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Hwang, Hsinchu

Chwen-Tay Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20080316472OPTICAL SENSING MODULE AND DISPLAY DEVICE USING THE SAME - An optical sensing module is adapted to be assembled to a frame of a display device. The display device comprises a display module and the frame, and the display module has a display area and the frame surrounds the display area. The optical sensing module comprises a casing and an optical sensor. The casing is pivoted to the frame and the optical sensor is configured in the casing for sensing external light projecting on a side of the casing. The optical sensor is capable of sensing a brightness of the display area when the side of the casing faces the display area and sensing a brightness of an ambient light when the side of the casing doesn't face the display area.12-25-2008
20090201165ANGLE-ADJUSTABLE METHOD AND AUTOMATIC ANGLE-ADJUSTABLE DISPLAY DEVICE - An automatic angle-adjustable display device and an angle-adjustable method are provided. The automatic angle-adjustable display device includes a screen, three wireless transmitting and receiving sensors, an angle adjustment mechanism and a control unit. The wireless transmitting and receiving sensors are respectively disposed at first, second and third positions of the screen. In response to a control signal issued from the control unit, the angle adjustment mechanism is driven to adjust the viewing angle of the screen with respect to the viewer. The angle-adjustable method includes steps of triggering the wireless transmitting and receiving sensors to emit these wireless signals, measuring first, second and third distances between the first, second and third positions of the screen and the viewer according to the reflected wireless signals, and adjusting the viewing angle of the screen with respect to the viewer according to these distance differences.08-13-2009

Fei-Chang Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20080218093Structure of AC light-emitting diode dies - A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.09-11-2008
20090218580STRUCTURE OF AC LIGHT-EMITTING DIODE DIES - A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.09-03-2009

Patent applications by Fei-Chang Hwang, Hsinchu TW

Gwo-Fang Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20110104973Manufacturing Method for Flexible Display Apparatus - A manufacturing method for flexible display apparatus includes following steps. A carrier frame is formed on a rigid substrate. A flexible substrate is formed on the carrier substrate, wherein a border of the flexible substrate is supported by the carrier frame. A display unit is formed on the flexible substrate. At least a portion of the flexible substrate is separated from the carrier frame. In the manufacturing method, the flexible substrate and the carrier frame can be easily separated.05-05-2011

Gwo-Feng Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20110096000TOUCH STRUCTURE AND TOUCH DISPLAY APPARATUS COMPRISING THE SAME - A touch structure and a touch display apparatus comprising the same are provided. The touch display apparatus has a touch controller electrically connected to the touch structure. The touch structure comprises a display panel with a display surface and a sense assembly. The sense assembly is disposed on a surface opposite to the display surface and electrically connected to the touch controller to generate a touch signal while the display surface of the display panel is touched so that the touch controller may act according to the touch signal.04-28-2011
20110128608ELECTRO-PHORETIC DISPLAY DEVICE AND FABRICATING METHOD THEREOF - An electro-phoretic display device includes a first substrate, an active elements array, a driving circuit, a conductive flexible board, an electro-phoretic layer, a second substrate and a sealant layer. The first substrate has a first surface defining a display area and a circuit area, and a second surface. The active elements array is disposed within the display area and the driving circuit is disposed within the circuit area and electrically connected to the active elements array. The conductive flexible board is partially disposed at the first substrate and electrically connected to the driving circuit. The electro-phoretic layer and the second substrate are sequentially disposed on the active elements array and the driving circuit. The sealant layer is interposed between the second substrate and the conductive flexible board to seal the electro-phoretic layer between the first substrate and the second substrate. A fabricating method of electro-phoretic display device is also disclosed.06-02-2011
