Patent application number | Description | Published |
20150229201 | SWITCH CONTROL CIRCUIT AND RESONANT CONVERTER INCLUDING THE SAME - A resonant converter includes a primary-side winding electrically coupled to an input voltage, a secondary-side winding electrically coupled to a load, first and second switches coupled to one end of the primary-side winding, and a switch control circuit configured to differently control switching frequency limit ratios of the first and second switches by differently limiting a frequency variation ratio of a first clock signal that determines switching frequencies of the first and second switches according to variation of one of the input voltage and the load. | 08-13-2015 |
20150229220 | SWITCH CONTROL CIRCUIT AND RESONANT CONVERTER INCLUDING THE SAME - A resonant converter includes a first switch coupled between a first node and a primary side ground, a second switch coupled between an input voltage and the first node, at least one capacitor and at least one inductor coupled in series between both ends of the first switch, and a switch control circuit that shifts switching frequencies of the first and second switches during a period for which an abnormal event lasts when occurrence of the abnormal event is detected, and shifts the switching frequencies in an opposite direction when the abnormal event ends. | 08-13-2015 |
20150229226 | RESONANT CONVERTER AND DRIVING METHOD THEREOF - A resonant converter includes a first switch on a primary side and a second switch coupled to the first switch, a first synchronous rectification switch on a secondary side conducted according to a switching operation of the first switch, a second synchronous rectification switch on the secondary side conducted according to a switching operation of the second switch, and a switch control circuit configured to detect a waveform of one end voltage of at least one of the first synchronous rectification switch and the second synchronous rectification switch, determine one of a below region and an above region, and differently control conduction duration of the first and second synchronous rectification switches according to a determined result. | 08-13-2015 |
Patent application number | Description | Published |
20090166853 | MULTI-LAYER STACKED WAFER LEVEL SEMICONDUCTOR PACKAGE MODULE - A stacked wafer level semiconductor package module includes a semiconductor chip module including first and second semiconductor chips each having a rectangular shape. The first semiconductor chip has first pads disposed along a first short side of a lower surface thereof. The second semiconductor chip has second pads disposed along a first short side of a lower surface thereof. The first and second semiconductor chips are stacked so as to expose the first pad and the second pad on one side of the stacked first and second semiconductor chips. The package also includes a substrate having a first connection pad facing the first pad and a second connection pad facing the second pad. The package also includes a first connection member for connecting the first pad to the first connection pad, and a second connection member for connecting the second pad to the second connection pad. | 07-02-2009 |
20090184414 | WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME - A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads. | 07-23-2009 |
20090197372 | METHOD FOR MANUFACTURING STACK PACKAGE USING THROUGH-ELECTRODES - Manufacturing a wafer level stack package includes the steps of back-grinding a lower surface of a wafer including a plurality of first semiconductor chips. A support member is attached to a lower surface of the back-grinded wafer. One or more second semiconductor chips are stacked on the respective first semiconductor chips of the back-grinded wafer. First through-electrodes are formed to electrically connect the stacked first semiconductor chips and second semiconductor chips. Third semiconductor chips are attached to uppermost ones of the stacked second semiconductor chips, and the third semiconductor chips have second through-electrodes which are electrically connected to the first through-electrodes and re-distribution lines which are connected to the second through-electrodes. Outside connection terminals are attached to the re-distribution lines of the third semiconductor chips. The first semiconductor chips of a wafer level on which the second and third semiconductor chips are stacked are sawed to for semiconductor packages at a chip level. | 08-06-2009 |
20110006412 | SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF AND STACK PACKAGE USING THE SAME - A semiconductor chip package and method for manufacturing thereof and stack package using the same is presented that reduces electrical signal transmission delays and realizes a reduction in thickness is presented. The stack package includes a plurality of semiconductor chip packages coupled to a substrate. Each semiconductor chip package includes a substrate and a device layer attached to the substrate. The device layer has first bonding pads on a first surface and second bonding pads on a second surface opposite to the first surface. The first and second bonding pads are coupled together by through electrodes that pass through the device layer. The stack package also includes conductive materials attached to the second bonding pads such that the conductive materials couple together adjacent semiconductor chip packages and the substrate. | 01-13-2011 |
