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Hyo Jun Park, Yongin-Si KR

Hyo Jun Park, Yongin-Si KR

Patent application numberDescriptionPublished
20100048861POLYIMIDE RESIN AND LIQUID CRYSTAL ALIGNMENT LAYER AND POLYIMIDE FILM USING THE SAME - Disclosed is a polyimide resin, which is colorless and transparent and has superior properties, including mechanical properties and heat stability, and thus is usable in various fields, including semiconductor insulating films, TFT-LCD insulating films, transparent electrode films, passivation films, liquid crystal alignment layers, optical communication materials, protective films for solar cells, and flexible display substrates. Also, a liquid crystal alignment layer and a polyimide film using the polyimide resin are provided.02-25-2010
20100255221POLYIMIDE FILM - Disclosed is a polyimide film, which is colorless and transparent, with superior mechanical properties and high thermal stability.10-07-2010
20100279131POLYIMIDE FILM WITH IMPROVED THERMAL STABILITY - Disclosed is a polyimide film having superior thermal stability, in which the degree of change depending on variation in temperature is minimized.11-04-2010
20100317821POLYIMIDE RESIN AND LIQUID CRYSTAL ALIGNMENT LAYER AND POLYIMIDE FILM USING THE SAME - Disclosed is a polyimide resin, which is colorless and transparent and has superior properties, including mechanical properties and heat stability, and thus is usable in various fields, including semiconductor insulating films, TFT-LCD insulating films, transparent electrode films, passivation films, liquid crystal alignment layers, optical communication materials, protective films for solar cells, and flexible display substrates. Also, a liquid crystal alignment layer and a polyimide film using the polyimide resin are provided.12-16-2010
20110082276TRANSPARENT POLYIMIDE FILM HAVING IMPROVED SOLVENT RESISTANCE - Disclosed herein is a transparent polyimide film having improved solvent resistance, the outer form of which is not changed by swelling or dissolving even when it is immersed in a polar solvent.04-07-2011
20110143132PLASTIC SUBSTRATE AND DEVICE INCLUDING THE SAME - Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.06-16-2011
20110171445TRANSPARENT ELECTRODE - Disclosed herein is a transparent electrode, including: a polyimide film having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less; and an electrode layer including a conductive material and a polyimide resin having an average linear thermal expansion coefficient of 50.0 ppm/° C. or less, which is measured by thermo-mechanical analysis based on a film thickness of 50˜100 μm at a temperature of 50˜250° C., and a yellowness of 15 or less. The transparent electrode is advantageous in that a problem of a short circuit does not occur even when apparatuses including this transparent electrode are over-heated because it has excellent heat resistance, and in that it is transparent and has high electroconductivity.07-14-2011
20110178266POLYIMIDE FILM - Disclosed is a polyimide film, which is very transparent and very resistant to heat and thus undergoes little dimensional change under thermal stress, and is suitable for use in transparent conductive films, TFT substrates, flexible printed circuit boards and so on.07-21-2011