Hung-Chih
Hung-Chih Chang, Tainan City TW
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20140230889 | SOLAR CELL, METHOD FOR MANUFACTURING THE SAME AND SOLAR CELL MODULE - A solar cell, a method for manufacturing the same and a solar cell module are described. The solar cell includes a substrate of a second conductivity type, an emitter layer, a first oxide layer, an auxiliary passivation layer, a back surface field layer, a second oxide layer, a first electrode and a second electrode. The substrate includes a first surface and a second surface opposite each other. The emitter layer, the first oxide layer and the auxiliary passivation layer are sequentially disposed on the first surface. Materials of the auxiliary passivation layer and the first oxide layer are different. The back surface field layer and the second oxide layer are sequentially disposed on the second surface. The first electrode is disposed above the first surface and contacts with the emitter layer. The second electrode is disposed above the second surface and contacts with the back surface field layer. | 08-21-2014 |
Hung-Chih Chang, Taipei TW
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20110057525 | One-Way Pulley System for an Alternator Assembly - A one-way pulley for an alternator assembly includes an outer wheel, a clutch assembly, and a spindle. The outer wheel includes an axial hole extending longitudinally therethrough, whereby the axial hole forms an inner surface of the outer wheel. The clutch assembly is disposed within the axial hole of the outer wheel and includes a housing with an outer surface for contacting the inner surface of the outer wheel, and a plurality of rolling elements operable to extend into a pivot hole. The spindle is disposed within the pivot hole of the clutch assembly, the spindle having an outer surface for contacting the plurality of rolling elements and a coupling portion for connecting to a rotor shaft. The outer surface of the clutch assembly housing is fixedly attached to the inner surface of the outer wheel. | 03-10-2011 |
Hung-Chih Chang, Taichung City TW
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20150303299 | 3D UTB TRANSISTOR USING 2D MATERIAL CHANNELS - A semiconductor device and a method of manufacture are provided. A substrate has a dielectric layer formed thereon. A three-dimensional feature, such as a trench or a fin, is formed in the dielectric layer. A two-dimensional layer, such as a layer (or multilayer) of graphene, transition metal dichalcogenides (TMDs), or boron nitride (BN), is formed over sidewalls of the feature. The two-dimensional layer may also extend along horizontal surfaces, such as along a bottom of the trench or along horizontal surfaces of the dielectric layer extending away from the three-dimensional feature. A gate dielectric layer is formed over the two-dimensional layer and a gate electrode is formed over the gate dielectric layer. Source/drain contacts are electrically coupled to the two-dimensional layer on opposing sides of the gate electrode. | 10-22-2015 |
20160118479 | 3D UTB Transistor Using 2D-Material Channels - A semiconductor device and a method of manufacture are provided. A substrate has a dielectric layer formed thereon. A three-dimensional feature, such as a trench or a fin, is formed in the dielectric layer. A two-dimensional layer, such as a layer (or multilayer) of graphene, transition metal dichalcogenides (TMDs), or boron nitride (BN), is formed over sidewalls of the feature. The two-dimensional layer may also extend along horizontal surfaces, such as along a bottom of the trench or along horizontal surfaces of the dielectric layer extending away from the three-dimensional feature. A gate dielectric layer is formed over the two-dimensional layer and a gate electrode is formed over the gate dielectric layer. Source/drain contacts are electrically coupled to the two-dimensional layer on opposing sides of the gate electrode. | 04-28-2016 |
Hung-Chih Chang, New Taipei City TW
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20150214794 | Rotor of an Alternator - The present invention relates to a rotor for an alternator, including a first claw pole element and an opposite second claw pole element and a plurality of N-pole claw-shaped bodies of the first claw pole element and a plurality of S-pole claw-shaped bodies of the second claw pole element being respectively adjacent to each other and spaced apart; wherein a permanent magnet is fixed between each of the N-pole claw-shaped bodies of the first claw pole element and each of the S-pole claw-shaped bodies of the second claw pole element which are adjacent to each other, to increase a magnetic field generated after the rotor is electromagnetically conducted and decrease magnetic leakage between the two pole elements, thereby increasing generating capacity of the alternator. | 07-30-2015 |
Hung-Chih Chen, Hsinchu TW
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20120308808 | GAS BARRIER FILM AND METHOD FOR MANUFACTURING THE SAME - A gas barrier film and method for manufacturing the abovementioned gas barrier film are disclosed in the present invention. The gas barrier film is applied in electronic product, food, medicine and other fields for protecting them from gas and water. The gas barrier film comprises a gas barrier layer and pluralities of cladding layers. The gas barrier layer is a liquid layer, and the cladding layers are disposed on the opposite surface of the gas barrier layer. | 12-06-2012 |
Hung-Chih Chen, Taoyuan County TW