20110148277ELECTROPHORISES DISPLAY UNIT AND ITS PRODUCTION METHOD - An electrophorises display unit includes a substrate, a first electrode, a first insulation layer, a second electrode and a second insulation layer. The first electrode is disposed on the substrate. The first insulation layer is disposed on the first electrode. The second electrode is disposed on the first insulation layer. The second insulation layer is disposed on the second electrode. Wherein, the second insulation layer has an opening for appearing a part of the second electrode.06-23-2011
20110248940TOUCH DISPLAY STRUCTURE AND TOUCH DISPLAY APPARATUS COMPRISING THE SAME - A touch display apparatus comprises a touch display structure and a touch controller electrically connected thereto. The touch display structure comprises a display layer, an electric circuit layer, and a second electrode. The electric circuit layer, disposed under the display layer, comprises a substrate, a driving electrode, and a first electrode. The driving electrode and the first electrode are disposed on an upper surface and a lower surface of the substrate, respectively, and are electrically connected to the touch controller, respectively. The second electrode is disposed under the first electrode and electrically connects to the touch controller. The first electrode and the second electrode generate a touch control signal in response to a press of a user or an electromagnetic signal. The touch controller receives and processes the touch control signal, and then, the touch controller transmits the touch control signal to the driving electrode to drive the display layer.10-13-2011
20110290414METHOD FOR MANUFACTURING COLOR ELECTROPHORETIC DISPLAY DEVICE - A method for manufacturing a color electrophoretic display device includes the following steps. First, a substrate having a displaying region and a circuit region around the displaying region is provided. Next, a driving array is formed in the displaying region. Subsequently, an electrophoretic display layer is formed on the driving array. Afterwards, a thermal transfer process is performed so that a color filter layer is formed on the electrophoretic display layer. The method can increase the production eligibility rate of the color electrophoretic display device, thereby improving the display quality of the color electrophoretic display device.12-01-2011
20110291921ELECTRONIC PAPER DISPLAY DEVICE - An electronic paper display device includes a first substrate, a plurality of display units and a plurality of light-emitting units. The first substrate includes first base and a plurality of electrodes disposed on the first base. The display units are disposed above the first substrate. The light-emitting units are respectively disposed between the display units and the first base.12-01-2011
20120062467ELECTRONIC SYSTEM, METHOD FOR CONTROLLING MOBILE APPARATUS, READING APPARATUS AND METHOD FOR CONTORLLING THEREOF - An electronic system includes a mobile apparatus and a reading apparatus. The mobile apparatus includes a first screen for showing a display image. Similarly, the reading apparatus includes a second screen, which is a touch control screen. When the reading apparatus links with the mobile apparatus through a data transmission interface, the mobile apparatus transmits the display image to the reading apparatus, so that the display image is displayed on the second screen of the reading apparatus. In addition, when an operation motion is performed on the second screen, a corresponding sensing signal generated by the reading apparatus is transmitted to the mobile apparatus, and the mobile apparatus determines whether or not responding to the operation motion according to the sensing signal.03-15-2012

