Patent application number | Description | Published |
20110067902 | HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided. | 03-24-2011 |
20110075374 | RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided. | 03-31-2011 |
20110088928 | HEAT DISSIPATING SUBSTRATE - Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer. | 04-21-2011 |
20110240346 | HEAT-RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein is a heat-radiating substrate. The heat-radiating substrate includes: a metal core layer; a first insulating layer that is formed on one side or both sides of the metal core layer, includes a bather layer contacting with the metal core layer, first and second pores having different diameters, and a porous layer connected with the bather layer; a first circuit layer that is embedded in the first insulating layer, filled in the second pores of the porous layer, and connected to the sides of the second pores; and a second insulating layer that is formed on the porous layer of the first insulating layer. | 10-06-2011 |
20120273558 | HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided. | 11-01-2012 |
20130319734 | PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate including: a base substrate; insulation layers formed on upper and lower portions of the base substrate; a first metal layer formed on an upper portion of the insulation layer; a first through-via penetrating through the base substrate, the insulation layer, and the first metal layer and being made of an insulating material; a seed layer formed on upper and lower portions and an inner wall of the first through-via; a second metal layer formed on upper portions of the first metal layer and the seed layer; and a second through-via formed in the seed layer formed at the inner wall of the first through-via and the second metal layer. | 12-05-2013 |
Patent application number | Description | Published |
20140187112 | PREPREG, METHOD FOR MANUFACTURING THE SAME, AND COPPER CLAD LAMINATE USING THE SAME - Disclosed herein are a prepreg, including: an inorganic fiber, an organic fiber, or a hybrid fiber obtained by mix-weaving the inorganic fiber and the organic fiber, coated with a thermally conductive component or impregnated with a thermally conductive component; and a cross-linkable resin for impregnating the fiber therewith, a method for manufacturing the same, and a copper clad laminate using the same, so that the prepreg and the copper clad laminate can maintain a low coefficient of thermal expansion and a high modulus of elasticity and have excellent heat radiation property. | 07-03-2014 |
20140353004 | INSULATION RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY AND ELECTRICAL PROPERTIES, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board. | 12-04-2014 |