Patent application number | Description | Published |
20100039531 | APPARATUS AND METHOD FOR IMPROVED DIGITAL IMAGE PLAYBACK - Disclosed are an apparatus and method for improving digital image playback by switching among a plurality of displayed playback images according to a control signal generated from a user input. The apparatus includes a playback image generating unit (in an embodiment, a digital signal processor), which generates a playback image by using image data included in an image file. A display unit displays the playback image generated by the playback image processor. A detecting unit determines the duration of the control signal generated from the user input, and the playback image generating unit adjusts a specified speed of switching among a plurality of playback images according to the input of the control signal and the specified speed of switching playback images is adjusted according to the detected duration. | 02-18-2010 |
20100060597 | METHOD AND APPARATUS FOR DISPLAYING AND SELECTING ICONS ON A TOUCH SCREEN - A touch screen including a display unit configured to display a plurality of icons. The touch screen may include a detection unit configured to detect a touch in one of a plurality of touch detection regions of the display unit wherein the touch detection regions comprise an icon portion on which one icon of the plurality of icons is displayed, and an adjacent portion which is adjacent to the icon portion. The touch screen may further include a control unit electrically connected to the display unit and the detection unit, the control unit configured to control display operations of the display unit, and configured to identify based on a received signal from the detection unit which touch detection region is touched and which one icon is displayed in the touched detection region. | 03-11-2010 |
20100090324 | SEMICONDUCTOR PACKAGE HAVING SOLDER BALL WHICH HAS DOUBLE CONNECTION STRUCTURE - A semiconductor package having a solder ball having a double connection structure which reduces a total height of a package on package (POP). The semiconductor package includes a first semiconductor package in which a semiconductor device is mounted on a lower surface of a first substrate, and a through hole is formed in a solder ball pad region of the first substrate, a second semiconductor package in which a semiconductor device is mounted on an upper surface of a second substrate, and a solder ball pad of the second substrate is formed to correspond to the through hole of the first substrate and is mounted on the first substrate, and a common solder ball that is disposed below the first substrate and is connected to the solder ball pad of the second substrate through the through hole. | 04-15-2010 |
20100201616 | SYSTEMS AND METHODS FOR CONTROLLING A DIGITAL IMAGE PROCESSING APPARATUS - A digital image processing apparatus includes a sensing unit configured to sense a user's gesture to perform a specific function and generate a signal representing the user's gesture. The digital image processing apparatus also includes a digital signal processing unit which receives the signal representing the user's gesture and recognizes a plurality of discontinuous gestures as one gesture when a temporal proximity threshold between a plurality of discontinuous gestures is met. The one gesture may represent an input command from the user. | 08-12-2010 |
20100220230 | METHOD AND APPARATUS FOR CONTROLLING AUTO FOCUS, AND DIGITAL PHOTOGRAPHING APPARATUS USING THE METHOD AND APPARATUS - Provided is a method and apparatus for controlling an auto focus (AF) function. The method performs AF only on an area that is converted according to a shape of a subject, instead of on an area in a predetermined frame. Accordingly, focus is accurately adjusted even in a backlight situation or in a dark place, and also, an AF speed is increased since an AF area to be calculated is reduced. | 09-02-2010 |
20100270689 | Semiconductor packages and electronic systems including the same - Provided are semiconductor packages and electronic systems including the same. A substrate is provided. A plurality of semiconductor chips may be stacked the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad. | 10-28-2010 |
20110043647 | METHOD AND APPARATUS FOR DETERMINING SHAKEN IMAGE BY USING AUTO FOCUSING - A method and apparatus for determining a shaken image by using auto focusing. The method includes calculating a maximum AF value of a preview image and a maximum AF value of a captured image that is down-sampled according to the preview image and comparing the maximum AF value of the preview with the maximum AF value of the captured image to determine whether the captured image is shaken or not. | 02-24-2011 |
20110050913 | METHOD OF CONTROLLING DIGITAL PHOTOGRAPHING APPARATUS HAVING MEMORY, RECORDING MEDIUM FOR RECORDING THE METHOD, AND DIGITAL PHOTOGRAPHING APPARATUS - A method of controlling a digital photographing apparatus having a memory for storing an image includes generating counter information corresponding to the image, determining whether the capacity of the memory is larger than a reference capacity, and selectively resizing or deleting the image according to the counter information when the capacity of the memory is larger than the reference capacity. | 03-03-2011 |
20110068481 | PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - Provided are a semiconductor package and a method for fabricating the same. The semiconductor package includes a lower package comprising a lower substrate, a lower semiconductor chip mounted on the lower substrate and comprising a redistribution, and a molding layer molding the lower semiconductor chip, an upper package comprising an upper substrate and an upper semiconductor chip mounted on the upper substrate, with the upper package being stacked on the lower package. The semiconductor package further includes an electrical interconnector extending from the upper substrate into the molding layer and connected to the redistribution to electrically connect the upper and lower packages to each other, and a dummy interconnector extending from the upper substrate into the molding layer to physically couple the upper and lower packages to each other. | 03-24-2011 |
20110095424 | SEMICONDUCTOR PACKAGE STRUCTURE - The semiconductor package structure includes first and second packages. The first package has at least one first semiconductor chip disposed on a first printed circuit board, and at least one first pad disposed on the at least one first semiconductor chip. The second package has at least one second pad disposed on the first package, and at least one second semiconductor chip disposed on the at least one second pad. The at least one first semiconductor chip is electrically connected to the first printed circuit board. The at least one second pad is electrically connected to the at least one second semiconductor chip. The at least one second pad faces the at least one first pad. | 04-28-2011 |
20140145352 | SEMICONDUCTOR PACKAGES AND ELECTRONIC SYSTEMS INCLUDING THE SAME - A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad. | 05-29-2014 |
20140292818 | DISPLAY APPARATUS AND CONTROL METHOD THEREOF - A display apparatus which executes an application including at least one object and a control method thereof are provided. The control method includes displaying an application execution screen including the at least one object, receiving, as an input, an object position change command including at least one of a position change direction and a position change amount, and displaying the application execution screen including the first object, the position of which has been changed according to the object position change command. | 10-02-2014 |