20120007213 | SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME - A semiconductor chip includes: a semiconductor substrate in which a bonding pad is provided on a first surface thereof; a through silicon via (TSV) group including a plurality of TSVs connected to the bonding pad and exposed to a second surface opposite to the first surface of the semiconductor substrate; and a fuse box including a plurality of fuses connected to the plurality of TSVs and formed on the first surface of the semiconductor substrate. | 01-12-2012 |
20130078807 | WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME - A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads. | 03-28-2013 |
20130292845 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a first semiconductor chip having a first surface and a second surface which faces away from the first surface and including first bonding pads which are formed on the first surface and first through electrodes which pass through the first surface and the second surface; a second semiconductor chip stacked over the second surface of the first semiconductor chip, and including second bonding pads which are formed on a third surface facing the first semiconductor chip and second through electrodes which pass through the third surface and a fourth surface facing away from the third surface and are electrically connected with the first through electrodes; and a molding part formed to substantially cover the stacked first and second semiconductor chips and having openings which expose one end of the first through electrodes disposed on the first surface of the first semiconductor chip. | 11-07-2013 |
20140048930 | CONDUCTIVE BUMP, SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE USING THE SAME - A conductive bump includes a step member formed to form a step on a portion of a connection pad; and a conductive member formed on the connection pad and the step member and having an inclined surface which is inclined with respect to the connection pad. | 02-20-2014 |
20150064843 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a first semiconductor chip having a first surface and a second surface which faces away from the first surface and including first bonding pads which are formed on the first surface and first through electrodes which pass through the first surface and the second surface; a second semiconductor chip stacked over the second surface of the first semiconductor chip, and including second bonding pads which are formed on a third surface facing the first semiconductor chip and second through electrodes which pass through the third surface and a fourth surface facing away from the third surface and are electrically connected with the first through electrodes; and a molding part formed to substantially cover the stacked first and second semiconductor chips and having openings which expose one end of the first through electrodes disposed on the first surface of the first semiconductor chip. | 03-05-2015 |
20150243619 | CONDUCTIVE BUMP, SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE USING THE SAME - A conductive bump includes a step member formed to form a step on a portion of a connection pad; and a conductive member formed on the connection pad and the step member and having an inclined surface which is inclined with respect to the connection pad. | 08-27-2015 |
Patent application number | Description | Published |
20120178369 | SHORT-RANGE WIRELESS COMMUNICATION APPARATUS AND METHOD FOR ESTABLISHING CONNECTION THEREOF - A short-range wireless communication apparatus and method establish a connection thereof by simply selecting a connection target through a camera and providing an identifiable image of a target. In the method, the apparatus captures an identifiable image of a connection target device and recognizes identifiable information corresponding to the captured identifiable image. Then the apparatus either automatically selects or in conjunction with user approval selects the connection target device corresponding to the recognized identifiable information and establishes a connection with the selected target device through a short-range wireless communication. | 07-12-2012 |
