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Hwang, Gyunggi-Do
Byoung Won Hwang, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110150359 | CURRENT LIMITATION METHOD OF DISPLAY DEVICE - A current limitation method of a display device includes: calculating a brightness average in each frame of an inputted image; calculating a brightness difference between successive frames of the image by using the calculated brightness average, and calculating a cumulative average brightness value by cumulating the brightness average with respect to the frames included in a frame length which is varied depending on the brightness difference; converting the cumulative average brightness value into a preset brightness adjustment value; and adjusting the brightness of the inputted image according to the brightness adjustment value. | 06-23-2011 |
| 20110169817 | APPARATUS FOR COMPENSATING FOR DETERIORATION IN AMOLED - There is provided an apparatus for compensating for deterioration in an active matrix organic light-emitting diode. An apparatus for compensating for deterioration in an active matrix organic light-emitting diode being operated by a pixel driving unit may include: a switching control unit being synchronized with an operation of the pixel driving unit to thereby generate a switching control signal in order to compensate for deterioration in a pixel; and a switch circuit unit connected between an anode of the active matrix organic light-emitting diode and a terminal of a deterioration compensation voltage, being turned on or off according to the switching control signal from the switching control unit, and supplying the deterioration compensation voltage to the anode of the active matrix organic light-emitting diode while being turned on. | 07-14-2011 |
Jun Oh Hwang, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20090294956 | Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof - Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin. | 12-03-2009 |
| 20090308650 | Printed circuit board and method of manufacturing the same - The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved. | 12-17-2009 |
| 20100230146 | CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties. | 09-16-2010 |
| 20110120758 | DIE MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME - Disclosed is a die mounting substrate, which includes a mounting substrate having a pad, a die having a terminal and surface-mounted on the mounting substrate, and a conductive paste bump formed on the pad or the terminal so as to connect the pad and the terminal to each other. When the die is connected and mounted on the mounting substrate using the conductive paste bump, shear stress is relieved thus preventing reliability from decreasing due to a difference in the coefficient of thermal expansion between the die and the mounting substrate, and also preventing the force of adhesion of the bump from decreasing due to the reduction in size of the pad of the mounting substrate. | 05-26-2011 |
| 20110308069 | Method of manufacturing cooling fin and package substrate with cooling fin - A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object. | 12-22-2011 |
Shin Hwan Hwang, Gyunggi-Do KR
| Patent application number | Description | Published |
|---|---|---|
| 20110285830 | Stereoscopic Image Display Apparatus Capable Of Wirelessly Transmitting and Receiving Power - Disclosed herein is a stereoscopic image display apparatus capable of wirelessly transmitting and receiving power. The stereoscopic image display apparatus includes a stereoscopic image display unit and shutter glasses. The stereoscopic image display unit divides stereoscopic images into images for the left eye and images for the right eye and displays the resulting stereoscopic images, generates a signal of opening/closing a right eye shutter and a left eye shutter, and generates a power signal and then wirelessly transmits power in a magnetic resonance coupling manner. The shutter glasses wirelessly receives the power signal from the stereoscopic image display unit in the magnetic resonance coupling manner, and provides the images for the left eye and the images for the right eye by alternatively opening and closing the left eye shutter and the right eye shutter in response to the signal of opening/closing the right eye shutter and the left eye shutter. | 11-24-2011 |