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Hyun Seop
Hyun Seop Bae, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20080270855 | Method For Detecting Memory Error - A method for easily detecting a memory error that may occur when a memory is accessed or an allocated memory is freed in the process of developing software is disclosed. The memory error detecting method includes: (a) generating an original block indication variable for indicating a starting memory block of a memory region allocated with respect to a variable included in a computer program; (b) detecting a memory error that may occur when the allocated memory region is accessed, by performing a certain operation (computing or arithmetic operation), before the allocated memory region is accessed, using a target block indication variable indicating memory block to be accessed in the allocated memory region and/or the original block indication variable; and (c) outputting information about a detected memory error. | 10-30-2008 |
Hyun Seop Kim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20100133414 | MOBILE TERMINAL HAVING SUPPORTING MEMBER - A mobile terminal having a supporting member is provided. The mobile terminal includes a main body having a first hinge portion, a first part mounted in the main body, and the supporting member having a second hinge portion connected to the first hinge portion. The supporting member is inserted into the main body and coupled to the main body by rotating about the first hinge portion. By integrally forming the main body of the mobile terminal and the supporting member, a manufacturing cost of the mobile terminal can be reduced and inadvertent loss of the supporting member by a user can be prevented. Further, when the supporting member is stored in a folded position in the main body of the mobile terminal, the supporting member can be used for aesthetic purposes and can provide an enhanced external appearance. | 06-03-2010 |
| 20100184492 | MOBILE PHONE HAVING POP-UP KEYPAD - A slide mobile phone is provided. The slide mobile phone may include a first main body, a second main body connected to perform a sliding movement while contacting with the first main body, a rail formed along an inner side surface of the first main body, a keypad installed at the first main body and having a projection received in the rail in a side surface, and spring members installed within the first main body for supporting the keypad. The keypad can vertically move by extension and compression of the plurality of spring members when the second main body is moved according to an opening and/or closing movement. | 07-22-2010 |
Hyun Seop Shim, Incheon KR
| Patent application number | Description | Published |
|---|---|---|
| 20110042466 | RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD OF MANUFACTURING THE SAME - There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad. | 02-24-2011 |
| 20110043363 | RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD AND MOLD FOR MANUFACTURING THE SAME - A radio frequency identification (RFID) tag includes a circuit chip including a pad for an electrical connection on one surface thereof, a molding part receiving the circuit chip therein while exposing the pad to the outside, and an antenna formed on an outer surface of the molding part, having a predetermined pattern shape and electrically connected to the pad. | 02-24-2011 |
| 20110061904 | Display array substrate and method of manufacturing display substrate - A display array substrate according to an aspect of the invention may include: a substrate wafer having cutting grooves curved inward; and a transparent electrode coated over one surface of the substrate wafer, wherein shock, occurring when cutting the substrate wafer, is prevented from being transmitted to the transparent electrode by cutting the substrate wafer along the cutting grooves having a different height from the transparent electrode. | 03-17-2011 |