Ho-Yung David Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20120132921REDUCING WAFER DISTORTION THROUGH A HIGH CTE LAYER - Provided is a method of fabricating a semiconductor device. The method includes providing a silicon substrate having opposite first and second sides. At least one of the first and second sides includes a silicon (05-31-2012

Jenn-Chang Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20110065233Method for fabricating and repairing organic thin film - The present invention relates to a method for fabricating an organic thin film transistor, including: (A) providing a gate electrode; (B) forming a gate insulating layer on the gate electrode; and (C) forming an organic active layer, a source electrode and a drain electrode over the gate insulating layer, and increasing crystallinity of the organic active layer by irradiating the organic active layer. Accordingly, through irradiation, the present invention can efficiently enhance the field effect mobility, and thereby significantly improves the device performance of an organic thin film transistor. Additionally, irradiation mentioned in the present invention also can be used for repairing an organic thin film transistor.03-17-2011
20110086467Method of fabricating an organic thin film transistor and method of surface treatment for gate insulating layer - A method of fabricating an organic thin film transistor is disclosed, which comprises steps of (S1) forming a gate electrode on a substrate; (S2) forming a gate insulating layer on the gate electrode; (S3) providing a gas on the surface of the gate insulating layer to form hydrophobic molecules on the surface of the gate insulating layer; (S4) forming an organic semiconductor layer, a source electrode, and a drain electrode over the gate insulating layer having hydrophobic molecules thereon, wherein the gas of step (S3) is at least one selected from the group consisting of halogen-substituted hydrocarbon, un-substituted hydrocarbon, and the mixtures thereof. The method of the present invention utilizes gases comprising carbon or fluorine atom to perform surface treatment on the surface of the gate insulating layer, therefore the hydrophobic character of the surface of the gate insulating layer can be enhanced and the electrical properties of the OTFT can be improved. Also, a method of surface treatment for the gate insulating layer is disclosed.04-14-2011
20110227046OTFT and MIM Capacitor Using Silk Protein as Dielectric Material and Methods for Manufacturing the Same - An organic thin film transistor (OTFT) and a metal-insulator-metal (MIM) capacitor using silk protein as a dielectric material, and methods for manufacturing the same are disclosed. The OTFT of the present invention comprises: a substrate; a gate electrode disposed on the substrate; a gate insulating layer containing silk protein, which is disposed on the substrate and covers the gate electrode; an organic semiconductor layer; and a source electrode and a drain electrode, wherein the organic semiconductor layer, the source electrode and the drain electrode are disposed over the gate insulating layer.09-22-2011
20110253984ELECTRONIC GRADE SILK SOLUTION, OTFT AND MIM CAPACITOR WITH SILK PROTEIN AS INSULATING MATERIAL AND METHODS FOR MANUFACTURING THE SAME - An electronic grade silk solution, an organic thin film transistor (OTFT) and a metal-insulator-metal capacitor with silk protein as the insulating material manufactured by use of the silk solution, and methods for manufacturing the same are disclosed. The OTFT of the present invention comprises: a substrate; a gate disposed on the substrate; a gate insulating layer containing silk protein, which is disposed on the substrate and covers the gate; an organic semiconductor layer; and a source and a drain, wherein the organic semiconductor layer, the source and the drain are disposed over the gate insulating layer.10-20-2011
20110291078OTFT USING PAPER AS SUBSTRATE AND SILK PROTEIN AS INSULATING MATERIAL AND METHOD FOR MANUFACTURING THE SAME - An organic thin film transistor (OTFT) using paper as a substrate and silk protein as an insulating material and methods for manufacturing the same are disclosed. The OTFT of the present invention comprises: a paper substrate; a gate disposed on the paper substrate; a gate insulating layer containing silk protein, which is disposed on the paper substrate and covers the gate; an organic semiconductor layer; and a source and a drain, wherein the organic semiconductor layer, the source and the drain are disposed over the gate insulating layer.12-01-2011
20110297962SCHOTTKY DIODE WITH DIAMOND ROD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a Schottky diode with a diamond rod, which comprises: a substrate with a gate layer formed thereon; a patterned insulating layer disposed on the gate layer, wherein the patterned insulating layer comprises a first contact region and a second contact region; a diamond rod disposed on the patterned insulating layer, wherein a first end of the diamond rod connects to the first contact region, and a second end of the diamond rod connects to the second contact region; a first electrode corresponding to the first contact region of the patterned insulating layer, and covering the first end of the diamond rod; and a second electrode corresponding to the second contact region of the patterned insulating layer, and covering the second end of the diamond rod, and a method for manufacturing the same.12-08-2011

Jiunn-Ren Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20090014836Memory Array with a Selector Connected to Multiple Resistive Cells - An array includes a transistor comprising a first terminal, a second terminal and a third terminal; a first contact plug connected to the first terminal of the transistor; a second contact plug connected to the first terminal of the transistor; a first resistive memory cell having a first end and a second end, wherein the first end is connected to the first contact plug; and a second resistive memory cell having a third end and a fourth end, wherein the third end is connected to the second contact plug.01-15-2009
20100117045Memory Array with a Selector Connected to Multiple Resistive Cells - An array includes a transistor comprising a first terminal, a second terminal and a third terminal; a first contact plug connected to the first terminal of the transistor; a second contact plug connected to the first terminal of the transistor; a first resistive memory cell having a first end and a second end, wherein the first end is connected to the first contact plug; and a second resistive memory cell having a third end and a fourth end, wherein the third end is connected to the second contact plug.05-13-2010

Patent applications by Jiunn-Ren Hwang, Hsinchu TW

Jung-Min Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20090162960Method for manufacturing high efficiency light-emitting diodes - A method for manufacturing a light-emitting device comprising the steps of cutting a light-emitting unit by a laser beam, and cleaning the light-emitting unit by an acid solution to remove by-products resulted from the laser cutting.06-25-2009
20110281383METHOD FOR MANUFACTURING HIGH EFFICIENCY LIGHT-EMITTING DIODES - A method for manufacturing a light-emitting device comprising the steps of: providing a substrate comprising a first surface and a second surface; forming a plurality of cutting lines on the substrate by a laser beam; cleaning the substrate by a chemical solution; and forming a light-emitting stack on an first surface of the substrate after cleaning the substrate.11-17-2011

