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Hwang, Asan-Si
Hyun-Ik Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100052130 | SEMICONDUCTOR PACKAGE AND METHODS FOR MANUFACTURING THE SAME - Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire. | 03-04-2010 |
| 20120013007 | PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES - A Package-on-Package (POP) semiconductor package has a structure in which a second semiconductor package is stacked on a first semiconductor package. A plurality of spacers are disposed between a first substrate of the first semiconductor package and a second substrate of the second semiconductor package so as to maintain a gap between the first substrate and the second substrate. The plurality of spacers may project from a bottom surface of the second substrate toward the first substrate, or may project from a top surface of the first substrate toward the second substrate. When an upper molding layer is formed on the second substrate so as to cover a second semiconductor chip, the plurality of spacers may be connected to the upper molding layer via through holes that vertically pass through the second substrate. When a first semiconductor chip is adhered to the top surface of the first substrate with an adhering layer, the plurality of spacers may be connected to the adhering layer on the top surface of the first substrate. | 01-19-2012 |
In Uk Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110048673 | AIR-CONDITIONER FOR VEHICLE - An air-conditioner for a vehicle may include a casing including an internal space therein, wherein the internal space communicates with an upper outlet formed in a side of the casing, an evaporator and a heating member installed in the casing, a partition wall partitioning a portion of the internal space behind the heating member into an upper space and a lower space, wherein the upper space includes at least a floor duct inlet and the lower space receives the heating member therein to form an upward flowing path which guides air from the heating member toward the upper outlet, a floor duct coupled to the upper space to communicate the at least a floor duct inlet with the outside, and a floor door installed in the casing to selectively open the upper space and/or a flowing path fluid-connecting the evaporator and the heating member to the upper outlet. | 03-03-2011 |
Jae-Seon Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100149776 | PRESSURE CONDUCTIVE SHEET - A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics. | 06-17-2010 |
| 20120007625 | Test Socket for Testing Electrical Characteristics of a Memory Module - A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage. | 01-12-2012 |
Ji-Hwan Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090184418 | WIRING SUBSTRATE, TAPE PACKAGE HAVING THE SAME, AND DISPLAY DEVICE HAVING THE SAME - A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. | 07-23-2009 |
| 20120018871 | STACK PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A stack package usable in a three-dimensional (3D) system-in-package (SIP) includes a first semiconductor chip, a second semiconductor chip, and a supporter. The first semiconductor chip includes a through silicon via (TSV), and the second semiconductor chip is stacked on the first semiconductor chip and is electrically connected to the first semiconductor chip through the TSV of the first semiconductor chip. The supporter is attached onto the first semiconductor chip so as to be spaced apart from an edge of the second semiconductor chip. | 01-26-2012 |
Jun-Ho Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090237340 | LIQUID CRYSTAL DISPLAY MODULE AND DISPLAY SYSTEM INCLUDING THE SAME - A liquid crystal display (LCD) module and a display system including the LCD module are provided. The LCD module includes a common-voltage adjustment unit which is enabled by interfacing with an external device and thus adjusts a common voltage; a signal control unit which outputs a first reverse signal that reverses the polarity of a voltage at intervals of at least two frames; and a data driving unit which reverses the polarity of an image data voltage with respect to the common voltage at intervals of at least two frames in response to the first reverse signal. | 09-24-2009 |
| 20100134401 | Liquid Crystal Display and Method of Driving the Same - A liquid crystal display (LCD) and a method of driving the LCD are provided. The LCD includes a display panel; and a timing controller providing a first data signal to the display panel during a first frame period, a second data signal to the display panel during a second frame period and a blank signal to the display panel during a blank period between the first and second frame periods, wherein the voltage of the blank signal varies among a plurality of levels between the voltage of the first data signal and the voltage of the second data signal. | 06-03-2010 |
| 20100254108 | DISPLAY DEVICE AND METHOD OF DRIVING THE SAME - A display device includes a display panel on which an image is displayed, and a driving board. The driving board includes a substrate, a first multi-layer ceramic condenser disposed on the substrate and to which a first current is supplied, and a second multi-layer ceramic condenser disposed substantially parallel with the first multi-layer ceramic condenser and to which a second current is supplied. The first current and the second current are supplied to the first multi-layer ceramic condenser and the second multi-layer ceramic condenser, respectively, in opposite directions. | 10-07-2010 |
