Patent application number | Description | Published |
20080229161 | MEMORY PRODUCTS AND MANUFACTURING METHODS THEREOF - Memory products and manufacturing methods thereof. A memory product comprises at least one memory cell and at least one redundancy memory cell. The memory cell and the redundancy memory cell have different physical or electronic properties. The redundancy memory cells are used as repair schemes for the memory cell if the memory cell is determined to have experienced Vccmin failure. | 09-18-2008 |
20100259999 | KEEPERS, INTEGRATED CIRCUITS, AND SYSTEMS THEREOF - A keeper of an integrated circuit includes a first transistor having a first gate being coupled with an output end of an inverter. A second transistor is coupled with the first transistor in series. The second transistor has a second gate being coupled with an input end of the inverter. | 10-14-2010 |
20110063894 | SRAM CELLS, MEMORY CIRCUITS, SYSTEMS, AND FABRICATION METHODS THEREOF - A static random access memory (SRAM) cell includes a pair of cross-coupled inverters having a first node and a second node. A first transistor is coupled between the first node and a first bit line. A second transistor is coupled between the second node and a second bit line. A third transistor is coupled with the first node. The third transistor has a threshold voltage that is higher than that of a fourth transistor of the pair of cross-coupled inverters by about 10% or more. A fifth transistor is coupled between the third transistor and a third bit line | 03-17-2011 |
20120020176 | GENERATING AND AMPLIFYING DIFFERENTIAL SIGNALS - Some embodiments regard a circuit comprising: a first left transistor having a first left drain, a first left gate, and a first left source; a second left transistor having a second left drain, a second left gate, and a second left source; a third left transistor having a third left drain, a third left gate, and a third left source; a first right transistor having a first right drain, a first right gate, and a first right source; a second right transistor having a second right drain, a second right gate, and a second right source; a third right transistor having a third right drain, a third right gate, and a third right source; a left node electrically coupling the first left drain, the second left drain, the second left gate, the third right gate, and the third left drain; and a right node electrically coupling the first right drain, the second right drain, the second right gate, the third left gate, and the third right drain. | 01-26-2012 |
20120206953 | MEMORY EDGE CELL - A circuit comprises a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, a third NMOS transistor, and a fourth NMOS transistor. The PMOS transistors and the NMOS transistors are configured to provide a first voltage reference node having a first reference voltage and a second voltage reference node having a second reference voltage. The first reference voltage and the second reference voltage serve as a first reference voltage and a second reference voltage for a memory cell, respectively. | 08-16-2012 |
20120327704 | SEMICONDUCTOR MEMORIES - A semiconductor memory includes a bit cell having first and inverters forming a latch. First and second transistors are respectively coupled to first and second storage nodes of the latch and to first and second write bit lines. Each of the first and second transistors has a respective gate coupled to a first node. Third and fourth transistors are coupled together in series at the first node and are disposed between a write word line and a first voltage source. Each of the first and second transistors has a respective gate coupled to a first control line. A fifth transistor has a source coupled to a second voltage source, a drain coupled to at least one of the inverters of the latch, and a gate coupled to the first node. A read port is coupled to a first read bit line and to the second storage node of the latch. | 12-27-2012 |
20130003445 | SRAM CELLS, MEMORY CIRCUITS, SYSTEMS, AND FABRICATION METHODS THEREOF - A static random access memory (SRAM) cell includes a pair of cross-coupled inverters having a first node and a second node. A first transistor is coupled between the first node and a first bit line. A second transistor is coupled between the second node and a second bit line. A third transistor is coupled with the first node. The third transistor has a threshold voltage that is higher than that of a fourth transistor of the pair of cross-coupled inverters by about 10% or more. A fifth transistor is coupled between the third transistor and a third bit line | 01-03-2013 |
20130010560 | GENERATING AND AMPLIFYING DIFFERENTIAL SIGNALS - A circuit includes a first node, a second node, a first current mirror circuit, and a second current minor circuit. The first current mirror circuit has a reference end and a mirrored end. The reference end of the first current minor circuit is coupled to the first node, and the mirrored end of the first current minor circuit is coupled to the second node. The second current minor circuit has a reference end and a mirrored end. The reference end of the second current minor circuit is coupled to the second node, and the mirrored end of the second current minor circuit is coupled to the first node. | 01-10-2013 |
