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Hwang, Uiwang-Si
Chi Seok Hwang, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090136748 | Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods - An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C. | 05-28-2009 |
Han-Chul Hwang, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110250531 | Photosensitive Resin Composition for Color Filter, and Color Filter Using the Same - The present invention provides a photosensitive resin composition for a color filter including a methine-based dye represented by the following Chemical Formula 1, and a color filter fabricated using the same. | 10-13-2011 |
Ja Young Hwang, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090140216 | Anisotropic conductive film composition, anisotropic conductive film including the same, and associated methods - An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles. | 06-04-2009 |
Min Kyu Hwang, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110159223 | DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME - A die-attach film and a method of manufacturing the same, the method including providing a dicing film layer with the attach layer thereon, the dicing film layer being prepared from a photocurable adhesive composition and including an attach layer region overlapping the attach layer such that the attach layer blocks inflow of oxygen into the attach layer region, and a ring frame region, the ring frame region having an upper surface that is adjacent to the attach layer and is exposed to air or an oxygen atmosphere such that oxygen flows into the ring frame region; and irradiating UV light to a back side of the dicing film layer to induce photocuring of the attach layer region, the oxygen in the ring frame region acting as a radical scavenger and suppressing photocuring of the ring frame region. | 06-30-2011 |
Sun Ae Hwang, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100151204 | Light diffusion film and method for manufacturing the same - A light diffusion film includes a thermoplastic resin, wherein a surface of the light diffusion film has an embossed pattern thereon, and the surface of the light diffusion film having the embossed pattern has a surface roughness (Ra) of about 0.5 μm to about 3 μm and a height distribution index (HDI) of about 3 μm to about 8 μm. | 06-17-2010 |
Sung Duk Hwang, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100152337 | Mixtures of Brominated Diphenylethanes, Method of Preparing the Same and Resin Composition Using the Same - A mixture of brominated diphenylethanes is prepared by brominating diphenylethanes, comprises hexabromodiphenylethane, heptabromodiphenylethane and octabromodiphenylethane, comprises about 55 to about 85% by weight hexabromodiphenylethane, and comprises about 0.01 to about 30% by weight diphenylethanes substituted with an odd number of bromines. The mixture of brominated diphenylethanes can provide improved compatibility with polymer resins, as well as impart excellent flame retardancy and improved weatherability and thermal stability. | 06-17-2010 |
| 20100152342 | Flame-Retardant High Impact Vinyl Aromatic Resin Composition Having Good Fluidity - The flame-retardant high impact vinyl aromatic resin composition of the present invention comprises (A) about 100 parts by weight of a rubber modified vinyl aromatic resin; (B) about 1 to about 30 parts by weight of a brominated diphenyl ethane mixture; and (C) about 1 to about 10 parts by weight of antimony oxide. The resin composition can have excellent fluidity as well as high impact strength and can provide a flame-retardant high impact vinyl aromatic resin composition having excellent workability and mechanical properties. | 06-17-2010 |
| 20100152372 | Flame Retardant Thermoplastic Resin Composition - The present inventors have developed flame retardant thermoplastic resin compositions which comprises 100 parts by weight of a rubber-modified aromatic vinyl copolymer resin (A) and about 10 to about 30 parts by weight of a brominated diphenyl ethane mixture (B) including about 55 to about 85% by weight of hexabromodiphenyl ethane. The rubber modified aromatic vinyl copolymer resin (A) according to the present invention is a polymer resin wherein grafted rubbery polymers are dispersed in the form of particles in a matrix of vinyl copolymer. The rubber-modified aromatic vinyl copolymer resin (A) includes grafted rubbery polymers in an amount of about 10 to about 100% by weight and the matrix of vinyl copolymer in an amount of about 0 to about 90% by weight. The brominated diphenyl ethane mixture (B) may have about 1 to about 25% by weight of diphenyl ethane having an odd number of bromine substituents. | 06-17-2010 |
| 20100168292 | Thermoplastic Resin Composition Having Improved Flowability - A thermoplastic resin composition that can have improved flowability of the present invention comprises (A) about 1 to about 98% by weight of a functional group-containing vinyl copolymer resin reactive with polyester; (B) about 1 to about 98% by weight of an aromatic vinyl graft copolymer resin; (C) about 1 to about 98% by weight of a polyester resin; and (D) about 0.5 to about 30 parts by weight of a bromodiphenyl ethane mixture, based on the total weight of a base resin comprising (A), (B) and (C). The resin composition of the present invention can have flame retardancy, excellent impact resistance, and improved flowablity. | 07-01-2010 |
Yong Ha Hwang, Uiwang-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100330780 | MULTI-FUNCTION TAPE FOR A SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME - A multifunction tape for a semiconductor package and configured to bond to a device-formed side of a semiconductor substrate having a plurality of devices thereon while performing a process of grinding a side of the semiconductor substrate opposite to the device-formed side and a process of dicing the semiconductor substrate into individual chips with a dicing tape having a UV-curable adhesive layer bonded to the ground side of the semiconductor substrate, the multifunction tape being bonded to the individual chips while the individual chips, separated from each other by the dicing process, are picked up and die-attached and a method of manufacturing a semiconductor device using the same, the multifunction tape including a base film; a UV-curable adhesive layer on one side of the base film; and first and second bonding layers on the adhesive layer. | 12-30-2010 |