Patent applications by Jung-Min Hwang, Hsinchu TW

Kuen Yuan Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20080275153UV curable resin, its preparation and composition containing the same - The present invention relates to an ultraviolet curable resin of the present invention which is prepared from alkyl(meth)acrylates, glycidyl(meth)acrylate, and substituted or unsubstituted acrylic acid, wherein the resin contains terminal vinyl group in amount of at least 50 wt % based on the resin and its glass transition temperature (Tg) is in a range of from 40˜100° C. The present invention also relates to a resin composition containing the ultraviolet curable resin.11-06-2008
20100167208WATER SOLUBLE PHOTOSENSITIVE POLYMIDE POLYMER, ITS PREPARATION AND PHOTORESIST CONTAINING THE SAME - The present invention relates to a water soluble photosensitive polyimide polymer, preparation thereof and a photoresist composition containing the same. The water soluble photosensitive polyimide polymer is characterized by having repeat units represented by the following formula (I):07-01-2010

Patent applications by Kuen Yuan Hwang, Hsinchu TW

Kuo-Chu Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20090295274Deuterated Semiconducting Organic Compounds for Use in Light-Emitting Devices - The present invention discloses deuterated semiconducting organic compounds. The deuterated semiconducting organic compounds comprise at least one partially or fully deuterated non-conjugated portion linked to the conjugated portion. The mentioned deuterated semiconducting organic compounds can be used in optoelectronic devices, such as light-emitting devices and photodiodes, with enhanced performance and lifetime. The deuterated semiconducting organic compounds of this application can be employed as emissive layer, charge-transporting layer, or energy transfer material in organic light-emitting devices.12-03-2009

Naejye Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20110018834Touch System and Recognition Method - A touch system including a touch panel and a readout circuit is disclosed. The touch panel is integrated with a plurality of photosensitive elements within pixel elements, and capable of displaying at least touch position by at least an optical inputting. The touch panel provides a signal data when the touch panel is touched. The readout circuit is configured to receive the signal data and includes a transformation unit and a processing unit. The transformation unit generates a signal value based on the signal data and a transformation parameter. The processing unit executes a specific action when the signal value is less than a preset value.01-27-2011
20110153284Liquid Crystal Device with Embedded Element and Method for Designing Thereof - A design method for integrating an embedded device into a liquid crystal panel is disclosed, including providing an adjustable backlight spectrum range, and determining an area ratio of sub pixels occupied by an embedded element and a readout line in a touch panel according to the adjustable backlight spectrum range.06-23-2011

Nae-Jye Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20110018840TOUCH SCREEN SYSTEM - A touch screen system includes an in-cell type optical touch device for displaying images and receiving a light signal, an out-cell type touch device for sensing a finger or a non-optical stylus, a first functional unit connected with the in-cell type optical touch device, a second functional unit connected with the out-cell type touch panel and a third functional unit connected with the first functional unit and the second functional unit. The out-cell type touch device is disposed on the in-cell type optical touch device. The first functional unit converts an analog sensing signal received by the in-cell type optical touch device into a first electrical signal. An object-sensing signal generated from the out-cell type touch panel is processed by the second functional unit to generate a second electrical signal. The third functional unit analyzes the first electrical signal and the second electrical signal and generates valid output signals.01-27-2011
20110069038INTERACTIVE DISPLAY PANEL - An interactive display panel includes scan lines, first data lines, sub-pixels, photo-sensors and second data lines. The scan lines and the first data lines are intersected to define sub-pixel regions. Each of the sub-pixels is located in one of the sub-pixel regions and has a display region, and each of the sub-pixels is electrically connected with one of the scan lines and one of the first data lines respectively. The photo-sensors are located outside the display regions of the sub-pixels. The scan lines and the second data lines are intersected and electrically connected with the photo-sensors.03-24-2011
20110096026PIXEL ARRAY AND DISPLAY PANEL HAVING THE SAME - A pixel array having a plurality of pixel structures is provided. At least one of the pixel structures includes a scan line, a data line, an active device, a pixel electrode, a capacitor electrode line, a readout line and a sensing device. The scan line and the data line are disposed on a substrate. The active device is electrically connected to the scan line and the data line. The pixel electrode is electrically connected to the active device. The capacitor electrode line electrically couples with the pixel electrode. The readout line is disposed parallel to the data line. The sensing device is electrically connected to the scan line and the readout line, and the sensing device is connected to an adjacent capacitor electrode line.04-28-2011
20110169775STYLUS AND TOUCH INPUT SYSTEM - A touch input system including a stylus and a display device is provided. The stylus includes a battery module, a touch portion, a transducer module and a RF transmitting module. When a contact pressure is acted on the touch portion, the touch portion is electrically connected to the battery module by the contact pressure and emits a light signal. The display region receives and reacts to the light signal, and the contact pressure is transformed into an electrical signal by the transducer module. The RF transmitting module is electrically connected to the transducer module and transmitting the electrical signal. The display device includes a display region and a RF receiving module.07-14-2011