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20090058689 | KEYBOARD OF HANDHELD ELECTRONIC DEVICE - A keyboard of a handheld electronic device is provided. The keyboard is divided into a number of key areas arranged in array. The keyboard includes character keys and function keys. Each of the character keys respectively occupies one of the key areas and has a first character symbol, while some of the character keys further have a second character symbol respectively. Some of the function keys have an activation key occupying one key area. The other function keys respectively include an ENTER key, a SPACE key, and a SHIFT key, each of which occupies approximately two key areas transversely. The arrangement of the keys enable users to press the key quickly, correctly, and conveniently. | 03-05-2009 |
Hung-Chih Chen, Hsin-Chu TW
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20130258642 | Back Plate for Use with a Backlight Module, A Backlight Module Using the Same, and the Manufacturing Method Thereof - A back plate for use with a backlight module, a backlight module using the same, and the manufacturing method thereof are provided. The back plate includes a plate body and a side wall. The side wall extends out from the edge of the plate body and includes a wall body and a bending part, wherein the thickness of the wall body is less or equal to 0.12 mm. The bending part is formed by bending a plurality of bending sheets outward from the top of the wall body, wherein the thickness of each bending sheet is less or equal to 0.12 mm. The backlight module includes the back plate and a light source module, wherein the light source module is disposed on the plate body and adjacent to the inner side of the side wall. | 10-03-2013 |
20130301239 | Slim Border Design of Display Device and Backlight Module Thereof - A backlight module includes a bezel, a supporting frame, and a light source module. The bezel includes a back plate and a side wall connected to an edge of the back plate; the supporting frame includes a lower frame body and an upper frame body extending from a top of the lower frame body, wherein the lower frame body is disposed on the back plate and surrounded by the side wall. The upper frame body has at least a portion laterally shifted relative to the lower frame body to be located over the side wall. The light source module is surrounded by the lower frame body, wherein the portion of the upper frame body located over the side wall encloses a panel accommodation space above a top of the light source module. A display device includes the above-mentioned backlight module and a display panel disposed in the panel accommodation space. | 11-14-2013 |
Hung-Chih Chen, Liujiao Township TW
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20140059783 | Knife and Fork Assembly that can Function as Chopsticks - A knife and fork assembly includes a knife and a fork detachably connected with the knife. The knife has a first end provided with an elongate first handle and a second end provided with a blade. The blade has a locking groove which has an entrance. The locking groove has a hooked section. The fork has a first end provided with an elongate second handle and a second end provided with a neck. The neck has a plurality of protruding tines and a plurality of slots between the tines. The neck has an opening. The locking groove is locked onto one of the slots, and the hooked section is hooked in the opening. Thus, the first handle of the knife co-operates with the second handle of the fork to function as a pair of chopsticks. | 03-06-2014 |
Hung-Chih Chiang, Wurih Township TW
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20100050794 | MODULATOR FOR SUPPORTING ARM OF REAR BICYCLE CARRIER - A modulator for supporting arms of a rear bicycle carrier comprises a support frame including a central post having two ends with which first and second supporting arms are connected; a ratchet holder integrally formed with or separately disposed on the connecting position of the central post, and including a plurality of inner teeth arranged around the internal periphery thereof; a connecting shaft inserted through the ratchet holder, on the two sides of an intermediate seat of the connecting shaft being mounted two ratchet members for engaging with the inner teeth of the ratchet holder; a control unit fixed on a predetermined position of the rear bicycle carrier for being rotated clockwise or counterclockwise to disengage at least one ratchet member from the inner teeth of the ratchet holder such that the first and second supporting arms can be adjusted toward a suitable angle relative to the central post. | 03-04-2010 |
Hung-Chih Chiu, Hsinchu TW
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20160113538 | RELAXATION STATE EVALUATION SYSTEM AND METHOD AND COMPUTER PROGRAM PRODUCT THEREOF - The present invention proposes a relaxation state evaluation system and method and a computer program product thereof. The method comprises steps: measuring ECG data of a user; analyzing the ECG data to generate a first, second, third and fourth parameters, wherein the first parameter is the short-scale entropy slope of the user before cardiovascular disease treatment (CVDT); the second parameter is the difference of the post-CVDT and pre-CVDT mean RR intervals; the third parameter is the logarithm of the variance of the pre-CVDT high frequency NN intervals; the fourth parameter is the logarithm of the ratio of the variances of the pre-CVDT low frequency and high frequency NN intervals; working out an evaluation index, which is a function of the abovementioned parameters; and evaluating the relaxation state of the user, wherein the user is determined to be in a relaxation state if the evaluation index is over a threshold. | 04-28-2016 |
