Patent application number | Description | Published |
20110153249 | SEQUENCE CALIBRATION METHOD AND SEQUENCE CALIBRATION DEVICE - The invention provides a sequence calibration method, including: (a) obtaining a first reading sequence and a second reading sequence from an identical source by a receiving unit; (b) setting a comparison condition by a determining unit; and (c) comparing the first reading sequence with the second reading sequence according to the comparison condition to generate a sequence comparison result by the determining unit; and (d) outputting a calibrated sequence according to the sequence comparison result by the determining unit, wherein the comparison condition is set according to a first seed table of the first reading sequence and a second seed table of the second reading sequence. | 06-23-2011 |
20110163898 | METHOD AND APPARATUS FOR COMPRESSING NUCLEOTIDE SEQUENCE DATA - The invention provides a data compression method, comprising: (a) obtaining a first reading sequence and a second reading sequence from an identical source by a receiving unit; (b) comparing the first reading sequence with the second reading sequence according to a comparison condition to generate a sequence comparison result by the processor; (c) outputting a final template sequence according to the sequence comparison result by the processor; (d) comparing the final template sequence to each of the first and second reading sequences, to generate a respective difference between the final template sequence and each of the first and second reading sequences by the processor; and (e) compressing the first and second reading sequences according to the final template sequences and all generated differences between the final template sequence and the first and second reading sequences, to generate a compression file by the processor. | 07-07-2011 |
20120325019 | FORCE SENSING DEVICE AND FORCE SENSING SYSTEM - A force sensing device and a force sensing system are provided. The force sensing device comprises at least one magnetic material layer and a force sensing layer which can move with respect to each other. The force sensing layer comprises two sensing elements. The first sensing element, disposed along a first axis of the magnetic material layer, generates a sensing signal varying with a first lateral force applied on the force sensing device. The first lateral force enables the first sensing element to move relatively with respect to the magnetic material layer along the first axis. The second sensing element, disposed along a second axis of the magnetic material layer, generates a sensing signal varying with a second lateral force applied on the force sensing device. The second lateral force enables the second sensing element to move relatively with respect to the magnetic material layer along the second axis. | 12-27-2012 |
20130163839 | SIGNAL AND IMAGE ANALYSIS METHOD AND ULTRASOUND IMAGING SYSTEM - A time domain signal analysis method is provided. The signal analysis method includes the following steps. A signal to be analyzed is received. The signal to be analyzed is iteratively sifted by using Empirical Mode Decomposition (EMD) to extract at least one intrinsic function (IMF). A normalized Hilbert transform is performed on the IMF. The transformed IMF includes phase information. The transformed IMF is processed by means of phase processing to obtain the processed IMF including angular frequency information. The foregoing signal analysis method could be utilized in an ultrasound imaging system to identify image information of ultrasound images. | 06-27-2013 |
20130163840 | IMAGING SYSTEM AND IMAGE PROCESSING METHOD THEREOF - An image processing method is provided. The image processing method includes the following steps. A plurality of raw signal is received by a signal transceiving module of the ultrasound imaging system. It is determined whether each of the raw signals satisfies any condition in a condition group, and the raw signal satisfying any condition in the condition group is mapped to one of a plurality of preset constants to generate a plurality of first data. The raw signals not satisfying any condition in the condition group are processed according to a calculation formula to generate a plurality of second data. A beamforming procedure is simultaneously performed on the first and second data to obtain a beamformed image. The beamformed image is transformed to obtain an image of a region to be detected. Furthermore, an imaging system using the foregoing image processing method is also provided. | 06-27-2013 |
Patent application number | Description | Published |
