base unit including a main body having electrical insulation properties and at least one pair of first and second through electrodes formed in the main body in a thickness direction thereof and formed of a semiconductor material, and a light emitting structure disposed on the base unit and including first and second conductivity type semiconductor layers and an active layer interposed there between. The manufacturing process thereof may be simplified, whereby a reduction in manufacturing costs and time may be achieved. | 12-05-2013 |
20150060925 | LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate. | 03-05-2015 |