Hung-Chih Chiu, Zhonghe City TW
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20130024065 | Autonomous Electronic Device and Method of Controlling Motion of the Autonomous Electronic Device Thereof - An autonomous electronic device and a method of controlling the motion of the autonomous electronic device thereof are disclosed. The autonomous electronic device includes a motor, a wheel, a processing module, a motor controlling module, and a motion sensor module. The motor is used for driving the wheel. The motor controlling module is used for controlling the motor. The motion sensor module is used for generating a sensing signal according to surrounding conditions encountered by the autonomous electronic device and transferring the signal to the processing module, wherein when the sensing signal is an abnormal movement signal, the processing module controls the motor to adapt to the surrounding conditions via the motor controlling module according to the abnormal movement signal. | 01-24-2013 |
Hung-Chih Chiu, Taipei City TW
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20130257579 | HIGH-POWER FUSIBLE DEVICE - The high-power fusible device contains a main member having an upper element and a lower element as a basic structure for the high-power fusible device. The high-power fusible device further contains a fusible element positioned between the upper and lower elements, a high-thermal conductive layer sandwiched between the lower element and the fusible element, and at least a chamber on a lower side of the upper element interfacing an upper side of the fusible element as an accommodation space for the fusible element when it is blown. | 10-03-2013 |
Hung-Chih Chou, Hsinchu TW
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20130070205 | ILLUMINATION SYSTEM AND PROJECTION APPARATUS - An illumination system includes a first light source, a first rotation wheel, a first phosphor element, and a light combining element. The first light source is capable of emitting a first color beam. The first rotation wheel is disposed on a transmission path of the first color beam and includes a first transmissive region and a first reflective region. The first transmissive region is capable of allowing the first color beam to pass through so as to form a first color transmissive beam. The first reflective region is capable of reflecting the first color beam to form a first color reflective beam. One of the first color transmissive and reflective beams excites the first phosphor element to form a second color beam. The light combining element combines the second color beam and a beam originating from the other one of the first color transmissive and reflective beams. | 03-21-2013 |
20130088441 | TOUCH DISPLAY APPARATUS - A touch display apparatus including a first projecting screen and a projection apparatus is provided. The first projecting screen has a first curved surface. The first curved surface is capable of receiving a touch input instruction and has at least one tactile sense identify region. A sense of touch of the tactile sense identify region is different from a sense of touch of the other regions of the first curved surface. The projection apparatus is capable of projecting a projecting beam toward the first curved surface so as to form an image. | 04-11-2013 |
20130088689 | LIGHT SOURCE MODULE AND PROJECTION APPARATUS - A light source module including a first light-emitting device, a light emitting wheel, a second light-emitting device, and a light combination device is provided. The first light-emitting device provides an exciting beam. The light emitting wheel is disposed on a transmission path of the exciting beam and has a first light conversion area. The exciting beam obliquely irradiates on the first light conversion area and is converted into a first color beam. The second light-emitting device provides a second color beam. Herein, colors of the first color beam and the second color beam are different. The light combination device is disposed on the transmission paths of the first color beam and the second color beam. The first color beam is reflected to the light combination device by the light emitting wheel and the light combination device combines the first color beam and the second color beam. | 04-11-2013 |
20130094002 | PROJECTION SYSTEM USED IN A VEHICLE - A projection system used in a vehicle including a projection apparatus, a projection screen, and an image correction module is provided. The projection apparatus provides an image beam. The projection screen receives the image beam. The image beam forms an image on the projection screen. The projection screen is a non-flat plane. The image correction module corrects the image beam to compensate a distortion of the projected image based on the surface contour of the image screen. | 04-18-2013 |
20130100527 | VEHICULAR PROJECTION SYSTEM - A vehicular projection system including a projection apparatus, a beam splitting module, and two projection screens is provided. The projection apparatus provides at least one image light beam. The beam splitting module divides the image light beam into a first image light beam and a second image light beam. The two projection screens receive the first image light beam and the second image light beam respectively. Each of the first image light beam and the second image light beam respectively forms an image on one of the two projection screens corresponding thereto. | 04-25-2013 |
