| Patent application number | Description | Published |
|---|
| 20090025195 | Method of manufacturing capacitor-embedded PCB - A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate. | 01-29-2009 |
| 20090049686 | Method of manufacturing component-embedded printed circuit board - A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first insulation layer stacked over a first metal layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers. | 02-26-2009 |
| 20090244864 | Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof - Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C). | 10-01-2009 |
| 20100097770 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Disclosed are a printed circuit board and a manufacturing method thereof. The manufacturing method of a printed circuit board includes: mounting an electronic device on an upper surface of an adhesive layer; laminating an insulator on an upper side of the electronic device and a lower side of the adhesive layer, respectively, such that the electronic device is buried; and forming a circuit pattern and a via on the insulator. | 04-22-2010 |
| 20110048780 | METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE - A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate. | 03-03-2011 |
| 20110099779 | Method of manufacturing capacitor-embedded PCB - A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate. | 05-05-2011 |
| 20110100689 | ELECTRONICS COMPONENT EMBEDDED PCB - An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line. | 05-05-2011 |
