Patent application number | Description | Published |
20130137036 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film. | 05-30-2013 |
20130164682 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. | 06-27-2013 |
20130171564 | Positive Photosensitive Resin Composition, and Display Device and Organic Light Emitting Device Using the Same - Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. | 07-04-2013 |
20130171568 | Positive Photosensitive Resin Composition, and Photosensitive Resin Layer and Display Device Using the Same - Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same. | 07-04-2013 |
20140170562 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm. | 06-19-2014 |
20140186768 | Photosensitive Resin Composition for Insulating Film of Display Device, Insulating Film Using the Same, and Display Device Using the Same - A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition. | 07-03-2014 |
20150050594 | Positive Photosensitive Resin Composition, and Photosensitive Resin Film and Display Device Prepared by Using the Same - Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same. | 02-19-2015 |
Patent application number | Description | Published |
20110250531 | Photosensitive Resin Composition for Color Filter, and Color Filter Using the Same - The present invention provides a photosensitive resin composition for a color filter including a methine-based dye represented by the following Chemical Formula 1, and a color filter fabricated using the same. | 10-13-2011 |
20120138858 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed is a photosensitive resin composition for a color filter that includes (A) an organic salt-type sulfonate-containing dye; (B) a pigment; (C) an acrylic-based binder resin; (D) a photopolymerizable monomer; (E) a photopolymerization initiator; and (F) a solvent. | 06-07-2012 |
20120161087 | Photosensitive Resin Composition and Color Filter Using the Same - A photosensitive resin composition for a color filter including a colorant including a dye represented by the following Chemical Formula 1, (B) an acrylic-based binder resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent, and a color filter using the same are provided. | 06-28-2012 |
20130164678 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a dye-polymer composite including a structural unit derived from a compound represented by the following Chemical Formula 1; (B) an acrylic-based photopolymerizable monomer; (C) a photopolymerization initiator; and (D) a solvent. | 06-27-2013 |
20140175346 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed is a photosensitive resin composition for a color filter including (A) a dye-polymer composite wherein the dye includes a repeating unit derived from a compound represented by the following Chemical Formula 1; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent. | 06-26-2014 |
Patent application number | Description | Published |
20110159223 | DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME - A die-attach film and a method of manufacturing the same, the method including providing a dicing film layer with the attach layer thereon, the dicing film layer being prepared from a photocurable adhesive composition and including an attach layer region overlapping the attach layer such that the attach layer blocks inflow of oxygen into the attach layer region, and a ring frame region, the ring frame region having an upper surface that is adjacent to the attach layer and is exposed to air or an oxygen atmosphere such that oxygen flows into the ring frame region; and irradiating UV light to a back side of the dicing film layer to induce photocuring of the attach layer region, the oxygen in the ring frame region acting as a radical scavenger and suppressing photocuring of the ring frame region. | 06-30-2011 |
20120141786 | ADHESIVE FILM FOR SEMICONDUCTOR DEVICE - An adhesive film for semiconductor devices, the adhesive film including a base film having a coefficient of linear expansion of about 50 to about 150 μm/m·° C. at 0 to 5° C. | 06-07-2012 |
20120171481 | OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM - An optically clear adhesive, a dicing die bonding film, and a semiconductor device, the optically clear adhesive including a curing agent; and an acrylic copolymer, the acrylic copolymer including an alkyl group, a hydroxyl group, and at least one of a phosphate group and a silane group. | 07-05-2012 |
20120171844 | DICING DIE BONDING FILM, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE - A dicing die bonding film including a bonding layer; and a pressure-sensitive adhesive layer adjoining the bonding layer, the pressure-sensitive adhesive layer having a storage modulus of about 400 to about 600 kPa at 25° C. and a peel strength of about 200 to about 350 mN/25 mm with respect to the bonding layer as measured according to KS-A-01107 standard. | 07-05-2012 |