20130265245 | TOUCH DEVICE AND TOUCH PROJECTION SYSTEM USING THE SAME - A touch device including a light guide unit, a light emitting unit, an invisible light filter and an invisible light detector is provided. The light guide unit has at least one light incident surface and a first surface connected to the light incident surface. The light emitting unit is disposed beside the light incident surface and is capable of emitting an invisible light beam. The invisible light filter is contacted tightly with the first surface. The light guide unit is disposed between the invisible light filter and the invisible light detector. Moreover, a touch projection system including the touch device is also provided. | 10-10-2013 |
20130314379 | VEHICULAR OPTICAL TOUCH APPARATUS - A vehicular optical touch apparatus includes a screen, an elastic layer, a detection light source, and an image detector. The elastic layer is disposed on the screen and includes a first surface facing away from the screen and a second surface facing the screen. The second surface includes a plurality of inclined surfaces inclined with respect to the first surface. The inclined surfaces totally reflect at least one portion of ambient light entering the elastic layer through the first surface, so that the portion of ambient light leaves the elastic layer through the first surface. The detection light source emits detection light toward the elastic layer. When an object presses the first surface to deform the second surface, the detection light sequentially passes through the elastic layer, is reflected by the object, passes through the elastic layer again, and is transmitted to the image detector. | 11-28-2013 |
20140198302 | IMAGE REARRANGING LENS AND PROJECTION APPARATUS - An image rearranging lens and a projection apparatus are provided. The image rearranging lens is used to rearrange a plurality of sub images provided by an image source and arranged along an arranging direction. The image rearranging lens includes a plurality of lens groups arranged along the arranging direction. Each of the sub images is imaged on a corresponding lens group. Optical axes of the lens groups are not aligned to each other along the arranging direction. The optical axis of each of the lens groups and the optical axis of the neighboring lens groups have an offset along a direction perpendicular to the arranging direction. | 07-17-2014 |
Hung-Chih Hsu, Taichung City TW
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20150143935 | BALL SCREW WITH SUPPORT DEVICES - A ball screw with support devices includes a nut base having two sides equipped with the support devices for preventing the screw from deflection. Two runner structures are provided near two ends of the screw. The runner structure includes a driving wheel and a driven wheel having different diameters and concentrically installed. The nut base is connected to the driving wheel via an active connecting element for driving the driving wheel to rotate. The driven wheel moves with the driving wheel and is connected to the support devices via passive connecting elements so that the support devices and the nut displace synchronously. By controlling a diameter ratio between the driving and driven wheels, the nut and the support devices displace with proportional speeds, thereby allowing the support devices to always stay at the two sides of the nut as designed and provide reliable support. | 05-28-2015 |
Hung-Chih Huang, Tu-Cheng TW
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20080320318 | METHOD AND APPARATUS FOR DATA ENCRYPTION AND DECRYPTION - A method is provided for encrypting data to be stored in a data storage medium. The method includes encrypting the data using a special key associated with the electronic device. One example of the special key is a barcode of the electronic device. The encrypted data then is stored in the data storage medium. When the data stored in the data storage medium is decrypted, only the electronic device has the special key i.e., the barcode, can reproduce the encrypted data. When the data storage medium is lost or stolen, the encrypted data cannot be decrypted by another electronic device because the barcode of current electronic device is different from the original electronic device. Therefore, the encrypted data stored in the data storage medium is prevented from being read out by other electronic devices. | 12-25-2008 |
Hung-Chih Huang, Hsinchu City TW
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20100045686 | Display Method Applied to Electrophoretic Display and Corresponding Electrophoretic Display - In a display method applied to an electrophoretic display, the electrophoretic display has a first memory, a second memory and an electrophoretic display panel. A plurality of data is stored in the first memory according to a predetermined sequence. The display method includes the following steps. Firstly, whether a first datum of the data is stored in the second memory is determined. Next, the first datum is read out from the first memory and stored in the second memory if the first datum is not stored in the second memory. Next, the first datum stored in the second memory is displayed on the electrophoretic display panel. Next, a second datum before the first datum and/or a third datum after the first datum are/is read out from the first memory and stored in the second memory during displaying the first datum on the electrophoretic display panel. | 02-25-2010 |
Hung-Chih Hung, Hemei Township TW
