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Hwang, Cheongju-Si
Deogjong Hwang, Cheongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100115336 | MODULE TEST DEVICE AND TEST SYSTEM INCLUDING THE SAME - A test system includes a host, a module to communicate with the host, and a test device to test the module while the module is connected to the host. The host includes a pulse width modulator circuit to supply a power to the module, and the test device varies a feedback resistance value provided to the pulse width modulator circuit. | 05-06-2010 |
Deog-Jong Hwang, Cheongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100125377 | APPARATUS TO TEST SEMICONDUCTOR DEVICE AND METHOD OF TESTING SEMICONDUCTOR DEVICE USING THE SAME - An apparatus to test a semiconductor device includes a chamber defining an inner space to receive a plurality of semiconductor devices, a temperature control apparatus connected to the chamber and configured to heat or cool the chamber to a predetermined level, and a control module to transmit an electrical signal to the temperature control apparatus to heat or cool an inner space of the chamber. As a result, the semiconductor devices can be exposed to heating and cooling environments having set test temperature values to selectively perform a test. | 05-20-2010 |
Jong-Taek Hwang, Cheongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080272452 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - An image sensor that includes a hard mask layer formed in the upper surface region of the planarization layer and under a microlens to protect an underlying planarization layer from chemicals used during performing a cleaning process after formation of the microlens. The microlens is composed of inorganic materials to prevent cracking by physical impacts. | 11-06-2008 |
| 20080318410 | METHOD OF FORMING METAL ELECTRODE OF SYSTEM IN PACKAGE - A method for forming a metal electrode of a system in package of a system in package including a multilayer semiconductor device having semiconductor devices stacked in a plurality of layers. The method may include forming a through hole extending through the plurality of layers, forming a combustible material layer having high viscosity at a lower portion of the through hole in order to seal the lower portion thereof, and forming a through electrode by filling copper in the through hole. There is an effect of efficiently forming a through electrode having a large depth corresponding to the height of stacked semiconductor devices in the system in package. Filling copper in a through hole having a large depth-to-width ratio may be efficiently done by OSP coating, electrolysis copper plating, and electro Cu plating processes. | 12-25-2008 |
| 20090072285 | CMOS IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME - A CMOS image sensor and a method for fabricating the same for preventing contamination and peeling of an array of micro lenses. The CMOS image sensor includes a plurality of photodiodes formed on and/or over a substrate, an insulating film formed on and/or over an entire surface of the substrate including the photodiodes, color filter layers formed on and/or over the insulating film, a first oxide film formed on and/or over the color filter layers, an ion-rich oxide film formed by injecting silicon ions into the first oxide film, a second oxide film formed on and/or over the ion-rich oxide film, and a micro lens pattern formed corresponding to the photodiodes by patterning the second oxide film. | 03-19-2009 |
| 20090101951 | CMOS Image Sensor and Fabricating Method Thereof - A CMOS image sensor and fabricating method thereof are disclosed. The method includes forming a plurality of photodiode regions on a semiconductor substrate, forming a plurality of color filters respectively corresponding to the photodiode regions, forming a planarization layer on the color filters, forming a protective layer on the planarization layer, and forming a microlens layer comprising a plurality of microlenses corresponding to the photodiode regions by depositing a low-temperature oxide layer on the protective layer and then patterning the low-temperature oxide layer. After the planarization layer is formed, the protective layer is formed by plasma processing. Thus, the planarization layer can be protected from chemical penetration via numerous pin holes in the microlens layer in the course of wet processing. Accordingly, the method prevents the microlens from lifting from the planarization layer. | 04-23-2009 |
| 20090108451 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a pattern layer formed on and/or over a semiconductor substrate, a fluorine-diffusion barrier layer containing a silicon-doped silicon oxide formed on and/or over the pattern layer, and an interlayer dielectric layer containing fluorine formed on and/or over the fluorine-diffusion barrier layer. | 04-30-2009 |
Kabjin Hwang, Cheongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090284686 | OPTICAL SHEET, BACKLIGHT UNIT, AND LIQUID CRYSTAL DISPLAY - An optical sheet, a backlight unit including the optical sheet, and a liquid crystal display including the backlight unit are provided. The optical sheet includes a base film including a first surface and a second surface opposite the first surface and a plurality of projections on the base film. A first thickness between the first surface and the second surface is different from a second thickness between the first surface and the second surface. | 11-19-2009 |
Sung-Min Hwang, Cheongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100279161 | STACK AND FOLDING-TYPED ELECTRODE ASSEMBLY AND METHOD FOR PREPARATION OF THE SAME - Disclosed herein is a method of locating a plurality of pull cells constructed in a cathode/separator/anode structure, as basic units, on a separator sheet having a continuous length, further locating a unit electrode or a bi-cell on the separator sheet, and winding the pull cells and unit electrode or the bi-cell to continuously manufacture a stacking/folding type electrode assembly constructed in a structure in which anodes are located at the outermost electrodes forming the outside of the electrode assembly, respectively, wherein the method including a step of continuously supplying a cathode sheet, an anode sheet, a first separator sheet, and a second separator sheet, to manufacture the unit cells, successively arranging the unit cells on the second separator sheet from a first stage to an n stage, and winding the unit cells, a step of arranging cathode tabs and anode tabs at the respective stages, while the cathode tabs and the anode tabs are opposite to each other, and arranging electrode tabs having the same polarity between the neighboring stages, while the electrode tabs are opposite to each other, such that the electrode tabs having the same polarity are located all together at predetermined positions of the wound electrode assembly, and a step of supplying electrodes the number of which is odd from two electrode sheets and electrodes the number of which is even from one electrode sheet. | 11-04-2010 |
Sung Seock Hwang, Cheongju-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20120128950 | FUNCTIONAL INORGANIC BOARD AND MANUFACTURING METHOD THEREOF - The present invention relates to an inorganic board comprising a base layer containing magnesium-based inorganic materials and phase change materials, and to a method for producing the board. The inorganic board of the present invention employs magnesium-based inorganic materials instead of plaster used in conventional boards, and thus improves the strength and water resistance thereof as compared to conventional plaster boards. Accordingly, the board of the present invention is formed so as to be thin, and the content of the phase change materials in the base layer increases by the superior blending ratio of magnesium-based inorganic materials and phase change materials, thus maintaining the indoor temperature of the structure constructed by the board of the present invention at a comfortable level. Therefore, the inorganic board of the present invention can be effectively used in interior materials or the like for a building, which require strength and water resistance properties. | 05-24-2012 |