20130188433 | MEMORY CIRCUIT AND METHOD OF WRITING DATUM TO MEMORY CIRCUIT - A circuit includes a first node, a second node, a memory cell, a first data line, a second data line, and a write driver. The memory cell is coupled to the first node and the second node and powered by a first voltage at the first node and a second voltage at the second node. The first data line and the second data line are coupled to the memory cell. The write driver has a third node carrying a third voltage less than the first voltage during a write operation. The write deriver is coupled to the first data line and the second data line and configured to, during a write operation, selectively coupling one of the first data line and the second data line to the third node and coupling the other one of the first data line and the second data line to the first node. | 07-25-2013 |
20130242644 | MEMORY CELL AND MEMORY ARRAY - A memory cell includes a first, second, and third columns of devices. The first column of devices includes a first pull-down transistor, a second pull-down transistor, a first switch, and a second switch. The second column of devices includes a third pull-down transistor, a fourth pull-down transistor, a third switch, and a fourth switch. The third column of devices includes a first pull-up transistor, and a second pull-up transistor. The first pull-up transistor, the first pull-down transistor, and the third pull-down transistor are connected as a first inverter, and the second pull-up transistor, the second pull-down transistor, and the fourth pull-down transistor are connected as a second inverter. The first inverter and the second inverter are cross-coupled. The first switch, the second switch, the third switch, and the fourth switch are coupled with output terminals of the first and second inverters. | 09-19-2013 |
20130263065 | PRE-COLORED METHODOLOGY OF MULTIPLE PATTERNING - Some embodiments relate to a method for pre-coloring data within an integrated chip layout to avoid overlay errors that result from mask misalignment during multiple patterning lithography. The method may be performed by generating a graphical IC layout file containing an integrated chip layout having a plurality of IC shapes. The IC shapes within the graphical IC layout file are assigned a color during decomposition. The IC shapes are further pre-colored in a manner that deliberately assigns the pre-colored data to a same mask. During mask building data associated with IC shapes that have been pre-colored is automatically sent to a same mask, regardless of the colors that are assigned to the shapes. Therefore, the pre-colored shapes are not assigned to a masked based upon a decomposition, but rather based upon the pre-coloring. By assigning IC shapes to a same mask through pre-coloring, overlay errors can be reduced. | 10-03-2013 |
20130263066 | Pre-Colored Methodology of Multiple Patterning - Some embodiments relate to a method of pre-coloring word lines and control lines within an SRAM integrated chip design to avoid timing delays that result from processing variations introduced through multiple patterning lithography processes. The method is performed by generating a graphical IC layout file having an SRAM circuit with a plurality of word lines and Y-control lines. The word lines and Y-control lines are assigned a color during decomposition. The word lines and Y-control lines are further pre-colored in a manner that deliberately assigns the pre-colored data to a same mask. Therefore, during mask building, data associated with pre-colored word and Y-control lines is sent to a same mask, regardless of the colors that are assigned to the data. By assigning word and Y-control lines to a same mask through pre-coloring, processing variations between the word and Y-control lines are minimized, thereby mitigating timing variations in an SRAM circuit. | 10-03-2013 |
20140201692 | PRE-COLORED METHODOLOGY OF MULTIPLE PATTERNING - Some embodiments relate to a system that pre-colors word lines and control lines within a memory cell to avoid timing delays that result from processing variations introduced through multiple patterning lithography processes. The system has a memory element that stores a graphical IC layout with a memory circuit having layout features including a plurality of word lines and a plurality of Y-control lines. A pre-coloring element pre-colors one or more of the plurality of word lines and Y-control lines, to indicate that pre-colored word lines and Y-control lines are to be formed on a same mask of a multiple mask set used for a multiple patterning lithography process. A decomposition element assigns different colors to uncolored layout features of the memory circuit, to indicate that different colored memory features are to be formed on different masks of the multiple mask set. | 07-17-2014 |
Patent application number | Description | Published |
