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Hung-Der Su

Hung-Der Su, Luju Township TW

Patent application numberDescriptionPublished
20090117696Fully logic process compatible non-volatile memory cell with a high coupling ratio and process of making the same - A fully logic process compatible non-volatile memory cell has a well on a substrate, a pair of source and drain outside the well, a channel between the source and drain, a control gate in the well, and a floating gate having a first portion above the channel, and a second portion above the well. The control gate includes two regions having opposite conductivity types and a third region between the two regions and under the second portion of the floating gate, and thus eliminates the parasitic depletion capacitor in the coupling path of the cell, thereby improving the coupling ratio.05-07-2009
20090201078Single-chip common-drain JFET device and its applications - A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.08-13-2009
20090201079Single-chip common-drain JFET device and its applications - A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.08-13-2009
20090206921Single-chip common-drain JFET device and its applications - A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.08-20-2009
20090206922Single-chip common-drain JFET device and its applications - A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.08-20-2009
20090237062Single-chip common-drain JFET device and its applications - A single-chip common-drain JFET device comprises a drain, two gates and two source arranged such that two common-drain JFETs are formed therewith. Due to the two JFETs merged within a single chip, no wire bonding connection is needed therebetween, thereby without parasitic inductance and resistance caused by bonding wire, and therefore improving the performance and reducing the package cost. The single-chip common-drain JFET device may be applied in buck converter, boost converter, inverting converter, switch, and two-step DC-to-DC converter to improve their performance and efficiency. Alternative single-chip common-drain JFET devices are also provided for current sense or proportional current generation.09-24-2009

Patent applications by Hung-Der Su, Luju Township TW

Hung-Der Su, Jhudong Township TW

Patent application numberDescriptionPublished
20080211581Amplifier circuit with internal zeros - An amplifier circuit with internal zeros provides a second pole in addition to a first pole and two zeros such that the second pole can prevent excessive gain at high frequency, so as to have high-frequency noise under control.09-04-2008
20090042395Spacer process for CMOS fabrication with bipolar transistor leakage prevention - A two-step spacer etch is used for the formation of a spacer in CMOS fabrication. A dry etch is first applied to remove part of the spacer material on the silicon substrate and leave a thin layer of the spacer material remained on the silicon substrate. Then, a wet etch is applied to completely remove the thin layer of the spacer material on the silicon substrate. The wet etch has good etch selectivity between the spacer material and silicon, and thus will not damage the surface of the silicon substrate when the spacer is formed. Therefore, the BJT on the silicon substrate is prevented from junction leakage.02-12-2009
20090066399Level shift circuit - A level shift circuit includes an input stage and an output stage coupled to each other by two nodes. The input stage changes the voltages on the nodes according to an input signal, and the output stage determines an output signal according to the voltages on the two nodes. In a transition state, the input stage provides a large current to charge or discharge the first node or the second node so as to quickly change the voltage thereon. In a steady state, the input stage lowers the current so as to reduce power consumption.03-12-2009

Hung-Der Su, Zhudong Township TW

Patent application numberDescriptionPublished
20110220997LDMOS Device Having Increased Punch-Through Voltage and Method For Making Same - The present invention discloses an LDMOS device having an increased punch-through voltage and a method for making same. The LDMOS device includes: a substrate; a well of a first conductive type formed in the substrate; an isolation region formed in the substrate; a body region of a second conductive type in the well; a source in the body region; a drain in the well; a gate structure on the substrate; and a first conductive type dopant region beneath the body region, for increasing a punch-through voltage.09-15-2011

Hung-Der Su, Pingzhen City TW

Patent application numberDescriptionPublished
20120181653SEMICONDUCTOR PN JUNCTION STRUCTURE AND MANUFACTURING METHOD THEREOF - The present invention discloses a semiconductor PN junction structure and a manufacturing method thereof. From top view, the PN junction includes a staggered comb-teeth structure. The PN junction forms a depletion region with enhanced breakdown voltage, hence broadening the applications of a semiconductor device having such PN junction.07-19-2012

Hung-Der Su US

Patent application numberDescriptionPublished
20120187483Double diffused metal oxide semiconductor device and manufacturing method thereof - The present invention discloses a double diffused metal oxide semiconductor (DMOS) device and a manufacturing method thereof. The DMOS device includes: an isolation structure for defining device regions; a gate with a ring-shaped structure; a drain located outside the ring; and a lightly doped drain, a source, and a body electrode located inside the ring. To increase the sub-threshold voltage at the corners of the gate, the corners are located completely on the isolation structure, or the lightly doped drain is apart from the corners by a predetermined distance.07-26-2012