Patent application number | Description | Published |
20110089790 | Refrigerator and method of manufacturing the same - A refrigerator and a method of manufacturing the same include a door that opens and closes a storage chamber. The door includes a frame, and a panel fixed to the frame. An end of the panel is supported by the frame on one or two sides thereof. Accordingly, manufacturing processes are simplified while the design of the refrigerator is optimized. | 04-21-2011 |
20110132025 | REFRIGERATOR DOOR AND REFRIGERATOR HAVING THE SAME - Disclosed herein are a refrigerator door having an improved configuration to prevent damage to a printed layer of a door front panel and a refrigerator having the same. The refrigerator includes a door to open and close a storage compartment. The door includes a front panel on a rear surface of which a printed layer is formed, a door sash coupled to the front panel and having at least one opening, and a foamed material charged in a space defined by the front panel and the door sash. The front panel includes a release layer formed on a surface of the printed layer to correspond to the contour of the at least one opening. | 06-09-2011 |
20120235551 | REFRIGERATOR - A refrigerator includes a hinge bracket that is installed on a cabinet between an upper door and a lower door, which are configured to individually open and close an upper portion and a lower portion of a cabinet, respectively, and rotatably supports the upper door and the lower door, the hinge bracket coupled to a connecting member through a reinforcing bracket, which is installed at an inner side of a wall forming a heat insulation space of the cabinet, thereby enhancing the sealing performance of a filler unit configured to seal between the upper door and the lower door. | 09-20-2012 |
Patent application number | Description | Published |
20130156195 | METHOD OF OBTAINING A MAIN KEY FROM A MEMORY DEVICE, METHOD OF GENERATING AUTHENTICATION INFORMATION FOR A MEMORY DEVICE, AN EXTERNAL DEVICE AND SYSTEM ICLUDING THE EXTERNAL DEVICE - In one embodiment, the method includes obtaining, at the external device, an encrypted main key and an encrypted first decryption key from the memory device. The encrypted first decryption key is an encrypted version of a first decryption key. The encrypted main key is an encrypted version of the main key. The external device is unable to read the main key from the memory device. The method further includes decrypting, at the external device, the encrypted first decryption key using a second decryption key to obtain the first decryption key; and decrypting, at the external device, the encrypted main key of the memory device using the first decryption key to obtain the main key. | 06-20-2013 |
20130159733 | MEMORY DEVICE WHICH PROTECTS SECURE DATA, METHOD OF OPERATING THE MEMORY DEVICE, AND METHOD OF GENERATING AUTHENTICATION INFORMATION - In one embodiment, the memory device includes a first memory area and a second memory area. The first memory area stores secure data. The first memory area is inaccessible by an external device. The second memory area is configured to store encrypted secure data. The second memory area is accessible by the external device, and the encrypted secure data is an encrypted version of the secure data in the first memory area. | 06-20-2013 |
20130311781 | APPARATUS AND METHOD FOR CONTENT ENCRYPTION AND DECRYPTION BASED ON STORAGE DEVICE ID - An apparatus and method for encrypting content based on an identifier (ID) of a storage device and a decrypting apparatus and method corresponding thereto. The content recording device includes a storage device interface to receive a first primitive ID and a second primitive ID to identify first and second portions provided in a storage device from the storage device, and a processor to generate a media ID that is a unique ID of the storage device using the first primitive ID and the second primitive ID and to encrypt one or more contents using an encryption key generated using the media ID, wherein the storage device interface provides the content encrypted by the processor to the storage device. | 11-21-2013 |
20140064490 | MANAGEMENT OF ENCRYPTION KEYS FOR BROADCAST ENCRYPTION AND TRANSMISSION OF MESSAGES USING BROADCAST ENCRYPTION - A method of managing keys for broadcast encryption comprises identifying a plurality of devices as corresponding to a plurality of leaf nodes in a tree structure comprising a plurality of nodes having a root node, a plurality of middle nodes, and the leaf nodes, the plurality of middle nodes comprising first middle nodes and second middle nodes, determining node key sets for the second middle nodes and for the leaf nodes and omitting a determination of node key sets for first middle nodes of the middle nodes, and determining device keys for the plurality of devices based on the node key sets for the second middle nodes and the node key sets for the leaf nodes. | 03-06-2014 |
20140189370 | MEMORY DEVICES, AND SYSTEMS AND METHODS FOR VERIFYING SECURE DATA STORAGE - A memory device includes an input/output (I/O) interface, a secure logic for receiving a storage verifying command including an expected value of secure data via the I/O interface, an I/O logic for receiving an input request for inputting user data into the memory device and/or an output request for outputting user data therefrom and perform one of the input request and/or the output request, and a memory unit including a secure area, accessible by the secure logic, for storing the secure data and a normal area, accessible by the I/O logic, for storing the user data. The secure logic reads the secure data from the secure area in response to the input of the storage verifying command and outputs a storage verifying result to the external device, without outputting the secure data to the external device, according to whether the secure data expected value is identical with the secure data. | 07-03-2014 |
Patent application number | Description | Published |
20100007007 | SEMICONDUCTOR PACKAGE - A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions. | 01-14-2010 |
20130049228 | SEMICONDUCTOR PACKAGE HAVING SUPPORTING PLATE AND METHOD OF FORMING THE SAME - A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate. | 02-28-2013 |
20140167291 | SEMICONDUCTOR PACKAGE HAVING SUPPORTING PLATE AND METHOD OF FORMING THE SAME - A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate. | 06-19-2014 |