20100157692 | Distributed VDC for SRAM Memory - An integrated circuit structure includes a memory. The memory includes a first memory macro and a second memory macro identical to the first memory macro. A first power block is connected to the first memory macro and is configured to provide a regulated voltage to the first memory macro. The first power block has a first input and a first output. A second power block substantially identical to the first power block is connected to the second memory macro and is configured to provide the regulated voltage to the second memory macro. The second power block has a second input and a second output. The first input and the second input are interconnected. The first output and the second output are interconnected. | 06-24-2010 |
20100254209 | Ultra-Low Leakage Memory Architecture - An integrated circuit structure includes an active power supply line and a data-retention power supply line. A memory macro is connected to the active power supply line and the data-retention power supply line. The memory macro includes a memory cell array and a switch. The switch is configured to switch a connection between connecting the memory cell array to the active power supply line and connecting the memory cell array to the data-retention power supply line. The data-retention power supply line is outside of the memory macro. | 10-07-2010 |
20120092944 | MEMORY DEVICE HAVING A CLOCK SKEW GENERATOR - A memory device is provided with memory components and a clock skew generator, supporting at least two read and write operations that can occur coincidentally in read-read, read-write and write-write modes of operation of the memory device. The clock skew generator produces at least two stable and balanced clock channels carrying the at least two clock signals and varies relative timing of the clock signal edges so as to displace the edges in time, in those modes of operation wherein simultaneous edges would lead to detrimental loading. | 04-19-2012 |
20120181707 | Distributed Metal Routing - A system and method for a distributed metal routing is disclosed. An embodiment comprises a metal_0 layer with a metal_1 layer overlying the metal_0 layer. The metal_1 layer comprises separate parallel lines, with lines having different signals being distributed across the metal_1 layer. Such a layout decreases the parasitic resistance within the metal_0 layer as it decreases the distance current travels. Additionally, the distributed layout in metal_1 allows connections to be made to a metal_2 layer without the need for a hammer head connection of vias. | 07-19-2012 |
20120182792 | BIASING CIRCUIT AND TECHNIQUE FOR SRAM DATA RETENTION - A SRAM system includes: a SRAM cell array coupled between high and low supply nodes, a difference therebetween defining a data retention voltage (VDR) for a low power data retention mode; a main power switch coupling one of high and low supply nodes to a main power supply and disconnecting the one high and low supply nodes from the main power supply during the low power data retention mode; a monitor cell including a SRAM cell preloaded with a data bit and configured for data destruction responsive to a reduction in VDR before data destruction occurs in the SRAM cell array; and a clamping power switch responsive to data destruction in the monitor cell to couple the one of the high and low supply nodes to the main power supply. | 07-19-2012 |
20120195105 | SRAM BIT CELL - A semiconductor memory bit cell includes an inverter latch including a pair of cross-coupled inverters. A first transistor has a gate coupled to a first control line and a source coupled to the inverter latch, and a second transistor has a gate coupled to a second control line and a drain coupled to the drain of the first transistor at a first node. A third transistor has a source coupled to the first node and a gate coupled to a word line, and a fourth transistor has a gate coupled to a source of the second transistor and to the inverter latch. A fifth transistor has a gate coupled to the word line and a drain coupled to a read bit line. | 08-02-2012 |
20120230127 | Providing Row Redundancy to Solve Vertical Twin Bit Failures - A circuit includes a failure address register configured to store a first row address, a row address modifier coupled to the failure address register, wherein the row address modifier is configured to modify the first row address received from the failure address register to generate a second row address. A first comparator is configured to receive and compare the first row address and a third row address. A second comparator is configured to receive and compare the second row address and the third row address. The first and the second row addresses are failed row addresses in a memory. | 09-13-2012 |
20120230158 | Timing Skew Characterization Apparatus and Method - A timing skew characterization apparatus comprises a coarse timing skew characterization circuit, a fine timing skew characterization circuit and a coarse delay cell calibration circuit. The coarse timing skew characterization circuit comprises a plurality of coarse delay cells whose delays can be calibrated through the coarse delay cell calibration circuit. The calibration of fine delay cells can be implemented through a trail and error process. Both coarse delay step and fine delay step can be characterized through a single measurement setup. As a result, the timing skew characterization apparatus provides a high resolution setup and hold time measurement. | 09-13-2012 |