20130130284 | ENZYME-FIBER MATRIX COMPOSITE OF THREE-DIMENSIONAL NETWORK STRUCTURE, PREPARATION METHOD THEREOF, AND USE THEREOF - Disclosed is a composite of enzyme and fiber matrix with three-dimensional structure. The composite of enzyme and fiber matrix with three-dimensional structure includes a significantly large amount of an enzyme loaded in and immobilized in/onto a matrix when compared to conventional composites. In addition, the immobilized enzyme is prevented from leaching from the matrix when an external impact is applied to the composite of enzyme and fiber matrix with three-dimensional structure. Therefore, the stability of the composite of enzyme and fiber matrix with three-dimensional structure of the present invention is maintained even after a long period passes since a remarkably great amount of enzymes compared with a known composite can be supported and immobilized to a matrix, and the immobilized enzyme is not easily released by an external impact. In addition, it is possible to stably immobilize a great amount of enzymes even if a functional group covalently bonding to enzymes is hardly present on the surface of fiber. Therefore, it is possible to remarkably improve performance by using the composite of enzyme and fiber matrix with three-dimensional structure of the present invention in a biosensor, a bio-fuel cell and the like, compared with the case using a known matrix composite. | 05-23-2013 |
20130182695 | METHOD AND APPARATUS FOR ESTABLISHING WIRELESS LOCAL AREA NETWORK LINK BETWEEN PORTABLE TERMINALS - A method of connecting a plurality of portable terminal over a wireless local area network (WLAN), the method including: a user selecting at least one contact from a contact list displayed on a screen of a first portable terminal, transmitting, from the first portable terminal to an external server over a cellular network, connection information necessary for establishing a WLAN link to the first portable terminal; pushing the connection information from the external server to a second portable terminal corresponding to the selected contact; a user pressing a connection authentication button on a selection menu displayed on the second portable terminal, and establishing the WLAN link to the first portable terminal from the second portable terminal by using the connection information. | 07-18-2013 |
20140065969 | METHOD FOR CONNECTIVITY INFORMATION CONTROL AND AN ELECTRONIC DEVICE THEREOF - A method and apparatus for controlling connectivity information in an electronic device. The method includes receiving connectivity information on at least one wireless device, analyzing the received connectivity information, and establishing a connection with a neighbor wireless device by using the connectivity information. A first electronic device may store connectivity information with respect to the plurality of wireless devices. A second electronic device can receive a connectivity information file transmitted from the first electronic device. In the case where a second electronic device attempts to initially establish a connection with the plurality of neighbor wireless devices, the second electronic device can easily establish a connection with the plurality of wireless devices by decoding a connectivity information file transmitted from the first electronic device. | 03-06-2014 |
20140155050 | METHOD AND APPARATUS FOR RECEIVING CONTENT BASED ON STATUS OF TERMINAL - A terminal status-based content receiving method and an apparatus that receives a differential content based on a change in a status of a terminal are provided. The content receiving apparatus includes a low-power short range communication unit, and a controller configured to determine a status of the terminal, to include status information of the terminal in an advertising packet so as to periodically broadcast the advertising packet through the low-power short range communication unit, and to receive content corresponding to the status of the terminal from an external device that scans the advertising packet. | 06-05-2014 |
20140179233 | APPARATUS AND METHOD FOR RECEIVING CONTENT IN TERMINAL - An apparatus and a method for receiving content in a terminal, by which the terminal can receive, with low power consumption, content from an adjacent service provider by using a wireless communication technology. A low-power short-range communication unit; and a controller for controlling the low-power short-range communication unit to broadcast an advertising packet including information of the terminal at regular intervals, and control the low-power short-range communication unit so as to connect to a particular service provider which has scanned the advertising packet. A control operation is then performed so as to receive content from the particular service provider. | 06-26-2014 |
20140213189 | APPARATUS AND METHOD FOR PROCESSING BLUETOOTH DATA IN PORTABLE TERMINAL - An apparatus and a method for processing Bluetooth data in a portable terminal are provided. The apparatus includes a first control unit for transmitting a predetermined data transmission condition, a second control unit for receiving and storing the data transmission condition, for determining whether the data transmission condition is satisfied when data is received from an accessory through Bluetooth communication, and for transmitting the received data to the first control unit when the data transmission condition is satisfied as a result of the determination. | 07-31-2014 |