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20110155769 | CAULKING GUN - A caulking gun includes a housing forming a handle and supporting a cartridge holder for receiving and holding a caulking cartridge. A flexible push plate is received through the housing to have a front end extending into the cartridge holder to carry a push disk. The housing has front and rear portions respectively receiving therein an advancer and a gripper through which the push plate extends. A guide roller is rotatably received in the housing rearward of the gripper. A rear end of the push plate extends through the gripper and is wrapped around the guide roller for further extension frontward to project outside and above the cartridge holder. When a trigger of the handle comprising a trigger is actuated to cause the advancer to advance the push plate frontward for extrusion of the caulking cartridge to dispense caulking, the gripper holds and prevents the push plate from returning rearward. | 06-30-2011 |
Hung-Chih Kuo, Matou TW
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20110275105 | Methods of inducing pluripotency - Methods are provided for inducing non-pluripotent cells to become pluripotent. Methods also include identifying and isolating induced pluripotent (iPS) cells and uses thereof. Compositions and kits for carrying out the subject methods are also provided. | 11-10-2011 |
Hung-Chih Lin, Hsinchu City TW
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20110211366 | BACKLIGHT MODULE - A backlight module includes a light guide plate having a light incident surface, a light source module, at least one catch member, and a cushion member. The light source module is disposed adjacent to the light incident surface and has at least one light-emitting element, wherein a light beam emitted by the light-emitting element is capable of entering the light guide plate through the light incident surface. The catch member engages with one end of the light source module, wherein the catch member has at least one extension part extending towards the light incident surface of the light guide plate, and the extension part has an end surface facing the light incident surface. The cushion member is disposed between the light guide plate and the light source module and is adjacent to the light incident surface of the light guide plate and the end surface of the catch member. | 09-01-2011 |
20110242793 | BACKLIGHT MODULE - A backlight module includes a heat-dissipating element, at least one light-emitting element disposed on a first side of the heat-dissipating element, a back plate, and a heat-insulation element. The back plate has at least one opening and is disposed on the first side of the heat-dissipating element, and the back plate is not overlapped with the light-emitting element. The heat-insulation element is disposed between the back plate and the heat-dissipating element for reducing heat conduction between the back plate and the heat-dissipating element so as to prevent the heat generated by the light-emitting element from being conducted to the back plate. | 10-06-2011 |
20110249470 | BACKLIGHT MODULE - A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element. | 10-13-2011 |
20120097944 | TEST STRUCTURES FOR THROUGH SILICON VIAS (TSVs) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC) - A plurality of through silicon vias (TSVs) on a substrate or in a 3 dimensional integrated circuit (3DIC) are chained together. TSVs are chained together to increase the electrical signal. A plurality of test pads are used to enable the testing of the TVSs. One of the test pads is grounded. The remaining test pads are either electrically connected to TSVs in the chain or grounded. | 04-26-2012 |
20130099809 | METHODS AND SYSTEMS FOR PROBING SEMICONDUCTOR WAFERS - A wafer probing method includes calibrating a wafer probing system, checking continuity between probe pins of the wafer probing system and respective conductors of a wafer under test, and identifying at least an interconnect structure in the wafer under test to determine whether a fault exists. | 04-25-2013 |
20130147505 | TEST PROBING STRUCTURE - A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps. | 06-13-2013 |
20130196458 | METHOD OF TESTING THROUGH SILICON VIAS (TSVS) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC) - In a method of testing a plurality of through silicon vias (TSVs) chained together by interconnect on a substrate, a test signal is applied to a first test pad among a plurality of test pads, and a return signal is measured at a second test pad among the plurality of test pads. At least one test pad of the plurality of test pads is grounded to the substrate. The remaining test pads of the plurality of test pads are either connected to the plurality of chained TSVs or are grounded. | 08-01-2013 |
20140167799 | THREE DIMENSIONAL INTEGRATED CIRCUIT ELECTROSTATIC DISCHARGE PROTECTION AND PREVENTION TEST INTERFACE - The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection. | 06-19-2014 |
20140253162 | INTEGRATED CIRCUIT TEST SYSTEM AND METHOD - A system for testing a device under test (DUT) includes a probe card and a test module. The probe card includes probe beds electrically coupled to a circuit board and a first plurality of electrical contacts coupled to the circuit board, which are for engaging respective ones of a plurality of electrical contacts of a test equipment module. Probes are coupled to respective probe beds and are disposed to engage electrical contacts of the DUT. The probe card includes a second plurality of electrical contacts coupled to the circuit board. The first and second pluralities of contacts are mutually exclusive. The test module includes a memory, a processor, and a plurality of electrical contacts electrically coupled to respective ones of the second plurality of electrical contacts of the probe card. The circuit board includes a first electrical path for electrically coupling the test equipment module to the test module. | 09-11-2014 |