20130244403 | METHOD AND DEVICE FOR CUTTING SEMICONDUCTOR WAFERS - A method for cutting a semiconductor wafer into semiconductor chips that reduces defects at the semiconductor chip corners. The method includes a pre-cutting processing step of trimming the semiconductor chip corners so that mechanical stress is reduced at the corners. The method includes dicing channels on a semiconductor wafer thereby defining the geometrical shape of one of the semiconductor chips, modifying the corners of the one of the semiconductor chips, and cutting the semiconductor wafer to separate the one of the semiconductor chips from other semiconductor chips. | 09-19-2013 |
20130248119 | APPARATUS AND METHOD OF SEPARATING WAFER FROM CARRIER - A method of separating a wafer from a carrier includes placing a wafer assembly on a platform. The wafer assembly includes the wafer, the carrier, and a layer of wax between the wafer and the carrier. A wafer frame is mounted on the wafer of the wafer assembly. The layer of wax is softened. The wafer and the wafer frame mounted thereon are separated, by a first robot arm, from the carrier. | 09-26-2013 |
20130273717 | Apparatus and Method for the Singulation of a Semiconductor Wafer - The present disclosure is directed to an apparatus for the singulation of a semiconductor substrate or wafer. In some embodiments the singulation apparatus comprises a plurality of cutting devices. The cutting devices are configured to form multiple concurrent cutting lines in parallel on a surface of the semiconductor wafer. In some embodiments, the singulation apparatus comprises at least two dicing saws or laser modules. The disclosed singulation apparatus can dice the semiconductor wafer into individual chips by dicing in a direction across a complete circumferential edge of the wafer, thereby decreasing process time and increasing throughput. | 10-17-2013 |
20140048586 | Innovative Multi-Purpose Dipping Plate - The present disclosure is directed to an apparatus for the application of soldering flux to a semiconductor workpiece. In some embodiments the apparatus comprises a dipping plate having a reservoir which is adapted to containing different depths of flux material. In some embodiments, the reservoir comprises at least two landing regions having sidewalls which form first and second dipping zones. The disclosed apparatus can allow dipping of the semiconductor workpiece in different depths of soldering flux without the necessity for changing dipping plates. | 02-20-2014 |
20140264930 | Fan-Out Interconnect Structure and Method for Forming Same - A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached to a carrier, and a molding compound is formed over the die and the sacrificial film layer. The molding compound extends along sidewalls of the die. The sacrificial film layer is exposed. The contact pad is exposed by removing at least a portion of the sacrificial film layer. A first polymer layer is formed over the die, and a redistribution layer (RDL) is formed over the die and electrically connects to the contact pad. | 09-18-2014 |
20140360671 | APPARATUS FOR SEPARATING WAFER FROM CARRIER - An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier. | 12-11-2014 |
20150021760 | MECHANISMS FOR FORMING BONDING STRUCTURES - Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar. | 01-22-2015 |
20150024606 | METHOD AND SYSTEM FOR THINNING WAFER THEREOF - Embodiments of a method for thinning a wafer are provided. The method includes placing a wafer on a support assembly and securing an etching mask to a backside of the wafer. The etching mask covers a peripheral portion of the wafer. The method further includes performing a wet etching process on the backside of the wafer to form a thinned wafer, and the thinned wafer includes peripheral portions having a first thickness and a central portion having a second thickness smaller than the first thickness. Embodiments of system for forming the thinned wafer are also provided. | 01-22-2015 |
20150069604 | SEMICONDUCTOR DEVICE HAVING A BOUNDARY STRUCTURE, A PACKAGE ON PACKAGE STRUCTURE, AND A METHOD OF MAKING - A semiconductor device includes a substrate and a first conductive pad on a top surface of the substrate. The semiconductor device further includes a boundary structure on the top surface of the substrate around the conductive pad. | 03-12-2015 |
20150097272 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a carrier, several dies disposed on a surface of the carrier and several scribing lines defined on the surface of the carrier. The scribing lines include several continuous lines along a first direction and several discontinuous lines along a second direction. Further, a method of dies singulation includes providing a carrier, disposing several dies on a surface of the carrier according to several scribing lines including several continuous lines along a first direction and several discontinuous lines along a second direction, cutting the carrier according to the continuous lines along the first direction, and cutting the carrier according to the discontinuous lines along the second direction. | 04-09-2015 |