Ping-Feng Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20080251384MANUFACTURING METHOD FOR STAMPER AND MANUFACTURING METHOD FOR LIGHT GUIDE PLATE USING THE STAMPER - A manufacturing method for a stamper is provided. UV light cure adhesive is sprayed on a substrate and cured to form a three-dimensional pattern. Thereafter, a stamper is formed on the substrate and the three-dimensional pattern, such that the stamper has a first pattern opposite to the three-dimensional pattern. Afterwards, the stamper is separated from the substrate and the three-dimensional pattern. The stamper is disposed in a cavity of an injection molding machine to form a light guide plate. The light guide plate has a second pattern identical with the three-dimensional pattern.10-16-2008
20090002989INTEGRALLY FORMED REFLECTOR STRUCTURE, BACKLIGHT MODULE USING THE SAME REFLECTOR STRUCTURE AND METHOD FOR ASSEMBLING THE SAME BACKLIGHT MODULE - The present invention discloses an integrally formed reflector structure, a backlight module using the same reflector structure and a method for assembling the same module. An accommodation spacer and a plurality of lamp-support members are formed on a reflector baseplate with a vacuum-forming method, and a plurality of extension portions extend from the edges of the accommodation space. Further, pluralities of support pins, reflecting members, lamp-fixing members, positioning members, bent portions, etc. are formed in the appropriate positions of the reflector baseplate or the extension portions with a vacuum-forming method. Besides, the extension portions are bent from the bent portions to form a plurality of grooves, which are used to secure optical films in cooperation with the positioning members.01-01-2009

Patent applications by Ping-Feng Hwang, Hsinchu TW

Ruey-Bing Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20090267201Vertical Transmission Structure - A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.10-29-2009
20110121923VERTICAL TRANSMISSION STRUCTURE - A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.05-26-2011

Sam-Long Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20090123592Process for preparing vegetable casing and transferring apparatus used therein - The present invention discloses an extrusion process for preparing vegetable casing including preparing a continuous tubular extrudate by extrusion, and transferring the continuous tubular extrudate. The transferring includes repeatedly passing a plurality of separate horizontal posts below the continuous tubular extrudate, hanging the continuous tubular extrudate on the posts so that the continuous tubular extrudate is conveyed by the posts a distance, while a closed space is formed inside the tubular extrudate and between every two adjacent horizontal posts.05-14-2009

Shiaw-Min Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20080248515Optimizing culture medium for CD34<+> hematopoietic cell expansion - The present invention provides a method of determining the optimal composition of a serum-free, eukaryotic cell culture medium supplement, using 2-level factorial design and the deepest ascent method. The invention further provides a method of making a serum-free eukaryotic cell culture medium supplement and the generated thereof. The invention further provides a method of making a serum-free, eukaryotic cell culture medium and the medium generated thereof. The invention further provides a kit containing the medium of the invention. The invention also provides a method of expanding CD34<+> hematopoietic cells and a composition comprising CD34<+> hematopoietic cells in a serum-free, eukaryotic cell culture medium of the invention.10-09-2008
20090309072Bacterial cellulose film and carbon nanotubes-like thin film structures developed from bacterial cellulose - A carbon nanotubes-like material is disclosed. The carbon nanotubes-like material comprises bacterial cellulose carbonized under an oxygen-free atmosphere. Also disclosed is a cathode material containing bacterial cellulose and LiFePO12-17-2009
20110038969FERMENTED COMPOSITION OF MUNG BEAN HULLS, METHOD FOR FORMING THEREOF, AND ANTI-OXIDATION AND ANTI-INFLAMMATION COMPOSITION USING THE SAME - The invention provides a method for forming a fermented composition of mung bean hulls, including: mixing mung bean hulls and water to form a mixture; adding a fungus into the mixture, wherein the fungus includes 02-17-2011
20110256627Cutting device for culturing the next generation of cells - The present invention is related to a device for subculturing embryonic stem cells, which mainly contains a cutting brush having a handle and a brush stem. The brush stem has a stem and a plurality of discrete upright wires disposed on the stem. The brush stem is mounted onto a front end of the handle, and an angle between the brush stem and the handle ranges from 70 to 90 degrees. The distance between two adjacent wires is smaller than the diameter of a block of the embryonic stem cells to be cut for next generation culturing, so that the cutting brush can evenly cut the block into a plurality of smaller blocks of embryonic stem cells.10-20-2011