20120258592 | Layouts of POLY Cut Openings Overlapping Active Regions - A method of forming integrated circuits includes forming a mask layer over a gate electrode line, wherein the gate electrode line is over a well region of a semiconductor substrate; forming an opening in the mask layer, wherein a portion of the gate electrode line and a well pickup region of the well region are exposed through the opening; and removing the portion of the gate electrode line through the opening. | 10-11-2012 |
20120313177 | Multiple Finger Structure - A multiple finger structure comprises a plurality of active regions placed between a pair of dummy POLY lines. The active regions comprise a plurality of multiple fingered NMOS transistors, which are part of a sense amplifier of an SRAM memory circuit. The drain and source of each multiple fingered NMOS transistor have an SiP/SiC epitaxial growth region. The active regions extend and overlap with the dummy POLY lines. The overlap between the active regions and the dummy POLY lines helps to reduce edge imperfection at the edge of the active regions. | 12-13-2012 |
20120327730 | SRAM Differential Voltage Sensing Apparatus - An SRAM differential voltage sensing apparatus is coupled to a memory circuit. The memory circuit comprises a memory bank, a plurality of bit lines, a plurality of data lines coupled to the plurality of bit lines via a plurality of transmission gates and a sense amplifier. When the sense amplifier operates in a characterization mode, the transmission gates and pre-charge circuits are turned off. The differential voltage sensing apparatus applies a characterization signal to the sense amplifier and obtains the parameters of the memory circuit through a trial and error process. | 12-27-2012 |
20150069994 | Timing Skew Characterization Apparatus and Method - A device comprises a coarse timing skew characterization circuit having a buffer chain and a coarse delay cell calibration circuit comprising a first flip-flop, a second flip-flop and a logic gate, wherein the coarse delay cell calibration circuit is configured to measure a delay between an input of the buffer chain and an output of the buffer chain. | 03-12-2015 |
Patent application number | Description | Published |
20080258813 | Sense Amplifiers Operated Under Hamming Distance Methodology - A semiconductor device includes a first sense amplifier coupled to an input for generating a first output; a second sense amplifier couple to the input for generating a second output; and a third sense amplifier coupled to the input for generating a third output, wherein a fourth output amplifying the input is generated based on combinations of logic states of the first, second and third outputs. | 10-23-2008 |
20090109768 | SRAM Device with Enhanced Read/Write Operations - An SRAM device includes: a first group of memory cells connected to a first local bit line and a first local complementary bit line for accessing data nodes thereof; a second group of memory cells connected to a second local bit line and a second local complementary bit line for accessing data nodes thereof; and a global bit line and a global complementary bit line connected to the first and second local bit lines for accessing data nodes of the first and second groups of memory cells, wherein the first local bit line, the first local complementary bit line, the second local bit line, the second local complementary bit line, the global bit line and the global complementary bit line are constructed on a same metallization level in the SRAM device. | 04-30-2009 |
20090268501 | Novel SRAM Cell Array Structure - This invention discloses a static random access memory (SRAM) cell array structure which comprises a first and second bit-line coupled to a column of SRAM cells, the first and second bit-lines being substantially parallel to each other and formed by a first metal layer, and a first conductive line being placed between the first and second bit-lines and spanning across the column of SRAM cells without making conductive coupling thereto, the first conductive line being also formed by the first metal layer. | 10-29-2009 |
20090290446 | Memory Word-line Tracking Scheme - A word-line tracking system for a memory array having a plurality of memory cells, the word-line tracking system comprises a dummy row having substantially identical structure as one or more regular rows of the memory cells, the dummy row including a dummy word-line having a first and a second end at the opposite longitudinal ends of the dummy word-line, the first end being connected to a word-line driver, a self timing generator configured to receive a clock signal and generate a pulse signal in sync with the clock signal for the dummy word-line driver, the self timing generator having a first terminal for receiving a feedback signal to determine the falling edge of the pulse signal, a voltage-to-current converter connected to the second end of the dummy word-line, a current-to-voltage converter connected to the feedback terminal, and a wire connecting the voltage-to-current converter to the current-to-voltage converter. | 11-26-2009 |