Patent application number | Description | Published |
20100101651 | POLYMER SOLAR CELLS - A polymer solar cell is provided. The polymer solar cell includes a cathode and an anode, an active layer having a first surface and a second surface disposed between the cathode and the anode, and a titanium dioxide layer formed on one of the first and second surfaces of the active layer. | 04-29-2010 |
20100292433 | SOLUBLE POLYTHIOPHENE DERIVATIVE - The invention discloses soluble polythiophene derivatives containing highly coplanar repeating units. The coplanar characteristic of side chain conjugated thiophene units improves the degree of the intramolecular conjugation and intermolecular π-π interaction. The polythiophene derivative exhibits good carrier mobility and is suitable for use in photo-electronic device such as organic thin film transistors (OTFT), organic light-emitting diodes (OLEDs), and organic solar cells (OSCs). | 11-18-2010 |
20120108697 | Composition and Polymer - A composition and a polymer are provided. The composition includes the polymer and a melamine derivative. The polymer has a formula of | 05-03-2012 |
20140121386 | P-TYPE ORGANIC SEMICONDUCTOR MATERIAL AND OPTOELECTRONIC DEVICE UTILIZING THE SAME - Disclosed is a p-type organic semiconductor material having the formula: | 05-01-2014 |
20150048278 | POLYMER AND CONDUCTIVE COMPOSITION - Disclosed is a polymer having a chemical formula: | 02-19-2015 |
Patent application number | Description | Published |
20110105189 | ELECTRONIC DEVICE - An electronic device is provided. The electronic device including a body having a side on which an unstable display is disposed and an other side on which a bi-stable display is disposed. | 05-05-2011 |
20110122086 | TOUCH DISPLAY MODULE AND TOUCH DISPLAY APPARATUS COMPRISING THE SAME - A touch display apparatus comprising a controller and a touch display module, electrically connected to the controller, are provided. The touch display module comprises a display panel and a sensor assembly. The display panel includes a display surface and a connection surface opposite the display surface, and the sensor assembly is disposed on the connection surface and electrically connected to the controller. The sensor assembly comprises a first sensing layer and a second sensing layer, with a first sheet conducting layer and a second sheet conducting layer, respectively. When the display surface is touched, the first sheet conducting layer and the second sheet conducting layer are electrically connected to generate a touch signal. Thereby, the controller may detect a touch position according to the touch signal. | 05-26-2011 |
20110175872 | DISPLAY DEVICE FOR CONVERTING BETWEEN BRIGHT AND DARK STATES AND METHOD THEREOF - The configurations and controlling methods of a display device are provided in the present invention. The proposed display device having an environmental brightness, a display content and a display background with a display brightness includes a light sensor sensing the environmental brightness and adjusting the display brightness according to the environmental brightness such that a reader could read the display content easily. | 07-21-2011 |
20110279385 | TOUCH DISPLAY APPARATUS AND ELECTRONIC READING APPARATUS WITH TOUCH INPUT FUNCTION - The present invention relates to a touch display apparatus, which is including a display unit and a touch unit installed under the display unit. The display unit includes a first substrate and a second substrate installed in parallel. The touch unit includes a third substrate installed under the second substrate in parallel, and a plurality of first electrodes and a plurality of second electrodes separately installed on the lower surface of the second substrate and on the upper surface of the third substrate and facing each other. When a user touches the display unit of the electronic reading apparatus, the display unit will have a local deformation accordingly, the first electrode and the second electrode touch each other, and thus a touch signal is generated. Therefore, a touch function can be achieved. | 11-17-2011 |
20110285733 | DIGITAL STICKY NOTE WITH ELECTRIC PAPER DISPLAY - A digital sticky note has an electric paper displayer having a substrate. In addition, a display is configured on the substrate for showing an image picture without power. Further, a wireless receiver module, a process unit and a display circuit are also configured on the substrate. Wherein, the wireless receiver module receives a memo information through a wireless transmission interface, and transmits the memo information to the processor unit. Therefore, the processor unit controls the display circuit to show the memo information on the display array according to the obtained memo information. | 11-24-2011 |