20140335844 | APPARATUS AND METHOD FOR TRANSMITTING CONTENT IN PORTABLE TERMINAL - A method of transmitting contents in a portable terminal is provided. The method includes allowing a portable terminal of a transmitter to be connected to a portable terminal of a receiver by a control communication, allowing the portable terminal of the transmitter to select a type of the data transmission communication with the portable terminal of the receiver through the control communication, allowing the portable terminal of the transmitter to transmit setting data corresponding to the selected type of data transmission communication to the portable terminal of the receiver through the control communication, and allowing the portable terminal of the transmitter to be connected to the portable terminal of the receiver by the control communication and to transmit the content which are requested to be transmitted, to the portable terminal of the receiver. | 11-13-2014 |
20140337769 | METHOD AND APPARATUS FOR USING ELECTRONIC DEVICE - A method of using an electronic device is provided. The method includes receiving a request for a screen share mode in which to share a screen of a running application, transmitting display data resulting from running the application to a predetermined external output device, displaying a predetermined input interface on a display screen of the electronic device, and controlling operations of the application according to inputs to the displayed input interface. | 11-13-2014 |
20140340309 | METHOD AND APPARATUS FOR PROCESSING TOUCH INPUT IN MOBILE TERMINAL - Disclosed are an apparatus and a method for processing a touch input in the mobile terminal. The method includes transmitting information displayed in the mobile terminal to an external display device when connected to the external display device through a wired or wireless interface, receiving a first input, identifying a holding time of the first input when receiving a second input following the first input, and processing the second input according to the holding time of the identified first input. Accordingly, the touch input is analyzed and a subsequent drag input is performed as a pointer movement or a scroll operation in accordance with a holding time of the touch input, so that a user can conveniently select a desired item. | 11-20-2014 |
20140370811 | METHOD AND APPARATUS FOR TRANSMITTING CONTENT IN PORTABLE TERMINAL - A method and an apparatus for transmitting content in a portable terminal are provided. The method includes searching for devices, to each of which content is to be transmitted, by a first communication module, and displaying information indicating devices discovered as a result of the search; determining, when a particular portable terminal to which the content is to be transmitted is selected among the displayed information, whether the selected particular portable terminal is currently performing a communication connection with another portable terminal; requesting and receiving, through a second communication module, in response to determining that the particular portable terminal is currently performing the communication connection with the another portable terminal, an address of a device matched to a selected transmission method; and making a communication connection with the particular portable terminal; transmitting the content to the particular portable terminal, through a third communication module matched to the selected transmission method. | 12-18-2014 |
20150099486 | MOBILE TERMINAL, MOBILE TERMINAL AUXILIARY DEVICE AND METHOD FOR CONTROLLING THE SAME - Methods and apparatuses are provided for controlling a mobile terminal and a mobile terminal auxiliary device. Information on at least one of the mobile terminal and the mobile terminal auxiliary device and security-related information on the at least one of the mobile terminal and the mobile terminal auxiliary device are stored. It is determined whether the mobile terminal and the mobile terminal auxiliary device exist within a predetermined available distance. If the mobile terminal and the mobile terminal auxiliary device exist within the predetermined available distance, it is determined whether the mobile terminal or the mobile terminal auxiliary device has been registered by using the stored information. | 04-09-2015 |
Patent application number | Description | Published |
20090018803 | METHOD OF CLOTH SIMULATION USING LINEAR STRETCH/SHEAR MODEL - Deformations occurring in cloth can be decomposed into two components: the in-plane and the out-of-plane deformations. Stretch and shear are in-plane deformation, and bending is out-of-plane deformation. In the method, the numerical simulation can be done in real-time, and the models fix some flaws that existed in previous real-time models, leading to conspicuous reduction of artifacts. The (|x|−C) | 01-15-2009 |
20100057455 | Method and System for 3D Lip-Synch Generation with Data-Faithful Machine Learning - A method for generating three-dimensional speech animation is provided using data-driven and machine learning approaches. It utilizes the most relevant part of the captured utterances for the synthesis of input phoneme sequences. If highly relevant data are missing or lacking, then it utilizes less relevant (but more abundant) data and relies more heavily on machine learning for the lip-synch generation. | 03-04-2010 |