20100080045 | ROBUST 8T SRAM CELL - This invention discloses a static random access memory (SRAM) cell which comprises a pair of cross-coupled inverters having a first storage node, a first NMOS transistor having a source and a drain connected between the first storage node and a bit-line, a second NMOS transistor having a source and a drain connected between a gate of the first NMOS transistor and a word-line, the second NMOS transistor having a gate connected to a first column select line, and a third NMOS transistor having a source and a drain connected between a ground (VSS) and the gate of the first NMOS transistor, and a gate connected to a second column select line, the second column select line being complementary to the first column select line. | 04-01-2010 |
20100124099 | 8T LOW LEAKAGE SRAM CELL - This invention discloses a static random access memory (SRAM) cell comprising a pair of cross-coupled inverters having a storage node, and a NMOS transistor having a gate terminal, a first and a second source/drain terminal connected to the storage node, a read word-line (RWL) and a read bit-line (RBL), respectively, the RWL and RBL being activated during a read operation and not being activated during any write operation. | 05-20-2010 |
20110157963 | SRAM WORD-LINE COUPLING NOISE RESTRICTION - A DC mode word-line coupling noise restriction circuit for multiple-port Random Access Memory cells. This circuit may comprise a Static Random Access Memory array. The SRAM array contains a plurality of columns and a plurality of rows with an SRAM cell formed at a cross-point of the columns and rows. Each SRAM cell has a first word-line conductor and a second word-line conductor. The first word-line conductor is connected to a first coupling noise restriction circuit. The first coupling noise restriction circuit comprises an inverter and a NMOSFET. The inverter has another NMOSFET and a PMOSFET. | 06-30-2011 |
20110194362 | WORD-LINE DRIVER USING LEVEL SHIFTER AT LOCAL CONTROL CIRCUIT - A representative circuit device includes a local control circuit having a level shifter, wherein in response to receipt of a first address signal the level shifter shifts the first address signal from a first voltage level to a second voltage level, providing a level shifted first address signal; and a word-line driver having at least one input for receiving a plurality of address signals, wherein the at least one input includes a first input that is coupled to the local control circuit to receive the level shifted first address signal, and an output that is electrically coupled to a word line of a memory cell array. | 08-11-2011 |
20130094307 | BIT LINE VOLTAGE BIAS FOR LOW POWER MEMORY DESIGN - In a digital memory with an array of bit cells coupled to word lines and bit lines, each bit cell having cross coupled inverters isolated from bit lines by passing gate transistors until addressed, some or all of the bit cells are switchable between a sleep mode and a standby mode in response to a control signal. A bit line bias circuit controls the voltage at which the bit lines are caused to float when in the sleep mode. A pull-up transistor for each bit line BL or BLB in a complementary pair has a conductive channel coupled to a positive supply voltage and a gate coupled to the other bit line in the pair, BLB or BL, respectively. A connecting transistor also can be coupled between the bit lines of the complementary pair, bringing the floating bit lines to the supply voltage less a difference voltage ΔV. | 04-18-2013 |
20130201776 | BUILT-IN TEST CIRCUIT AND METHOD - A method of testing a semiconductor memory includes performing a first test of a first type prior to packaging the semiconductor memory. The first test of the first type includes generating a first plurality of addresses, decoding the first plurality of addresses to generate a second plurality of decoded addresses at a first decoder, and activating one of a plurality of rows or a plurality of columns of the semiconductor memory based on the second plurality of decoded addresses. The semiconductor memory is packaged after performing the first test of the first type. | 08-08-2013 |
20130258747 | METHOD AND APPARATUS FOR READ ASSIST TO COMPENSATE FOR WEAK BIT - A memory assist apparatus includes a detection circuit and a compensation circuit. The detection circuit is configured to provide a detection signal indicating whether a bit line configured to provide read access to a data bit stored at a memory bit cell has a voltage below a predetermined threshold. The compensation circuit is configured to pull down the voltage of the bit line if the detection signal indicates that the voltage of the bit line is below the predetermined threshold. | 10-03-2013 |