Patent application number | Description | Published |
20130177785 | HIGH TEMPERATURE-PROOF DEVICE FOR LITHIUM BATTERY - The present invention discloses a high temperature-proof device for a lithium battery, which is installed in a casing of a lithium battery. The casing has a sealing board on one face thereof. The sealing board has at least one through-hole where a pressure relief module is installed. The pressure relief module has a top cover protruding from the sealing board. The top cover has at least one exhaust hole and an engagement member arranged inside the top cover. The engagement member has a first exhaust channel. A low-melting point compound is arranged inside the first exhaust channel. The present invention releases the high-temperature gas generated by inappropriate chemical or electric reaction inside a lithium battery. Thus, the present invention can prevent a lithium battery from burning or explosion caused by the high-temperature gas. Therefore, the present invention can effectively promote safety of lithium batteries. | 07-11-2013 |
20130196216 | HIGH-TEMPERATURE-PROOF LITHIUM BATTERY TERMINAL COVER SET - A high-temperature-proof lithium battery terminal cover set, disposed on a lithium battery, comprising: a sealing plate, disposed on the housing, and is provided with a plurality of through holes, to penetrate at least two terminal sets, that is includes a positive terminal set and a negative terminal set, disposed respectively in through holes. Each terminal set includes: a terminal, on which is provided with a lock-and-fix portion, protruding out sealing plate; a spring, made of insulator, and is sleeved around lock-and-fix portion; a conductive plate, sleeved around lock-and-fix portion, and is connected to battery cells of lithium battery; and a low melting point locking piece, to lock and fix spring and conductive plate onto terminal. The lithium battery terminal cover set, current flowing to terminal can be cut off automatically, preventing fire or explosion. | 08-01-2013 |
20140308548 | TERMINAL-COVER ASSEMBLY FOR SECONDARY BATTERY - A terminal-cover assembly for a secondary battery comprises a cover and at least two terminal assemblies. The cover is arranged on one side of the battery housing and has several through-holes where two terminal assemblies are installed. Each terminal assembly has an electric-conduction terminal penetrating the through-hole. The electric-conduction terminal has an installation member at one end thereof and at least one fixing element with a female thread. A fastening element with a male thread is inserted through the installation member and engaged with the female thread of the fixing element. The fixing element and fastening element are made of an identical material. Thereby, the fastening element and the fixing element can cooperate with electric-conduction plates to cascade secondary batteries to form a battery assembly, neither damaged by hardness difference nor loosened by different extents of deformations resulting from different thermal expansion coefficients. | 10-16-2014 |
Patent application number | Description | Published |
20090236729 | MELTING TEMPERATURE ADJUSTABLE METAL THERMAL INTERFACE MATERIALS AND PACKAGED SEMICONDUCTORS INCLUDING THEREOF - A melting temperature adjustable metal thermal interface material (TIM) and a packaged semiconductor including thereof are provided. The metal TIM includes about 20-98 wt % of In, about 0.03-4 wt % of Ga, and at least one element of Bi, Sn, Ag and Zn. The metal TIM has an initial melting temperature between about 60-144° C. | 09-24-2009 |
20100163782 | Carbon-Containing Metal-Based Composite Material and Manufacturing Method Thereof - A carbon-containing metal-based composite material and a manufacturing method thereof are provided. The carbon-containing metal-based composite material includes a plurality of graphites, a plurality of heat-conducting reinforcements and a metal matrix. The graphites occupy 35%˜90% in volume. The heat-conducting reinforcements are distributed between the graphites. The heat-conducting reinforcements and the graphites are self-bonded. The heat-conducting reinforcements occupy 5%˜30% in volume and have a thermal conductivity larger than 200 W/mK. The metal matrix is filled between the heat-conducting reinforcements and the graphites, and the metal matrix occupies 5%˜35% in volume. | 07-01-2010 |
