| Patent application number | Description | Published |
|---|
| 20090013929 | PLATING APPARATUS - A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material. | 01-15-2009 |
| 20090014031 | CLEANING APPARATUS - The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently. | 01-15-2009 |
| 20090025582 | SCREEN PRINTING METHOD FOR PRINTING A PRINTED CIRCUIT BOARD - An exemplary screen printing method for printing a printed circuit board is provided. The printed circuit board includes a number of parallel electrical traces. In the method, firstly, a screen printing stencil is disposed on a side of the printed circuit board having the electrical traces and a squeegee is disposed on the screen printing stencil. Secondly, the squeegee is drawn across the screen printing stencil in a manner such that an angle between a blade of the squeegee and the electrical traces is in a range from 20 degrees to 70 degrees so as to print an ink on the printed circuit board. The method can improve quality of the printed circuit board. | 01-29-2009 |
| 20090032290 | FLEXIBLE PRINTED CIRCUIT BOARD BASE FILM, FLEXIBLE LAMINATES AND FLEXIBLE PRINTED CIRCUIT BOARDS INCLUDING SAME - A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate. | 02-05-2009 |
| 20090039053 | METHOD FOR MANUFACTURING ELECTRICAL TRACES OF PRINTED CIRCUIT BOARDS - An exemplary method for manufacturing a printed circuit board is provided. Firstly, a copper clad substrate comprising a base film, a copper layer and intermediate layer interposed between the base film and the copper layer is provided. The intermediate layer is comprised of nickel, chromium, or alloy of nickel and chromium. A patterned photoresist layer is formed on the copper layer with portions of the copper layer are exposed from the photoresist pattern layer. Exposed portions of the copper layer are removed using a copper etchant to form a number of electrical traces, thereby exposing portions of the intermediate layer from the patterned photoresist layer. Exposed portions of the intermediate layer are removed using a chromium-nickel etchant. The method can prevent a bottom of each of electrical traces from enlarging, thereby improving quality of printed circuit board. | 02-12-2009 |
| 20090047421 | METHOD FOR PLATING FLEXIBLE PRINTED CIRCUIT BOARD - A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board. | 02-19-2009 |
| 20090050600 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS - An exemplary method for manufacturing printed circuit boards is provided. In the method, a copper clad substrate having a copper layer thereon is provided. A surface of the copper layer is roughened by applying an atmospheric pressure plasma thereto. A photoresist layer is formed on the roughened surface of the copper layer. The photoresist layer is exposed. The photoresist layer is developed to form a patterned photoresist layer, thereby exposing portions of the copper layer. The exposed portions of the copper layer exposed are removed so that the remaining portions of the copper layer form electrical traces. The patterned photoresist layer is removed. | 02-26-2009 |
| 20090056624 | FLUID CIRCULATING SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARD - An exemplary fluid circulating system includes a return pipe, a reservoir, a suction pipe, a supply pipe, a circulating pump, and a processing device. The reservoir is configured for containing a work fluid. The processing device is configured for processing a semi-finished printed circuit board using the work fluid. The circulating pump is configured for transferring the work fluid from the reservoir to the processing device. The suction pipe and the supply pipe are respectively coupled to an inlet and the outlet of the circulating pump. An inner diameter of the suction pipe is larger than that of the supply pipe. The return pipe is coupled to the processing device for delivering the work fluid from the processing device to the reservoir. The fluid circulating system can improve quality of the circulated work fluid. | 03-05-2009 |
| 20090139086 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - The present invention relates to a method for manufacturing printed circuit boards. A substrate including a base and two conductive layers on two opposite surfaces of the base is provided. A through-hole passing through the base and the conductive layers is defined in the substrate. A metal layer is formed on the substrate. The metal layer has a first portion on an outer surface of the substrate and a second portion on an inner surface in the through-hole thereof. A protecting material is applied onto the metal layer in the through-hole, an unwanted section of the first portion of the metal layer is removed. Electrical traces in each of the conductive layers are formed. | 06-04-2009 |
| 20100003784 | METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD - A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed. | 01-07-2010 |
| 20100035187 | METHOD FOR SMOOTHING PRINTED CIRCUIT BOARDS - A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface. | 02-11-2010 |
| 20100038116 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure. | 02-18-2010 |
| 20100044237 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS - A method for manufacturing a PCB is related. The method includes providing a substrate with two opposite conductive layers and defining a through hole passing through the two conductive layers; forming a first electrically conductive metal layer on an inner surface of the substrate in the through hole using an electro-less plating process; forming a second electrically conductive metal layer on the first electrically conductive metal layer using an electro-plating process till the through hole being filled. | 02-25-2010 |
| 20100051331 | CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME - A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface. | 03-04-2010 |
| 20100051332 | CIRCUIT SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE ASSEMBLY HAVING SAME - A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer. | 03-04-2010 |