20140266273 | TEST-YIELD IMPROVEMENT DEVICES FOR HIGH-DENSITY PROBING TECHNIQUES AND METHOD OF IMPLEMENTING THE SAME - A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head. | 09-18-2014 |
20150115986 | ALIGNMENT TESTING FOR TIERED SEMICONDUCTOR STRUCTURE - Among other things, one or more techniques or systems for evaluating a tiered semiconductor structure, such as a stacked CMOS structure, for misalignment are provided. In an embodiment, a connectivity test is performed on vias between a first layer and a second layer to determine a via diameter and a via offset that are used to evaluate misalignment. In an embodiment, a connectivity test for vias within a first layer is performed to determine an alignment rotation based upon which vias are connected through a conductive arc within a second layer or which vias are connected to a conductive pattern out of a set of conductive patterns. In this way, the via diameter, the via offset, or the alignment rotation are used to evaluate the tiered semiconductor structure, such as during a stacked CMOS process, for misalignment. | 04-30-2015 |
20150115993 | STRUCTURE AND METHOD FOR TESTING STACKED CMOS STRUCTURE - A test structure is provided for testing a semiconductor structure having a plurality of tiers. The test structure includes at least one conductive loop. Each respective conductive loop has ends defining at least one opening between the ends, and is embedded inside one or more of the plurality of tiers in the semiconductor structure. The test structure also includes at least two test pads on each respective conductive loop. The at least two test pads are connected with respective ends of each respective conductive loop. The test structure is configured to permit detection of defects within each of the plurality of tiers in the semiconductor structure if the defects exist, using a testing apparatus. | 04-30-2015 |
20150130498 | SYSTEMS FOR PROBING SEMICONDUCTOR WAFERS - A wafer probing system includes a plurality of contacting pins connected to a test head. The system further includes a probe card electrically connectable with the test head, where the probe card includes a circuit board having a plurality of contact pads on opposite sides of the circuit board. | 05-14-2015 |
20150185282 | INTEGRATED FAN-OUT PACKAGE-ON-PACKAGE TESTING - A device for testing a bottom package of an integrated fan-out (InFO) Package-on-Package (PoP) comprises a bottom fixture having a space to accommodate the bottom package during testing and a detachable top cover, configured for conducting at least one test of the bottom package, wherein one or both of the bottom fixture and the top cover have a plurality of probing contacts for testing of the bottom package and wherein the device can be opened for placement of the bottom package under testing, and the cover is attachable to the bottom fixture for conducting the testing. | 07-02-2015 |
20150198662 | INTEGRATED FAN-OUT WAFER ARCHITECTURE AND TEST METHOD - A fan-out wafer comprises a first IC die having at least a first boundary scan cell (BSC) and a second BSC. The first BSC is coupled to a first demultiplexer. The second BSC is coupled to a first pad. A second IC die has at least a third BSC coupled to a second demultiplexer, and a second pad connected to the first pad. A first master path connects the first demultiplexer to the second demultiplexer. A first slave path connects the first demultiplexer to the second demultiplexer. The first pad and second pad are located between the first master path and the first slave path. | 07-16-2015 |
20150241507 | Test Circuit And Method - A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas. | 08-27-2015 |
20150241508 | Test Circuit And Method - A circuit is disclosed that includes a signal-forcing path, a discharging path, a contact probe, a monitoring probe and a switch module. The signal-forcing path is connected to a signal source. The discharging path is connected to a discharging voltage terminal. The contact probe contacts a pad module of an under-test device. The monitoring probe generates a monitored voltage associated with the pad module. The switch module is operated in a discharging mode to connect the contact probe to the discharging path when the monitored voltage does not reach a threshold voltage such that the under-test device is discharged and is operated in an operation mode to connect the contact probe to the signal-forcing path when the monitored voltage reaches the threshold voltage such that a signal generated by the signal source is forced to the under-test device. | 08-27-2015 |
20150323589 | COMPOSITE INTEGRATED CIRCUITS AND METHODS FOR WIRELESS INTERACTIONS THEREWITH - A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal. | 11-12-2015 |
20160113099 | THREE DIMENSIONAL INTEGRATED CIRCUIT ELECTROSTATIC DISCHARGE PROTECTION AND PREVENTION TEST INTERFACE - The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection. | 04-21-2016 |
Hung-Chih Lin, Hsin-Chu TW
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20110069509 | BACKLIGHT MODULE - A backlight module includes a back plate, a plurality of position limiting elements, a light guiding plate, and a light source. The position limiting elements are disposed on the back plate, and each of the position limiting elements includes a pillar and a cushion sheath covering the pillar. The light guiding plate is disposed on the back plate, and has a plurality of first position limiting portions. The first position limiting portions respectively contact the position limiting elements to position the light guiding plate on the back plate. The light source is disposed at a side of the light guiding plate. | 03-24-2011 |
