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Hung-Chin
Hung-Chin Chen, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110077767 | SYSTEM FOR TEMPORARILY SUPPLYING POWER AND A METHOD THEREOF - The method for temporarily supplying electric power includes steps of: providing a system which has a power supplying unit and a controlling unit for applying a temporary power to a broken semiconductor carrier of the semiconductor carrying facility; utilizing the power supplying unit to supply electric power to the broken semiconductor carrier; and utilizing the controlling unit to control movements of the broken semiconductor carrier. Thereby, the broken semiconductor carrier can be driven to a maintain area efficiently and safely. | 03-31-2011 |
Hung-Chin Huang, Tainan City TW
| Patent application number | Description | Published |
|---|---|---|
| 20110217821 | METHOD OF MANUFACTURING DOPING PATTERNS - A method of manufacturing doping patterns includes providing a substrate having a plurality of STIs defining and electrically isolating a plurality of active regions in the substrate, forming a patterned photoresist having a plurality of exposing regions for exposing the active regions and the STIs in between the active regions on the substrate, and performing an ion implantation to form a plurality of doping patterns in the active regions. | 09-08-2011 |
Hung-Chin Lin, Hukou TW
| Patent application number | Description | Published |
|---|---|---|
| 20110095316 | LED PACKAGE STRUCTURE - An LED package structure includes an LED die, a lead frame and a housing connecting to the lead frame. The LED die is located on a surface of the lead frame. The housing includes an inner face surrounding the LED die. The inner face has a bottom edge connected to the surface of the lead frame, a top edge and a waist line between the bottom edge and top edge. The bottom edge surrounds an area less than an area surrounded by the waist line. The area surrounded by the waist line is less than an area surrounded by the top edge. The inner face has a curved surface between the waist line and the bottom edge. | 04-28-2011 |
| 20110156085 | SEMICONDUCTOR PACKAGE - A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed. | 06-30-2011 |
Hung-Chin Thuang, Kaohsiung City TW
| Patent application number | Description | Published |
|---|---|---|
| 20090001596 | CONDUCTIVE LINE STRUCTURE - A conductive line structure is defined with an OPC photomask and is suitably applied to a semiconductor device. The conductive line structure includes a first conductive line and a second conductive line. The first conductive line includes a first line body oriented in the X-direction of a plane coordinate system, a first end portion at one end of the first line body slanting toward the Y-direction of the plane coordinate system, and a second end portion at the other end of the first line body also slanting toward the Y-direction. The second conductive line arranged in an end-to-end manner with the first conductive line includes a second line body oriented in the X-direction, a third end portion at one end of the second line body slanting toward the Y-direction, and a fourth end portion at the other end of the second line body also slanting toward the Y-direction. | 01-01-2009 |