20100215235 | METHOD FOR POPULATION-DRIVEN IDENTIFICATION OF BODY LANDMARKS - A new method for the identification of body landmarks from three-dimensional (3D) human body scans without human intervention is provided. The method is based on a population in whom landmarks were identified and from whom 3D geometries were obtained. An unmarked body (subject) is landmarked if there is a landmarked body in the population whose geometry is similar to that of the subject. The similarity between the surface geometry of the subject and that of each individual in the population can be determined. A search is performed using the mesh registration technique to find a part-mesh with the least registration error; the landmarks of the best-matched result are then used for the subject. | 08-26-2010 |
20100250213 | SEMI-LAGRANGIAN CIP FLUID SOLVER WITHOUT DIMENSIONAL SPLITTING - A new constrained interpolation profile method, which is stable and accurate but requires less amount of computation, is provided. CIP is a high-order fluid advection solver that can reproduce rich details of fluids. It has third-order accuracy but its computation is performed over a compact stencil. A novel modification of the original CIP method that fixes all of the above problems without increasing the computational load or reducing the accuracy is provided. The proposed method brings significant improvements in both accuracy and speed. | 09-30-2010 |
20110112800 | Method for Simulating Stretching and Wiggling Liquids - A method for simulating the stretching and wiggling of liquids is provided. The complex phase-interface dynamics is effectively simulated by introducing the Eulerian vortex sheet method, which focuses on the vorticity at the interface and is extended to provide user control for the production of visual effects. The generated fluid flow creates complex surface details, such as thin and wiggling fluid sheets. To capture such high-frequency features efficiently, a denser grid is used for surface tracking in addition to coarser simulation grid. A filter, called the liquid-biased filter, is used to downsample the surface in the high-resolution grid into the coarse grid without unrealistic volume loss resulting from aliasing error. | 05-12-2011 |
20120143573 | Method for Tracking Detail-Preserving Fully-Eulerian Interface - A method for tracking fully-Eulerian interface is provided, which preserves the fine details of liquids. Unlike existing Eulerian methods, the method shows good mass conservation even though it does not employ conventional Lagrangian elements. In addition, it handles complex merging and splitting of interfaces robustly due to the implicit representation. To model the interface more accurately, a high order polynomial reconstruction of the signed distance function is utilized based on a number of sub-grid quadrature points. By combining this accurate polynomial representation with a high-order re-initialization method, the method preserves the detailed structures of the interface. Moreover, the method is simple to implement, unconditionally stable, and is suitable for parallel computing environments. | 06-07-2012 |
20150242545 | Method of Simulation of Moving Interfaces using Geometry-Aware Volume of Fluid Method - A method for simulating moving interface in viscous incompressible two phase flows is provided by conservation of the fluid volume and a detailed reconstruction of the fluid surface using sub-grid refinement of the level set with the volume-of-fluid method. | 08-27-2015 |
20150242546 | Method of Cloth Simulation using Constrainable Multigrid - A method of cloth simulation using a constrainable multigrid is provided. The method includes steps of: calculating a change of geometry of the mesh of nodes at a plurality of time steps using a multigrid method by solving a time-varying partial differential equation at multiple resolutions or levels; providing a hierarchical mesh through restriction or coarsening by down-sampling from level m to m−1 or prolongation or interpolation by up-sampling from level m to m+1; transferring soft constraints between different hierarchical levels using a damper-based constraint method; updating the position vector x and the velocity vector v of the mesh nodes; and displaying an updated state of the mesh of nodes using updated position vector x and velocity vector v on a display. | 08-27-2015 |
20150243076 | METHOD OF SMART GRADING BASED ON PARAMETERIZED DRAFT - An automatic garment grading is provided. A retargeting technique is used with the mediator and the correspondence function. The mediator is a parameterized draft. Local coordinates systems are used for making correspondence. The mean value coordinates system (MVC) are improved so that the weights would have positive values, which is omitted mean value coordinates (OMVC). The mediator is parameterized draft, and correspondence function is the OMVC in the method. Smart grading is less time-consuming and easy to implement, and can minimize designer's specialized know-how and save performing time for the grading of real garment and virtual garment. | 08-27-2015 |