20110299296 | BACKLIGHT MODULE AND HEAT DISSIPATION MODULE - A backlight module includes a back plate having a trench, a light guide plate disposed on the back plate, a reflecting sheet disposed between the back plate and the light guide plate, a heat dissipation module, and a light emitting element. The heat dissipation module includes a heat dissipation element, a heat conducting element, and a position-limiting element. The heat dissipation element is disposed on the back plate. The heat conducting element is disposed in the trench. One end of the heat conducting element is aligned with the heat dissipation element. The first position-limiting element is detachably assembled in the trench and supports the reflecting sheet. One section of the heat conducting element is pressed onto a bottom wall of the trench by the first position-limiting element. The light emitting element is disposed on the heat dissipation element and faces one side of the light guide plate. | 12-08-2011 |
20120242346 | Power Compensation in 3DIC Testing - A device, such as a 3DIC stacked device includes a first device under test (DUT) connected to a first force pad by a first through substrate via (TSV) stack and connected to a first sense pad by a second TSV stack. The device further includes a second DUT stacked above the first DUT and connected to a second force pad and a second force pad by a second third TSV and connected to a second sense pad by a fourth TSV. Functional blocks on either the first or second blocks can be accessed for testing by way of the TSVs. In some applications the TSVs are vertically aligned to form TSV stacks. | 09-27-2012 |
20120246514 | Adaptive Test Sequence for Testing Integrated Circuits - A method includes testing a first device and a second device identical to each other and comprising integrated circuits. The testing of the first device is performed according to a first test sequence of the first device, wherein the first test sequence includes a plurality of ordered test items, and wherein the first test sequence includes a test item. A test priority of the test item is calculated based on a frequency of fails of the test item in the testing of a plurality of devices having an identical structure as the first device. The first test sequence is then adjusted to generate a second test sequence in response to the test priority of the test item, wherein the second test sequence is different from the first test sequence. The second device is tested according to the second test sequence. | 09-27-2012 |
20120256649 | Dynamic Testing Based on Thermal and Stress Conditions - A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked system comprises a plurality of stacked dies. A temperature of the die is measured. A respective set of test conditions of the die is found from the plurality of sets of test conditions, wherein the set of test conditions corresponds to the temperature. The die is at the temperature using the set of test conditions to generate test results. | 10-11-2012 |
20120286814 | 3D IC Testing Apparatus - A three dimensional (3D) integrated circuit (IC) testing apparatus comprises a plurality of connection devices. When a device under test (DUT) such as an interposer or a 3D IC formed by a plurality of 3D dies operates in a testing mode, the 3D IC testing apparatus is coupled to the DUT via a variety of interface channels such as probes. The connection devices and a variety of through silicon vias (TSVs) in the DUT form a TSV chain so that a electrical characteristic test of the variety of TSVs can be tested all at once. | 11-15-2012 |
20130078745 | Production Flow and Reusable Testing Method - An embodiment is a method. The method comprises providing a substrate comprising a die area. The die area comprises sections of pad patterns, and first sections of the sections each comprise a first uniform pad pattern. The method further comprises probing a first one of the first sections with a first probe card; stepping the first probe card to a second one of the first sections; and probing the second one of the first sections with the first probe card. | 03-28-2013 |
20130099812 | Probe Cards for Probing Integrated Circuits - A device includes a probe card, which further includes a chip. The chip includes a semiconductor substrate, a test engine disposed in the chip, wherein the test engine comprises a device formed on the semiconductor substrate, wherein the device is selected from the group consisting essentially of a passive device, an active device, and combinations thereof. A plurality of probe contacts is formed on a surface of the chip and electrically connected to the test engine. | 04-25-2013 |
20130147049 | Circuit Probing Structures and Methods for Probing the Same - A package component includes a stack-probe unit, which includes a first-type connector, and a second-type connector connected to the first-type connector. The first-type connector and the second-type connector are exposed through a surface of the package component. | 06-13-2013 |
20140176165 | Apparatus for Three Dimensional Integrated Circuit Testing - A three-dimensional integrated circuit testing apparatus comprises a probe card configured to couple a device-under-test of a three-dimensional integrated circuit with an automatic testing equipment board having a plurality of testing modules, wherein the probe card comprises a plurality of known good dies of the three-dimensional integrated circuit, a plurality of interconnects of the three-dimensional integrated circuit and a plurality of probe contacts, wherein the probe contacts are configured to couple the probe card with testing contacts of the device-under-test of the three-dimensional integrated circuit. | 06-26-2014 |