20110149521 | THERMALLY CONDUCTIVE, ELECTRICALLY INSULATING COMPOSITE FILM AND STACK CHIP PACKAGE STRUCTURE UTILIZING THE SAME - Disclosed is a thermally conductive, electrically insulating composite film, including interface layers disposed on the top and bottom surface of a metal substrate, and an insulation layer. Because the film has thermal conductivity and electric insulation properties, it can be disposed between the chips of a stack chip package structure, thereby dissipating the heat in horizontal and vertical directions simultaneously. | 06-23-2011 |
20110159340 | PROTECTION STRUCTURE FORTHERMAL DISSIPATION AND PREVENTING THERMAL RUNAWAY DIFFUSION IN BATTERY SYSTEM - A protection structure for preventing thermal dissipation and thermal runaway diffusion in battery system is provided. The protection structure includes a battery module casing and at least one composite heat conduction plate. There is a plurality of unit cells disposed in the battery module casing. The composite heat conduction plate is located within the battery module casing, contacted with the battery module casing, and sandwiched between at least two of the unit cells as a heat transmission medium between the cells and the casing to control heat transmission among the cells. The composite heat conduction plate is a multilayer anisotropic heat conduction structure constituted by at least one heat conduction layer and at least one heat insulation layer. | 06-30-2011 |
20120132242 | THERMOELECTRIC GENERATOR APPARATUS WITH HIGH THERMOELECTRIC CONVERSION EFFICIENCY - A thermoelectric generator apparatus disposed on a high-temperature surface of an object (as a heat source), at least includes a heat concentrator, a thermoelectric module and a cold-side heat sink. The heat concentrator has a top surface and a bottom surface contacting a high-temperature surface of the object, and an area of the bottom surface is smaller than that of the high-temperature surface. The thermoelectric module is disposed on the top surface of the heat concentrator. The cold-side heat sink is disposed on the thermoelectric module. Heat generated by the heat source is concentrated on the heat concentrator and flows to the hot side of the thermoelectric module for increasing the heat flux (Q′) passing the thermoelectric module and the hot side temperature of the thermoelectric module. Consequently, the thermoelectric conversion efficiency (η) is improved, and the power generation of the thermoelectric module is increased. | 05-31-2012 |
20120167937 | THERMOELECTRIC MODULE AND METHOD OF MANUFACTURING THE SAME - A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers. | 07-05-2012 |
20130152990 | SOLID-LIQUID INTERDIFFUSION BONDING STRUCTURE OF THERMOELECTRIC MODULE AND FABRICATING METHOD THEREOF - A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together. | 06-20-2013 |
20140158178 | THERMOELECTRIC GENERATOR AND THERMOELECTRIC GENERATING SYSTEM - A thermoelectric generator (TEG) including a cooling element, a heat-collection element and at least one thermoelectric generating module is provided. The heat-collection element is disposed at a side of the cooling element, wherein the heat-collection element has a first surface and a second surface opposite to the first surface, and the heat-collection element is suitable for facing a thermal radiation source with the first surface so as to receive thermal energy thereof in a predetermined distance without contacting the thermal radiation source. The thermoelectric generating module is disposed between the second surface of the heat-collection element and the cooling element, wherein the emissivity of the heat-collection element is larger than 0.8. A thermoelectric generating system is also provided. | 06-12-2014 |
20140174492 | THERMOELECTRIC MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A thermoelectric material and a method for manufacturing the same are provided. The thermoelectric material includes a mixture of nano-thermoelectric crystal particles, micron-thermoelectric crystal particles and nano-metal particles. | 06-26-2014 |
Patent application number | Description | Published |
20120182762 | ILLUMINATION MODULE - An illuminating module includes at least one light-emitting chip, a phosphor, and a color temperature conversion media. The light-emitting chip is capable of emitting wavelength light, and the phosphor is disposed in a propagation path of the wavelength light to transform the wavelength light into a first white light with a first color temperature. The color temperature conversion media is disposed in a propagation path of the first white light to transform the first white light into a second white light with a second color temperature. The second color temperature is smaller than the first color temperature. | 07-19-2012 |
20140093991 | METHOD FOR MANUFACTURING HIGH EFFICIENCY LIGHT-EMITTING DIODES - A method of manufacturing a light-emitting device comprising the steps of cutting a substrate by a laser beam to form a cavity in the substrate and generate a by-product directly on the substrate by the cutting, and removing the by-product by a chemical solution containing an acid under a predetermined cleaning temperature. | 04-03-2014 |