20130273355 | DICING DIE BONDING FILM - A pressure sensitive dicing die bonding film includes a base film, a pressure sensitive adhesive layer formed on the base film, and a bonding layer formed on the pressure sensitive adhesive layer. An adhesive strength between the pressure sensitive adhesive layer and the bonding layer and an adhesive strength between the pressure sensitive adhesive layer and a ring frame may satisfy the following relation: | 10-17-2013 |
Patent application number | Description | Published |
20140106154 | TRANSPARENT CONDUCTOR, COMPOSITION FOR PREPARING THE SAME, AND OPTICAL DISPLAY APPARATUS INCLUDING THE SAME - A transparent conductor, a composition for the same, and an apparatus including the same, the transparent conductor including a transparent conductive film, the transparent conductive film including a metal nanowire and a conductive polymer, wherein the transparent conductor has a b* value of less than about 1.78 in color coordinates of CIE Lab at wavelengths of 400 nm to 700 nm. | 04-17-2014 |
20140186587 | TRANSPARENT CONDUCTOR AND APPARATUS INCLUDING THE SAME - A transparent conductor including: a base layer, a first coating layer on the base layer and having conductivity, and a second coating layer on the first coating layer is disclosed. The base layer, the first coating layer and the second coating layer have refractive indexes of R1, R2 and R3, respectively, at a wavelength of 380 nm to 780 nm, and the transparent conductor has a difference between R1 and R2 (R1−R2) of about 0.05 to about 0.20, and a difference between R2 and R3 (R2−R3) of about 0.01 to about 0.20. An apparatus including the transparent conductor is also disclosed. | 07-03-2014 |
20150036298 | TRANSPARENT CONDUCTOR AND OPTICAL DISPLAY APPARATUS COMPRISING THE SAME - A transparent conductor includes a base layer, and a transparent conductive film on one or both sides of the base layer, the transparent conductive film including a metal nanowire, where the base layer includes a retardation film. An optical display apparatus includes the transparent conductor. The transparent conductor may compensate for a viewing angle of the optical display apparatus. | 02-05-2015 |
Patent application number | Description | Published |
20100152337 | Mixtures of Brominated Diphenylethanes, Method of Preparing the Same and Resin Composition Using the Same - A mixture of brominated diphenylethanes is prepared by brominating diphenylethanes, comprises hexabromodiphenylethane, heptabromodiphenylethane and octabromodiphenylethane, comprises about 55 to about 85% by weight hexabromodiphenylethane, and comprises about 0.01 to about 30% by weight diphenylethanes substituted with an odd number of bromines. The mixture of brominated diphenylethanes can provide improved compatibility with polymer resins, as well as impart excellent flame retardancy and improved weatherability and thermal stability. | 06-17-2010 |
20100152342 | Flame-Retardant High Impact Vinyl Aromatic Resin Composition Having Good Fluidity - The flame-retardant high impact vinyl aromatic resin composition of the present invention comprises (A) about 100 parts by weight of a rubber modified vinyl aromatic resin; (B) about 1 to about 30 parts by weight of a brominated diphenyl ethane mixture; and (C) about 1 to about 10 parts by weight of antimony oxide. The resin composition can have excellent fluidity as well as high impact strength and can provide a flame-retardant high impact vinyl aromatic resin composition having excellent workability and mechanical properties. | 06-17-2010 |
20100152372 | Flame Retardant Thermoplastic Resin Composition - The present inventors have developed flame retardant thermoplastic resin compositions which comprises 100 parts by weight of a rubber-modified aromatic vinyl copolymer resin (A) and about 10 to about 30 parts by weight of a brominated diphenyl ethane mixture (B) including about 55 to about 85% by weight of hexabromodiphenyl ethane. The rubber modified aromatic vinyl copolymer resin (A) according to the present invention is a polymer resin wherein grafted rubbery polymers are dispersed in the form of particles in a matrix of vinyl copolymer. The rubber-modified aromatic vinyl copolymer resin (A) includes grafted rubbery polymers in an amount of about 10 to about 100% by weight and the matrix of vinyl copolymer in an amount of about 0 to about 90% by weight. The brominated diphenyl ethane mixture (B) may have about 1 to about 25% by weight of diphenyl ethane having an odd number of bromine substituents. | 06-17-2010 |
20100168292 | Thermoplastic Resin Composition Having Improved Flowability - A thermoplastic resin composition that can have improved flowability of the present invention comprises (A) about 1 to about 98% by weight of a functional group-containing vinyl copolymer resin reactive with polyester; (B) about 1 to about 98% by weight of an aromatic vinyl graft copolymer resin; (C) about 1 to about 98% by weight of a polyester resin; and (D) about 0.5 to about 30 parts by weight of a bromodiphenyl ethane mixture, based on the total weight of a base resin comprising (A), (B) and (C). The resin composition of the present invention can have flame retardancy, excellent impact resistance, and improved flowablity. | 07-01-2010 |