| Patent application number | Description | Published |
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| 20090115313 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF - A light emitting device and a fabricating method thereof are described. The light emitting device includes a substrate, a light emitting chip, a tubular structure, and a fluorescent conversion layer. The tubular structure is formed on a surface of the substrate. The light emitting chip is disposed on the surface of the substrate and is surrounded by the tubular structure. The fluorescent conversion layer is disposed in the tubular structure and covers the light emitting chip. A ratio of a maximal vertical thickness and a maximal horizontal thickness of the fluorescent conversion layer at the light emitting chip is between 0.1 and 10. A distance for the light ray to pass through the fluorescent conversion layer is controlled by using the tubular structure, so as to solve a problem of the conventional art that fluorescent powder coating package technique results in non-uniform color temperature of the emitted light. | 05-07-2009 |
| 20090230417 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier. | 09-17-2009 |
| 20090267102 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier. | 10-29-2009 |
| 20090290273 | LIGHT-EMITTING DIODE PACKAGE HAVING ELECTROSTATIC DISCHARGE PROTECTION FUNCTION AND METHOD OF FABRICATING THE SAME - A light-emitting diode (LED) package having electrostatic discharge (ESD) protection function and a method of fabricating the same adopt a composite substrate to prepare an embedded diode and an LED, and use an insulating layer in the composite substrate to isolate some individual embedded diodes, such that the LED device has the ESD protection. | 11-26-2009 |
| 20100072487 | LIGHT EMITTING DIODE, PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light emitting diode (LED), a fabricating method thereof, and a package structure thereof are provided. The LED includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a current distribution modifying pattern, a first electrode and a second electrode. The active layer and the second semiconductor layer form a mesa structure and expose a part of the first semiconductor layer. The current distribution modifying pattern is disposed on the second semiconductor layer. The first electrode is disposed on and electrically connected to the first semiconductor layer exposed by the mesa structure. The second electrode is disposed on the current distribution modifying pattern and is electrically connected to the second semiconductor layer. The LED has superior light emitting efficiency. | 03-25-2010 |
| 20100072920 | DRIVE SYSTEM FOR ILLUMINATION DEVICE - A drive system for an illumination device includes a plurality of LEDs; an extra load; an illumination setting unit, for providing an illumination parameter such as a work cycle; a power supply unit, for providing a DC current; a microprocessor, for receiving the illumination parameter and generating a plurality of drive signals and a compensation signal according to the received illumination parameter; a plurality of first drive units, for driving the LEDs to receive the DC current in the high-level cycle for illumination; and a second drive unit, for receiving the compensation signal and outputting the DC current to the extra load according to the compensation signal. | 03-25-2010 |
| 20100084958 | LED Structure, Manufacturing Method Thereof and LED Module - A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED. | 04-08-2010 |
| 20100193809 | LIGHT EMITTING DIODE STRUCTURE, LED PACKAGING STRUCTURE USING THE SAME AND METHOD OF FORMING THE SAME - A light emitting diode (LED) structure, a LED packaging structure, and a method of forming LED structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure. | 08-05-2010 |
| 20100213479 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space. | 08-26-2010 |
| 20110074847 | INK JET PRINTHEAD MODULE AND INK JET PRINTER - An ink jet printhead module adapted for use in a printing apparatus, the ink jet printhead module being capable of receiving address signals and chip selection signals from a printhead drive unit of the printing apparatus. The printhead module includes chip control circuits, each being capable of receiving the address signals and receiving a corresponding one of the chip selection signals. Each chip control circuit includes switching circuits and an ink jetting circuit set. Each switching circuit is capable of receiving a corresponding one of the address signals and the corresponding one of chip selection signals and outputting a switching signal. An ink jetting circuit set includes ink jetting circuits, each being capable of receiving the switching signal from the corresponding switching circuit electrically coupled to the ink jetting circuit and determining whether or not to jet out ink based on the received switching signal. | 03-31-2011 |
| 20110092002 | METHOD FOR FABRICATING A LIGHT EMITTING DIODE PACKAGE STRUCTURE - The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess. | 04-21-2011 |
| 20110133229 | Light Emitting Diode Structure, LED Packaging Structure Using the Same and Method of Forming the Same - A light emitting diode (LED) structure and a LED packaging structure are disclosed. The LED structure includes a sub-mount, a stacked structure, an electrode, an isolation layer and a conductive thin film layer. The sub-mount has a first surface and a second surface opposite the first surface. The stacked structure has a first semiconductor layer, an active layer and a second semiconductor layer that are laminated on the first surface. The electrode is disposed apart from the stacked structure on the first surface. The isolation layer is disposed on the first surface to surround the stacked structure as well as cover the lateral sides of the active layer. The conductive thin film layer connects the electrode to the stacked structure and covers the stacked structure. | 06-09-2011 |