20140139193 | SWITCH CIRCUIT - The present disclosure relates to a switch circuit. The switch circuit comprises: a plurality of storing elements and a plurality of switch elements. The plurality of switch elements coupled the plurality of storing elements for generating a step-down mode. Moreover, the switch elements, controllers and parts of resistors in the present disclosure are integrated in an integrated circuit so as to effectively reduce size and weight of the driving circuit, advance the circuit suitability, and decrease the development cost of the circuit. | 05-22-2014 |
20150129912 | LIGHT-EMITTING DEVICE PACKAGE - A light-emitting device package including a substrate, a packaging lens, a light-emitting unit and a plurality of optical microstructures is provided. The packaging lens and the light-emitting unit are disposed on the substrate and the packaging lens wraps the light-emitting unit. The packaging lens has a bottom surface and includes at least one platform. The at least one platform has a side surface and a platform surface. The bottom surface of the packaging lens is connected with the platform surface through the side surface. The platform surface faces away from the light-emitting unit and the bottom surface. The optical microstructures are located on the platform surface of the at least one platform. | 05-14-2015 |
Patent application number | Description | Published |
20090084440 | SEMICONDUCTOR PHOTOVOLTAIC DEVICES AND METHODS OF MANUFACTURING THE SAME - A semiconductor photovoltaic device comprises a semiconductor substrate having a first surface and a second surface, the first surface and the second surface being opposed to each other, a plurality of trenches extending into the semiconductor substrate from the first surface, the first surface being a substantially planar surface, a dopant region in the semiconductor substrate near the first surface and the plurality of trenches, a first conductive layer over the semiconductor substrate, and a second conductive layer on the second surface of the semiconductor substrate. | 04-02-2009 |
20090251395 | WIRING STRUCTURES FOR PANELS - A panel capable of detecting an input signal applied on or over the panel comprises an array of sensor elements divided into first M | 10-08-2009 |
20100037948 | SOLAR CELLS PROVIDED WITH COLOR MODULATION AND METHOD FOR FABRICATING THE SAME - Solar cells provided with color modulation and a method for fabricating the same are disclosed. The solar cell includes a photoelectric conversion layer and a color-modulating layer provided over the photoelectric conversion layer. The photoelectric conversion layer is employed for generating electrical energy from incident light and the color-modulating layer is used to modulate colorful appearance. | 02-18-2010 |
20100156852 | FORCE-SENSING MODULES FOR LIGHT SENSITIVE SCREENS - A light sensitive screen includes at least one sensing element each being configured to detect a force applied to a position of the light sensitive screen and generate an electrical signal when a force is detected, and a sensor module configured to receive and process the electrical signal from the at least one sensing element. The sensor module may amplify the electrical signal from one of the at least one sensing element and generate an amplified signal, compare the amplified signal with a threshold and generate a comparing result, and generate a digital signal based on the comparing result, the digital signal including information as to whether the position of the light sensitive screen is touched. | 06-24-2010 |
20120268425 | SENSING APPARATUS AND SENSING METHOD FOR SENSING TOUCH POSITION ON DISPLAY PANEL - A sensing apparatus includes a sensing cell and a processing circuit. The sensing cell is disposed inside a display panel, and includes a first type sensing device and a second type sensing device. The first type sensing device is arranged to generate a first type sensing signal when the sensing cell receives an input event. The second type sensing device is adjacent to the first type sensing device, and arranged to generate a second type sensing signal when the sensing cell receives the input event, wherein a sensing ability of the first type sensing device to detect the input event is different from a sensing ability of the second type sensing device to detect the input event. The processing circuit is arranged to output a sensing output signal corresponding to the sensing cell according to a difference between the first type sensing signal and the second type sensing signal. | 10-25-2012 |