Seong-Yong Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100265435 | DISPLAY APPARATUS HAVING VARIABLE DIFFUSER FILM - In a display apparatus according to an embodiment, a variable diffuser film is disposed between a backlight unit generating light and a display panel displaying an image. The variable diffuser film transmits or scatters the light from the backlight unit in response to an electrical signal to control a viewing angle. The variable diffuser film is disposed between the first and second transparent layers and includes a polymer layer in which liquid crystal molecules transmitting or scattering the light according to the electrical signal are dispersed. The polymer layer has a thickness of about 3 micrometers to about 15 micrometers, and the liquid crystal molecules have an anisotropic refractive index (Δn) of about 0.15 to about 0.25. In one aspect, the display apparatus may automatically switch a narrow viewing angle mode and a wide viewing angle mode, thereby reducing power consumption necessary to switch the narrow and wide viewing angle modes. | 10-21-2010 |
| 20110157913 | LIGHT GUIDE PLATE, DISPLAY APPARATUS HAVING THE SAME, AND METHOD OF MANUFACTURING THE SAME - A light guide plate includes an incident surface receiving incident light from a light source, an exit section that outputs exit light having a light distribution different from a light distribution of the incident light and a reflective section opposite to the exit section. A plurality of first patterns are formed on the exit section while being arranged in a first direction of the exit section to distribute the exit light with maximum brightness in a direction perpendicular to the exit section. A plurality of second patterns are formed on the reflective section to scatter the incident light. | 06-30-2011 |
Sun-Kyu Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100102427 | SEMICONDUCTOR PACKAGING DEVICE - A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups. | 04-29-2010 |
| 20110168761 | APPARATUS FOR REPAIRING SEMICONDUCTOR MODULE - An apparatus for repairing a semiconductor module including: a heating block comprising a thermal contact surface for contacting a defective semiconductor package mounted on a substrate of the semiconductor module to heat the defective semiconductor package using a conduction method and to melt a solder of the defective semiconductor package, and a vacuum adsorption line for adsorbing the defective semiconductor package and separating the defective semiconductor package from the substrate; and a heater installed in the heating block. | 07-14-2011 |
| 20110216516 | Semiconductor Module, Socket For The Same, And Semiconductor Module/Socket Assembly - A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board. | 09-08-2011 |
Yi-Sung Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20110103031 | PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE PACKAGE SUBSTRATE - A package substrate may include an insulating substrate, first circuit patterns, second circuit patterns and a test pattern. The first circuit patterns may be arranged on the insulating substrate. The second circuit patterns may be arranged on the insulating substrate. The second circuit patterns may be arranged between the first circuit patterns. The test pattern may be electrically connected between same polar terminals of the first circuit patterns and the second circuit patterns. Thus, electrical connections between the semiconductor chip and the circuit patterns may be tested before performing a process for cutting the package substrate. | 05-05-2011 |
Yong-Hyun Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20090168405 | BACKLIGHT ASSEMBLY AND DISPLAY DEVICE HAVING THE SAME - A backlight assembly and a liquid crystal device having the same are provided. The backlight assembly includes a lamp unit configured to generate light, a reflection sheet configured to reflect the light from the lamp unit and a receiving frame having at least one recess portion configured to fix the reflection sheet so that the reflection sheet can be fixed to the backlight assembly without using an adhesive. | 07-02-2009 |
Young-Jin Hwang, Asan-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20120107436 | SEMICONDUCTOR PACKAGE MOLDING SYSTEM AND MOLDING METHOD THEREOF - A semiconductor package molding system includes a press unit, a loading apparatus for loading the first member and the first resin member on the first press apparatus and the second member and the second resin member on the second press apparatus, an unloading apparatus which is adapted to unload a molded first mold from the first press apparatus and a molded second mold from the second press apparatus, and a control unit which is adapted to apply a control signal to the press unit, the loading apparatus, and the unloading apparatus. The press unit includes at least one first press apparatus which is adapted to press a first resin member against a first member to mold a first mold, and at least one second press apparatus which is adapted to press a second resin member against a second member to mold a second mold. | 05-03-2012 |