20140022852 | DATA INVERSION FOR DUAL-PORT MEMORY - A semiconductor memory includes first and second memory storage latches each including first and second ports. A first pair of bit lines is coupled to the first ports, and a second pair of bit lines is coupled to the second ports. The first and second pairs of bit lines are twisted between the first and second memory storage latches. A first sense amplifier is coupled to the first pair of bit lines for outputting data, and a second sense amplifier is coupled to the second pair of bit lines for outputting an intermediate data signal. Output logic circuitry is coupled to an output of the second sense amplifier and is configured to output data based on the intermediate data signal and a control signal that identifies if the data is being read from the first memory storage latch or from the second memory storage latch. | 01-23-2014 |
20140068531 | PRE-COLORED METHODOLOGY OF MULTIPLE PATTERNING - Some embodiments relate to a method for pre-coloring data within an integrated chip layout to avoid overlay errors that result from mask misalignment during multiple patterning lithography. The method may be performed by generating a graphical IC layout file containing an integrated chip layout having a plurality of IC shapes. The IC shapes within the graphical IC layout file are assigned a color during decomposition. The IC shapes are further pre-colored in a manner that deliberately assigns the pre-colored data to a same mask. During mask building data associated with IC shapes that have been pre-colored is automatically sent to a same mask, regardless of the colors that are assigned to the shapes. Therefore, the pre-colored shapes are not assigned to a masked based upon a decomposition, but rather based upon the pre-coloring. By assigning IC shapes to a same mask through pre-coloring, overlay errors can be reduced. | 03-06-2014 |
20140073124 | EDGE DEVICES LAYOUT FOR IMPROVED PERFORMANCE - A method includes forming a first plurality of fingers over an active area of a semiconductor substrate. Each of the first plurality of fingers has a respective length that extends in a direction that is parallel to width direction of the active area. The first plurality of fingers form at least one gate of at least one transistor having a source and a drain formed by a portion of the active area. A first dummy polysilicon structure is formed over a portion of the active area between an outer one of the first plurality of fingers and a first edge of the semiconductor substrate. A second dummy polysilicon structure is over the semiconductor substrate between the first dummy polysilicon structure and the first edge of the semiconductor substrate. | 03-13-2014 |
20140119101 | WORDLINE TRACKING FOR BOOSTED-WORDLINE TIMING SCHEME - Some aspects of the present disclosure a method. In this method, a wordline voltage is provided to a wordline, which is coupled to a plurality of memory cells. A boost enable signal is provided. The state of the boost enable signal is indicative of whether the wordline voltage at a predetermined position on the wordline has reached a non-zero, predetermined wordline voltage. The wordline voltage is selectively boosted to a boosted wordline voltage level based on the boost enable signal. | 05-01-2014 |
20140133219 | Power Line Lowering for Write Assisted Control Scheme - Some embodiments of the present disclosure relate to a memory array having a cell voltage generator configured to provide a cell voltage header to a plurality of memory cells. The cell voltage generator is connected to the memory cells by way of supply voltage line and controls a supply voltage of the memory cells. The cell voltage generator has a pull-down element coupled between a control node of the supply voltage line and a ground terminal, and a one or more pull-up elements connected in parallel between the control node and a cell voltage source. A control unit is configured to provide one or more variable valued pull-up enable signals to input nodes of the pull-up elements. The variable valued pull-up enable signals operate the pull-up elements to selectively connect the supply voltage line from the cell voltage source to provide a cell voltage header with a high slew rate. | 05-15-2014 |
20140211578 | BOOSTED READ WRITE WORD LINE - One or more techniques or systems for boosting a read word line (RWL) or a write word line (WWL) of a two port synchronous random access memory (SRAM) bit cell array are provided herein. In some embodiments, a boosted control block is configured to generate a boosted word line signal configured to operate a RWL, a WWL, or a read write word line (RWWL). In some embodiments, the boosted word line signal includes a first stage and a second stage. For example, the first stage is associated with a first stage voltage level at a positive supply voltage (Vdd) voltage level and the second stage is associated with a second stage voltage level above the Vdd voltage level. In this manner, a read or write operation is boosted for an SRAM bit cell, because the second stage boosts a corresponding transistor in the SRAM bit cell, for example. | 07-31-2014 |