20130329395 | FRAME STRUCTURE AND ASSEMBLING METHOD THEREOF - A frame structure applicable to a touch device is disclosed. The frame structure includes a housing carrying a backlight unit; a first frame disposed on the backlight unit and having first and second abutting surfaces that are perpendicular to each other; a panel disposed on the first frame; a polarizer attached to the panel; a second frame disposed outside the housing and the first frame and abutting against the second abutting surface of the first frame; and a cover plate attached to the first abutting surface of the first frame and bonded to the second frame through an adhesive layer, thereby reducing the gap between the cover plate and the panel, enhancing the strength of the cover plate, causing a touch experience to be more sensitive and precise, reducing the use of adhesive and increasing the product yield. | 12-12-2013 |
20140061651 | ELECTROPHORETIC DISPLAY DEVICE WITH PHOTO DETECTING INPUT - An electrophoretic display device includes a photosensitive transistor in a thin-film-transistor layer that may be used to receive an optical signal as input control signal. The thin-film-transistor layer also includes an electrical switch element for driving an electrophoretic layer to display content. A switching transistor may also be included in the thin-film-transistor layer for selectively turning on the photosensitive transistor. By incorporating the photosensitive transistor and the switching transistor into the existing thin-film-transistor layer of an active matrix electrophoretic display device, optical sensing touch control is made applicable in the electrophoretic display device without compromising its advantageous light, flexible, thin features. | 03-06-2014 |
20140139489 | DISPLAY DRIVING CIRCUIT WITH PHOTO DETECTING INPUT - A display driving circuit with photo detecting input includes pixel regions, pixel electrodes, gate lines, data lines, at least one photo detecting unit, at least one readout line and at least one isolation electrode. The pixel regions are aligned in a matrix configuration. The pixel electrodes are disposed in the pixel region respectively. Each of the gate lines extends along a first direction and the gate lines are disposed parallel to one another. Each of the data lines extends along a second direction and the data lines are disposed parallel to one another. The gate lines cross the data lines. The photo detecting unit is at least partially disposed in one of the pixel region and electrically connected to the readout line. The readout line is disposed between two adjacent data lines. The isolation electrode is disposed between the readout line and one of the data lines. | 05-22-2014 |
20140139490 | DISPLAY DRIVING CIRCUIT WITH PHOTO DETECTING INPUT - A display driving circuit with photo detecting input includes pixel regions, pixel electrodes, gate lines, data lines, at least one photo detecting unit and at least one readout line. The gate lines cross the data lines. The data lines include a first data line and a second data line disposed adjacently to each other. There is no data line disposed between the first data line and the second data line. The photo detecting unit is electrically connected to one of the gate lines. The readout line is electrically connected to the photo detecting unit and disposed between the first data line and the second data line. A first spacing between first data line and the readout line is wider than or equal to a second spacing between the second data line and the readout line, and the first spacing is smaller than or equal to triple the second spacing. | 05-22-2014 |
Patent application number | Description | Published |
20110221512 | Charge Pump - A charge pump is disclosed for amplifying an input voltage received at an input end and outputting the amplified voltage at an output end as an output voltage. The charge pump includes a plurality of source/drain coupling transistors for serving as charging capacitors, and a plurality of cascode-connected transistors being symmetrically connected to between the input end and the output end. The charge pump further includes a plurality of diode-connected transistors to protect the source/drain coupling transistors against breakdown during the course of charge transfer and to speed up the charge transfer. | 09-15-2011 |
20120087196 | GATE OXIDE BREAKDOWN-WITHSTANDING POWER SWITCH STRUCTURE - The present invention proposes a gate oxide breakdown-withstanding power switch structure, which is connected with an SRAM and comprises a first CMOS switch and a second CMOS switch respectively having different gate-oxide thicknesses or different threshold voltages. The CMOS switch, which has a normal gate-oxide thickness or a normal threshold voltage, provides current for the SRAM to wake up the SRAM from a standby or sleep mode to an active mode. The CMOS switch, which has a thicker gate-oxide thickness or a higher threshold voltage, provides current for the SRAM to work in an active mode. The present invention prevents a power switch from gate-oxide breakdown lest noise margin, stabilization and performance of SRAM be affected. | 04-12-2012 |
