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Hutto
Barrett Hutto, Santa Cruz, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090275960 | APPARATUS AND METHOD FOR GASTRIC REDUCTION - An apparatus and method for gastric reduction is provided comprising a tissue gathering assembly for applying a force to inner portions of a stomach to collapse the inner portions toward the tissue gathering assembly, and a suture assembly moveably mounted to the tissue gathering assembly for advancing a suture into the inner portions to form a gastric sleeve. The tissue gathering assembly may further comprise a vacuum shaft having sections of apertures, wherein each section transmits a vacuum force through the apertures to gather a part of the inner portions of the stomach to form a channel that connects an upper pouch to a lower pouch of the stomach. The suture assembly may further comprise a rotatable helical suture for fastening the gathered inner portions to secure the gastric sleeve. | 11-05-2009 |
Dwane Scott Hutto, Hermon, ME US
| Patent application number | Description | Published |
|---|---|---|
| 20100224336 | PROCESS OF BLEACHING A WOOD PULP - A process of bleaching a wood pulp includes contacting the pulp with ozone to delignify the pulp in an ozone bleaching stage. A phosphonate chelant is added to the pulp so that the chelant is present with the pulp during the bleaching stage. The process excludes washing of the pulp to remove chelant between the chelant addition and the bleaching stage. | 09-09-2010 |
Josh William Hutto, Kirkland, WA US
| Patent application number | Description | Published |
|---|---|---|
| 20080243697 | DIGITAL GAME DISTRIBUTION AND ROYALTY CALCULATION - Systems and methods of digitally distributing digital game content and tracking royalties for the digital game content may include a correlated title key, retail key, and license key. The a correlated title key, retail key, and license key may be used to generate a royalty rate. For example, a royalty rate may be generated based on the license key. Additionally, a royalty price may be generated based on the title key. Then, a royalty amount may be computed by multiplying the royalty rate and the royalty price. The royalty amount may be stored in a retailer account that corresponds to the retail key. | 10-02-2008 |
Kathy Hutto, Lagrange, GA US
| Patent application number | Description | Published |
|---|---|---|
| 20080229938 | Toddler Food Slicer - Disclosed is both an apparatus and method for slicing a toddler's food into small bite sized portions for reducing the chance of choking and increasing a toddler's ease of eating the food. The food slicer includes a frame which fits around the food to be reduced and cutting blades fitted within the frame. The food is reduced into small bite sized portions by pressing the food slicer into the food and then removed. The blades of the food slicer can cut the food into bite sized cubes or slices depending upon the configuration of the blades with the frame. | 09-25-2008 |
Kevin Hutto, Kuna, ID US
| Patent application number | Description | Published |
|---|---|---|
| 20120061786 | ISOLATED BOND PAD WITH CONDUCTIVE VIA INTERCONNECT - An integrated circuit for use, for example, in a backside illuminated imager device includes circuitry provided on a first side of a substrate, a first conductive pad connected to the circuitry and spaced from the first side of the substrate, a second conductive pad spaced from a second side of the substrate, an electrically conductive interconnect formed through the substrate to interconnect the first and second conductive pads, and a dielectric surrounding the second conductive pad and at least a portion of the interconnect. Methods of forming the integrated circuit are also described. | 03-15-2012 |
Kevin W. Hutto, Kuna, ID US
| Patent application number | Description | Published |
|---|---|---|
| 20080217763 | MICROELECTRONIC WORKPIECES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES USING SUCH WORKPIECES - Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces are disclosed. In one embodiment, a microelectronic assembly comprises a support member having a first side and a projection extending away from the first side. The assembly also includes a plurality of conductive traces at the first side of the support member. Some of the conductive traces include bond sites carried by the projection and having an outer surface at a first distance from the first side of the support member. The assembly further includes a protective coating deposited over the first side of the support member and at least a portion of the conductive traces. The protective coating has a major outer surface at a second distance from the first side of the support member. The second distance is approximately the same as the first distance such that the outer surface of the protective coating is generally co-planar with the outer surface of the bond sites carried by the projection. In several embodiments, a microelectronic die can be coupled to the corresponding bond sites carried by the projection in a flip-chip configuration. | 09-11-2008 |
| 20090007934 | SYSTEMS AND METHODS FOR EXPOSING SEMICONDUCTOR WORKPIECES TO VAPORS FOR THROUGH-HOLE CLEANING AND/OR OTHER PROCESSES - Systems and methods for exposing semiconductor workpieces to vapors for through-hole cleaning and/or other processes are disclosed. A representative method includes exposing a semiconductor workpiece to a vapor, with the semiconductor workpiece having an opening extending from a first surface of the workpiece through the workpiece to a second surface facing opposite from the first surface. The opening can include a contaminant, and the method can further include drawing the vapor and the contaminant through at least a portion of the opening and away from the second surface of the semiconductor workpiece. | 01-08-2009 |
| 20110212614 | MICROELECTRONIC WORKPIECES AND METHOD FOR MANUFACTURING MICROELECTRONIC DEVICES USING SUCH WORKPIECES - Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces are disclosed. In one embodiment, a microelectronic assembly comprises a support member having a first side and a projection extending away from the first side. The assembly also includes a plurality of conductive traces at the first side of the support member. Some of the conductive traces include bond sites carried by the projection and having an outer surface at a first distance from the first side of the support member. The assembly further includes a protective coating deposited over the first side of the support member and at least a portion of the conductive traces. The protective coating has a major outer surface at a second distance from the first side of the support member. The second distance is approximately the same as the first distance such that the outer surface of the protective coating is generally co-planar with the outer surface of the bond sites carried by the projection. In several embodiments, a microelectronic die can be coupled to the corresponding bond sites carried by the projection in a flip-chip configuration. | 09-01-2011 |