Patent application number | Description | Published |
20110150359 | CURRENT LIMITATION METHOD OF DISPLAY DEVICE - A current limitation method of a display device includes: calculating a brightness average in each frame of an inputted image; calculating a brightness difference between successive frames of the image by using the calculated brightness average, and calculating a cumulative average brightness value by cumulating the brightness average with respect to the frames included in a frame length which is varied depending on the brightness difference; converting the cumulative average brightness value into a preset brightness adjustment value; and adjusting the brightness of the inputted image according to the brightness adjustment value. | 06-23-2011 |
20110169817 | APPARATUS FOR COMPENSATING FOR DETERIORATION IN AMOLED - There is provided an apparatus for compensating for deterioration in an active matrix organic light-emitting diode. An apparatus for compensating for deterioration in an active matrix organic light-emitting diode being operated by a pixel driving unit may include: a switching control unit being synchronized with an operation of the pixel driving unit to thereby generate a switching control signal in order to compensate for deterioration in a pixel; and a switch circuit unit connected between an anode of the active matrix organic light-emitting diode and a terminal of a deterioration compensation voltage, being turned on or off according to the switching control signal from the switching control unit, and supplying the deterioration compensation voltage to the anode of the active matrix organic light-emitting diode while being turned on. | 07-14-2011 |
20120167680 | APPARATUS FOR DRIVING MULTI-AXIAL ANGULAR VELOCITY SENSOR - Disclosed herein is an apparatus for driving a multi-axial angular driving sensor. The apparatus includes a driving unit; a timing control unit outputting the start control signal to the driving unit, wherein the start control signal, when one axis is driven based on an axis drive stabilization section and a drive off section,; and a sensing unit. Therefore, the present invention can significantly improve the sampling time in a multi-axial sensor. | 07-05-2012 |
20120167684 | SELECTIVE MOTION RECOGNITION APPARATUS USING INERTIAL SENSOR - Disclosed herein is a selective motion recognition apparatus using an inertial sensor. The selective motion recognition apparatus using an inertial sensor includes: an sensor unit; a selection unit that outputs a sensor selection signal; and a motion detection unit that receives an angular velocity sensor data and an acceleration sensor data output from the sensor unit. | 07-05-2012 |
20120304770 | DRIVING CONTROL MODULE AND METHOD FOR INERTIAL SENSOR - Disclosed herein is a driving control module for an inertial force. The driving control module includes a timing control unit that applies a driving signal and a sensing signal; a driving unit that receives the driving signal from the timing control unit and applies the driving signal to a sensor; a sensing unit that receives the sensing signal from the timing control unit, applies the sensing signal to a sensor, and senses stabilization driving and inertial force of the sensor; and a driving control unit that locks application of the driving signal from the timing control unit to the driving unit. As a result, the exemplary embodiment of the present invention can provide a driving control module and a method for an inertial sensor capable of obtaining a maximum sampling rate by sensing the stabilization driving of the driving unit and locking and sensing the application of the driving signal from the timing control unit at the time of the stabilization driving and capable of performing an efficient control by reducing the additional driving for stable sensing and the sensing loss. | 12-06-2012 |
20130247664 | INERTIAL SENSOR CONTROL MODULE AND METHOD FOR CONTROLLING INERTIAL SENSOR CONTROL MODULE - Disclosed herein is an inertial sensor control module. The inertial sensor control module according to a preferred embodiment of the present invention includes: an inertial sensor including a driving mass, a driving unit driving the driving mass of the inertial sensor according to a control signal to the inertial sensor, a control unit connected to the driving unit and generating the control signal to transfer the generated control signal to the driving unit, and a sensing unit connected between the inertial sensor and the control unit and detecting information about whether the driving mass of the inertial sensor is in a stabilized state or information about an inertial force of the inertial sensor to transfer the detected information to the outside or the control unit. | 09-26-2013 |
20130255376 | INERTIAL SENSOR AND MEASURING METHOD FOR MEASURING ANGULAR VELOCITY USING THE SAME - Disclosed herein is an inertial sensor. The inertial sensor according to a preferred embodiment of the present invention includes: a plate-shaped membrane; a mass body provided under the membrane; posts provided under an outside edge of the membrane and surrounding the mass body; a piezoelectric body formed on the membrane; sensing electrodes formed on the piezoelectric body; driving electrodes formed on an outer circumference of the sensing electrodes, wherein tri-axis angular velocity can be measured without time division by a driving control unit continuously applying first driving voltage and second driving voltage that are is AC driving voltage having a phase difference of 90°. | 10-03-2013 |
20130282326 | INERTIAL SENSOR CONTROL MODULE AND METHOD - Disclosed herein is an inertial sensor control module including: at least one inertial sensor including a driving mass and at least two pads connected to the driving mass; a driving unit applying a received control signal to the inertial sensor to drive the driving mass; a controlling unit connected to the driving unit and generating the control signal to transfer the control signal to the driving unit; and a sensing unit connected between the inertial sensor and the controlling unit and detecting information on whether the driving mass is in an abnormal resonance state for the control signal to transfer the detected information to the controlling unit. | 10-24-2013 |
20130312521 | CONTROL MODULE AND METHOD OF INERTIAL SENSOR - Disclosed herein is a control module of an inertial sensor, including: at least one inertial sensor including a driving mass; a sensing unit detecting and transferring information of the inertial sensor; a multiplexer unit including at least one multiplexer to selectively transfer the information of the inertial sensor to a sampling unit or a filter unit according to whether before or after start-up of the inertial sensor; a controlling unit including automatic gain control (AGC) and connected to the sampling unit and the filter unit to generate control information including an AGC gain for the inertial sensor; and a driving unit applying the AGC gain to the inertial sensor according to the control information, wherein the sampling unit and the filter unit are connected to each other so as to interwork with each other. | 11-28-2013 |
Patent application number | Description | Published |
20090294956 | Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof - Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin. | 12-03-2009 |
20090308650 | Printed circuit board and method of manufacturing the same - The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved. | 12-17-2009 |
20100230146 | CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties. | 09-16-2010 |
20110120758 | DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME - Disclosed is a die mounting substrate, which includes a mounting substrate having a pad, a die having a terminal and surface-mounted on the mounting substrate, and a conductive paste bump formed on the pad or the terminal so as to connect the pad and the terminal to each other. When the die is connected and mounted on the mounting substrate using the conductive paste bump, shear stress is relieved thus preventing reliability from decreasing due to a difference in the coefficient of thermal expansion between the die and the mounting substrate, and also preventing the force of adhesion of the bump from decreasing due to the reduction in size of the pad of the mounting substrate. | 05-26-2011 |
20110308069 | Method of manufacturing cooling fin and package substrate with cooling fin - A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object. | 12-22-2011 |
20140106510 | DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME - In accordance with various embodiments, there is provided a method of fabricating a die mounting substrate, including the steps of preparing a mounting substrate including a pad and a die including a terminal, and printing a conductive paste bump on one of the pad or the terminal. The method further includes the step of connecting the pad and the terminal to each other using the conductive paste bump, thereby surface-mounting the die on the mounting substrate. | 04-17-2014 |