20120170616 | Apparatus and Method for Sensing Temperature - An apparatus and a method for sensing temperature are provided. The apparatus includes a first oscillation circuit, a pulse width generator, and a comparison circuit. The first oscillation circuit is for generating a first signal having a first frequency which is related to a to-be-sensed temperature. The pulse width generator is for generating a pulse width signal, the pulse width signal having a pulse width related to the to-be-sensed temperature. The comparison circuit is for generating an output signal indicative of the value of the to-be-sensed temperature according to the first signal and the pulse width signal. | 07-05-2012 |
20120230086 | STATIC RANDOM ACCESS MEMORY CELL AND METHOD OF OPERATING THE SAME - A static random access memory cell includes a latch unit. The latch unit includes a bi-inverting circuit and a switching circuit. The bi-inverting circuit has a first terminal and a second terminal. The switching circuit is electrically connected between the first terminal and the second terminal, wherein when the switching circuit is turned on, the switching circuit forms a feedback between the first terminal and the second terminal for latching the latch unit; and when the switching circuit is turned off, the feedback is removed to cause the SRAM cell to write a data bit to the latch unit. | 09-13-2012 |
20130027122 | ON-CHIP ACTIVE DECOUPLING CAPACITORS FOR REGULATING VOLTAGE OF AN INTEGRATED CIRCUIT - On-chip active decoupling capacitors for regulating the voltage of an integrated circuit include a reference voltage generator, a latch-based comparator and switched DECAPs. The latched-based comparator is for comparing a reference voltage generated by the reference voltage generator and a supply voltage of the integrated circuit and outputting a comparison result. The switched DECAPs includes at least two capacitors and a plurality of switches, and coupling the at least two capacitors into a parallel configuration to sink current or a series configuration to source current based on the comparison result output by the latch-based comparator. The aforementioned on-chip active decoupling capacitors not only have lower power consumption, but also larger detection range. | 01-31-2013 |
20130028324 | METHOD AND DEVICE FOR DECODING A SCALABLE VIDEO SIGNAL UTILIZING AN INTER-LAYER PREDICTION - A method and device for decoding a scalable video signal utilizing an inter-layer prediction are provided herein. An inter-layer pre-fetch scheme (IPS) is presented to improve the performance for scalable video coding (SVC) decoder. With proposed invention, the required information for inter-layer prediction in SVC technique will be pre-fetched ahead when reconstructing the enhancement layer so that the cache miss rate can be reduced significantly. Accordingly, the execution time and memory energy consumptions can be improved. | 01-31-2013 |
20130031327 | SYSTEM AND METHOD FOR ALLOCATING CACHE MEMORY - Different processor elements in multi-task/multi-core system on chip may have different memory requirements at runtime. The method for adaptively allocating cache memory re-allocates the cache resource by updating the bank assignment table. According to the associativity-based partitioning scheme, centralized memory is separated into several groups of SRAM banks which are numbered differently. These groups are assigned to different processor elements to be L2 caches. The bank assignment information is recoded in bank assignment table, and is updated by system profiling engine. By changing the information in bank assignment table, the cache resource re-allocation for processor elements is achieved. | 01-31-2013 |
20140078818 | STATIC RANDOM ACCESS MEMORY WITH RIPPLE BIT LINES/SEARCH LINES FOR IMROVING CURRENT LEAKAGE/VARIATION TOLERANCE AND DENSITY/PERFORMANCE - A static random access memory includes a pre-charger, a first cell column array/peripheral circuit, and a first ripple buffer. The pre-charger is connected to a first local bit line in order to pre-charge the first local bit line. The first cell column array/peripheral circuit is connected to the first local bit line and has a plurality of cells for temporarily storing data. The cells are connected to the first local bit line. The first ripple buffer is connected to the first local bit line and a second local bit line in order to send the data from the first local bit line to the second local bit line. | 03-20-2014 |