| Patent application number | Description | Published |
|---|
| 20100021108 | OPTICAL WAVEGUIDE DEVICE AND OPTICAL COMMUNICATION MODULE - An optical waveguide device and an optical communication module are provided. In the optical waveguide device which includes a core and a cladding layer formed around the core and has one end formed to be inclined so as to refract input and output signals, the core includes therein a diffraction portion for diffracting an optical signal incident through the cladding layer to propagate straight through the core. Thus, it is possible to prevent deterioration of an optical signal coupling ratio in implementing a technique of transmitting optical signals in opposite directions. | 01-28-2010 |
| 20100047967 | METHOD OF MANUFACTURING STACKED SEMICONDUCTOR PACKAGE USING IMPROVED TECHNIQUE OF FORMING THROUGH VIA - A method of manufacturing a stacked semiconductor package using an improved technique of forming a through via in order to enable 3-dimensional vertical interconnection of stacked packages is provided. The method includes forming a seed layer required for forming a via core on a bottom surface of a wafer, forming at least one via hole vertically through the wafer, forming a via core in the via hole, insulating the via hole from the via core, and removing the seed layer from the bottom surface of the wafer. The stacked semiconductor package is suitable for high-speed signal transmission. | 02-25-2010 |
| 20100136783 | METHOD OF MANUFACTURING THROUGH-VIA - Disclosed is a method of manufacturing a through-via. The through-via manufacturing method includes forming a core-via hole in a wafer, forming a suction-via hole adjacent to the core-via hole in the wafer, forming a via core in the core-via hole, forming a polymer-via hole connected to the suction-via hole in the wafer, filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole, and polishing the wafer such that the via core formed in the core-via hole is exposed. | 06-03-2010 |
| 20110002692 | OPTICAL WAVEGUIDE AND BI-DIRECTIONAL OPTICAL TRANSCEIVER - An optical waveguide and a bi-directional transceiver are provided. A single mode optical fiber has one end coupled to one end of a hollow optical fiber and an opposite end having a slope plane, thereby separating optical signals travelling in opposite directions from each other. Manual alignment for an optical system is easily realized without the need for additional optical elements, so that the light transmission/reception performance of the optical waveguide is improved and the structure of the optical waveguide is smaller. | 01-06-2011 |
| 20110044696 | OPTICAL COMMUNICATION MODULE - An optical communication module which uses a single optical fiber to enable bidirectional communication or multiplexing communication is provided. The optical communication module includes a platform configured to have a through-hole therein which vertically passes through the platform; an optical receiver configured to be provided on the platform and include a light-receiving element; an optical transmitter configured to be provided on the platform and include a light-emitting element; and an optical filter configured to be provided on one surface of the platform to correspond to the through-hole, transmit light from the light-emitting element to an optical line, and transmit light input through the optical line to the light-receiving element, where one of the light-receiving element and the light-emitting element is provided on one surface of the platform on an opposite side of the optical line with the optical filter interposed therebetween, and the other is provided on the other surface of the platform to correspond to the through-hole. Accordingly, it is possible to reduce the manufacturing cost, minimize the optical or electrical crosstalk, and maximize the optical coupling efficiency. | 02-24-2011 |
| 20110050499 | SENSING DEVICE HAVING MULTI BEAM ANTENNA ARRAY - Provided is a sensing device having a multi beam antenna array. The sensing device includes an antenna array including a plurality of antennas, a plurality of low noise amplifiers respectively connected to the antennas to amplify radio frequency signals received from the respective antennas, a delay line box including a plurality of delay lines, each delay line delaying the signals amplified by the low noise amplifiers for a predetermined time, and a detector detecting the output signals of the delay ling box. | 03-03-2011 |
| 20110052125 | BIDIRECTIONAL OPTICAL TRANSCEIVER MODULE - A bidirectional optical transceiver module with a temperature control function is provided. The bidirectional optical transceiver module includes a package configured to have a flat bottom surface and include two windows used for optical transmission and reception; a ferrule configured to be coupled to one side of the package and allow an optical fiber to be inserted therein; an optical receiver module configured to be coupled to another side of the package in a direction perpendicular to that of the ferrule coupled to the package; a sub-optical transmitter module configured to be built in the package and include a light-emitting element and a collimating lens used to collimate light from the light-emitting element; an optical filter configured to be built in the package, transmit light from the light-emitting element to the optical fiber and reflect light received through the optical fiber to the optical receiver module; and a temperature regulator configured to be built in the package and control the sub-optical transmitter module to a preset temperature. Accordingly, it is possible to reduce the manufacturing cost of the package, effectively discharge heat, and be more endurable to external impact or vibration. | 03-03-2011 |