Patent applications by Shiaw-Min Hwang, Hsinchu TW

Ting-Ting Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20120007251STACKED MULTI-CHIP - A stacked multi-chip comprises a base layer, a first chip, a first stacked chip and at least one second stacked chip. The base layer comprises a mounting panel and a redistributed layer. The redistributed layer is mounted on the mounting panel. The first chip comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel. The connective layer abuts the redistributed layer. The first stacked chip is mounted on the first chip and comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel that is connected to the TSV channel of the first chip. The second stacked chip is mounted on the first stacked chip and comprises an electrically non-conductive layer and a connective layer. The electrically non-conductive layer comprises a TSV channel. The connective layer is connected to the connective layer of the first stacked chip.01-12-2012

Wei Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20090161400Leakage current cut-off device for ternary content addressable memory - A leakage current cut-off device for a ternary content addressable memory is provided. The storage cell of a ternary content addressable memory may be in the active mode, data-retention mode and cut-off mode. This invention applies a multi-mode data retention power gating device to the storage cell of the ternary content addressable memory to reduce the leakage current through the storage cell in the data-retention mode and the cut-off mode, and support the full speed operation in the active mode.06-25-2009
20100172194Dual-threshold-voltage two-port sub-threshold SRAM cell apparatus - The invention relates to a dual-threshold-voltage two-port sub-threshold SRAM cell apparatus. The above-mentioned apparatus comprises a first inverter, a second inverter, an access transistor and a read buffer. The first inverter and the second inverter include a plurality of first operating elements and a plurality of second operating elements for storing data. The access transistor is coupled to the first inverter and the second inverter, wherein the first operating elements and the second operating elements are high threshold voltage operating elements and the access transistor is low threshold voltage operating transistor. The read buffer is used for performing a read operation.07-08-2010
20110193515SOLAR POWER MANAGEMENT SYSTEM - A solar power management system is provided for managing electric energy conversion by a photovoltaic cell module, supplying the converted electric energy to an external load, and storing the converted electric energy in a battery. The solar power management system comprises a multiphase maximum power tracking (MPT) module, a charging circuit, and a voltage conversion module. The multiphase MPT module regulates output current of the photovoltaic cell module to output maximum power within the high limit thereof and obtain improved solar energy conversion efficiency. The voltage conversion module converts the electric energy generated by the photovoltaic cell module into different voltage formats, such as 5.6V DC, 1.0V DC, 0.6˜0.3V DC low voltage, or −1.2V DC negative voltage, to meet different external load requirements. The solar power management system has simple circuitry and can be configured as a system on chip (SoC) at reduced cost while provides very wide applications.08-11-2011

Patent applications by Wei Hwang, Hsinchu TW

Wei-Cheng Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20080316472OPTICAL SENSING MODULE AND DISPLAY DEVICE USING THE SAME - An optical sensing module is adapted to be assembled to a frame of a display device. The display device comprises a display module and the frame, and the display module has a display area and the frame surrounds the display area. The optical sensing module comprises a casing and an optical sensor. The casing is pivoted to the frame and the optical sensor is configured in the casing for sensing external light projecting on a side of the casing. The optical sensor is capable of sensing a brightness of the display area when the side of the casing faces the display area and sensing a brightness of an ambient light when the side of the casing doesn't face the display area.12-25-2008

Wein-Kuen Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20100302703THIN FILM CAPACITORS WITH MAGNETICALLY ENHANCED CAPACITANCE - A capacitor is disclosed. The capacitor includes a conductive and non-magnetic layer, a magnetic and conductive layer, and a dielectric layer. The dielectric layer is disposed between the conductive and non-magnetic layer and the magnetic and conductive layer. The magnetic and conductive layer is capable of generating a magnetic field, and thus enhances the dielectric constant of the dielectric layer for at least 10 folds.12-02-2010

Yu-Jiau Hwang, Hsinchu TW

Patent application numberDescriptionPublished
20080265410Wafer level package - A wafer level package includes a substrate, a passivation layer, an elastic layer, a first insulation layer, a metal trace, a second insulation layer, and a bump. The passivation layer is formed on the substrate, and has one pad. The elastic layer is formed on the passivation layer. The first insulation layer is formed on the passivation layer and the elastic layer, and has a junction in contact with the pad. The metal trace is formed on the first insulation layer. The second insulation layer is formed on the metal trace, and a groove is formed correspondingly above the elastic layer. The bump is formed in the groove. An annular trench can be further formed around the bump. A groove can be furthermore formed in the first insulation layer correspondingly below the bump.10-30-2008