| Patent application number | Description | Published |
|---|
| 20080311312 | Method for surface treatment of substrate and method for forming fine wiring - The present invention related to a method for surface treatment and a method for forming fine wiring and more particularly, to a method for surface treatment of a substrate, including: preparing a substrate on which a fine wiring is to be formed; and treating the surface of the substrate with a fluorine containing liquid having a low boiling point, and a method for forming fine wiring using the same method. According to the present invention, not only the spreading of ink droplets but also the deterioration of the interface adhesion is avoided. | 12-18-2008 |
| 20090027828 | Supercapacitor and manufacturing method thereof - A supercapacitor and a manufacturing method thereof are disclosed. With manufacturing method of Supercapacitor including: arranging a plurality of filters to be spaced at a designated interval apart, forming a first plating layer connecting one end of the filter, forming a second plating layer lengthened along the filter from the first plating layer, polymerizing to form a conductive polymer layer between the second plating layer, and removing the filter, capacitance (C), power (kw) and energy (E) can be increased as the space for absorbing electrons is widened, by making the surface area of an electrode wider than the a general film. | 01-29-2009 |
| 20090136874 | Method for manufacturing printed circuit board - A method of manufacturing a printed circuit board is disclosed. The method, which includes forming a base pattern over one side of a negative photoresist, exposing the one side, attaching an insulation layer on the one side, developing the negative photoresist such that the base pattern is uncovered, and forming a circuit pattern over the base pattern, can increase the thickness of the circuit pattern and strengthen the adhesion between the circuit pattern and the insulation layer. | 05-28-2009 |
| 20090286004 | METHOD OF FORMING PRINTED CIRCUIT PATTERN, FORMING GUIDE FOR PATTERN, AND GUIDE-FORMING INK - Disclosed are methods of forming a printed circuit pattern and forming a guide, and a guide-forming ink. The method of forming a printed circuit pattern in accordance with the present invention includes forming a guide by using guide-forming ink having a slip property, curing the formed guide by in-situ UV, and forming a printed circuit pattern on the inside of the cured guide by using metal ink. | 11-19-2009 |
| 20100058585 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board is disclosed. The method of manufacturing a printed circuit board in accordance with an embodiment of the present invention can include: forming a circuit pattern by discharging conductive ink on a carrier through inkjet printing, heating and sintering the circuit pattern, and transferring the circuit pattern on an insulation layer by stacking the carrier on the insulation layer such that the circuit pattern is buried in the insulation layer. In accordance with an embodiment of the present invention, a minute, precise circuit pattern can be formed through inkjet printing, and adhesion between the circuit pattern and the insulation layer can be improved. | 03-11-2010 |
| 20100059251 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD - Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes providing a base substrate in which a thermoplastic resin layer is formed; forming a circuit pattern on the thermoplastic resin layer by discharging a conductive ink by an inkjet method; curing the circuit pattern through the heating at a temperature that is lower than a melting point of the thermoplastic resin layer; sintering the circuit pattern through the heating; and burying at least a part of the circuit pattern in the thermoplastic resin layer by heating the thermoplastic resin layer and compressing the circuit pattern toward the thermoplastic resin layer, can provide a printed circuit board and a method for manufacturing the same, in which a fine circuit pattern can be formed by an inkjet method and the adhesive force between the circuit pattern and the base substrate can be improved. | 03-11-2010 |
| 20100068467 | METHOD FOR TREATING SURFACE OF SUBSTRATE RESIN AND SUBSTRATE RESIN TREATED THEREBY - It relates to a method for treating the surface of a printed circuit board resin and a printed circuit board resin treated thereby. The method may allows forming fine circuit patterns and improving the adhesive strength between metal patterns and the printed circuit board resin as well. | 03-18-2010 |
| 20100195268 | HYBRID SUPERCAPACITOR USING TRANSITION METAL OXIDE AEROGEL - It discloses a hybrid supercapacitor including a carbon aerogel cathode and a transition metal oxide aerogel anode which is able to increase energy density and power density with increase of overall cell potential and at the same time lower internal resistance of the electrode and equivalent series resistance by using a monolithic electrode with no use of current collector and binder. | 08-05-2010 |
| 20100195269 | HYBRID SUPERCAPACITOR USING SURFACE-OXIDIZED TRANSITION METAL NITRIDE AEROGEL - It discloses a hybrid supercapacitor including a carbon aerogel cathode and a surface-oxidized transition metal nitride aerogel anode which is able to increase energy density and power density with increase of overall cell potential and at the same time lower internal resistance of the electrode and equivalent series resistance by using a monolithic electrode with no use of current collector and binder. | 08-05-2010 |
| 20100220430 | SUPERCAPACITOR ELECTRODE USING ION-EXCHANGER - It relates to a supercapacitor using an ion-exchanger, particularly to a supercapacitor which may optimize the capacity of current collection by employing an ion-exchanger instead of a binder in manufacturing of supercapacitor electrodes. | 09-02-2010 |
| 20100233496 | METHOD FOR MANUFACTURING METAL ELECTRODE HAVING TRANSITION METALLIC COATING LAYER AND METAL ELECTRODE MANUFACTURED THEREBY - It is to provide a method for manufacturing a metal electrode having transition metal oxide coating layer and a metal electrode manufactured thereby, which eliminates a contact resistance problem and simultaneously improves electric conductivity of the electrode by using a one body electrode, which is not requiring separate current collector and binder, and further maintains pseudo-capacitance from the redox reaction by coating the metal surface with a transition metal oxide. | 09-16-2010 |
| 20110058306 | Chip-type electric double layer capacitor and package structure thereof - Disclosed is a package structure of a chip-type electric double layer capacitor which includes a lower package, which houses an electric double layer element and has a package terminal formed thereon to be electrically connected to the electric double layer element, and an upper package which is disposed on a top part of the lower package and seals the electric double layer element from the outside, wherein the package terminals are formed to be protruded from an internal bottom surface and an external bottom surface of the lower package, and the external bottom surface of the lower package has at least two pairs of protrusions formed thereon. | 03-10-2011 |
| 20110058307 | Chip-type electric double layer capacitor and method for manufacturing the same - The present invention relates to a chip-type electric double layer capacitor and a method for manufacturing a method for manufacturing the same. The chip-type electric double layer capacitor includes an electric double layer element including two electrodes that include two different polarities and electrode terminals protruded on sides opposite to each other, a first separator that prevents the two electrodes from being short-circuited, and a second separator that is disposed at a position opposed to the first separator on the basis of one electrode of the two electrodes; and a package including package terminals attached to the protruded electrode terminals of the two electrodes, which are formed on the bottom thereof and housing the electric double layer element, wherein the electric double layer element is wound on the basis of the protruded electrode terminals opposite to the two electrodes as a reference axis and the electrode terminals are attached to the package terminals, respectively. | 03-10-2011 |