20140361804 | METHOD AND APPARATUS OF WAFER TESTING - A system for testing a wafer includes a probe card and a wafer. The probe card includes at least one first probe site and at least one second probe site. The wafer includes a plurality of dies. The at least one first probe site is arranged for a first test, and the at least one second probe site is arranged for a second test. Each of the plurality of dies corresponds to first probe pads and second probe pads. Each of the at least one first probe site is arranged to touch the first probe pads of each of the plurality of dies. Each of the at least one second probe site is arranged to touch the second probe pads of each of the plurality of dies. | 12-11-2014 |
20150087089 | 3D IC Testing Apparatus - A method comprises connecting a testing setup having a plurality of probes to a device under test having a plurality of vias, wherein a probe is aligned with a corresponding via of the device under test and conducting a plurality of via electrical characteristic tests through a conductive path comprising the vias, the probes and a plurality of conductive devices, each of which connects two adjacent probes, wherein the conductive devices are in the testing setup. | 03-26-2015 |
20150380328 | Circuit Probing Structures and Methods for Probing the Same - A package component includes a stack-probe unit, which includes a first-type connector, and a second-type connector connected to the first-type connector. The first-type connector and the second-type connector are exposed through a surface of the package component. | 12-31-2015 |
20160077147 | INTEGRATED FAN-OUT PILLAR PROBE SYSTEM - Disclosed herein is a method of probe testing dies, the method comprising loading a wafer having a first die and a second die into a prober and bringing probes of the prober into contact with first contact pads of the first die according to first probe parameters. A first probe contact test of first values of the contact between the probes and the first contact pads is performed, and a die test of the first die is performed after performing the probe contact test. Results of the die test and results of the probe contact test are saved and second probe parameters are automatically generated based on at least the results of the first probe contact test. | 03-17-2016 |
Hung-Chih Lin, Hsinchu TW
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20140043148 | THREE-DIMENSIONAL INTEGRATED CIRCUIT AND METHOD FOR WIRELESS INFORMATION ACCESS THEREOF - A three-dimensional integrated circuit (3DIC) and wireless information access methods thereof are provided. The proposed 3DIC includes a semiconductor structure, and a wireless power device (WPD) formed on the semiconductor structure for wirelessly receiving a power for operating a function selected from a group consisting of probing the semiconductor structure, testing the semiconductor structure and accessing a first information from the semiconductor structure. | 02-13-2014 |
20140266281 | TESTING HOLDERS FOR CHIP UNIT AND DIE PACKAGE - A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body. | 09-18-2014 |
Hung-Chih Lin, Citong Township TW
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20150200608 | POWER CONVERTER - A power converter includes a wave generator, a low pass filter, a first control circuit, and a second control circuit. The wave generator receives an input voltage, and converts the input signal into a wave signal according to a first control signal and a second control signal. The low pass filter filters the wave signal to generate an output voltage. The first control circuit generates the first control signal according to the wave signal and the output voltage. The second control circuit generates the second control signal according to the wave signal and the output voltage. | 07-16-2015 |
Hung-Chih Lin, New Taipei City TW
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20150233932 | Methods, Systems, and Compositions for Enrichment of Rare Cells - The present invention discloses a highly efficient method of isolating circulating tumor cells in a blood sample by removing leukocytes and other interfering components in a blood sample. Exemplary isolation method relies on a specially configured separation column for magnetic separation of leukocytes from circulating tumor cells. Also disclosed are systems, devices, and reagents for performing the method, as well as diagnostic methods for early cancer detection, screening, and treatment monitoring utilizing the cell isolation method. | 08-20-2015 |
Hung-Chih Shih, Taoyuan City TW
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20150201530 | Heat Spreading Packaging Apparatus - This invention is related to a new heat spreading packaging design and the constituting method, especially mounting a heat spreader into an electronic device, so that it can reduce the internal temperature of device and make uniform surface temperature effectively. | 07-16-2015 |
Hung-Chih Sun, Miao-Li County TW
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20120188211 | DISPLAY DRIVING CIRCUIT AND DISPLAY PANEL USING THE SAME - In a display driving circuit, odd-stage shift registers (SRs) are cascaded; and even-stage SRs are cascaded. The SRs support dual direction shifting. Each SR includes: first, second, third, and fourth transistors. The first transistor is coupled to a forward scan start signal from a third transistor of a former second SR, coupled to an output signal from the former second SR and coupled to a node. The second transistor is coupled to a reverse scan start signal from a fourth transistor of a next second SR, coupled to an output signal from the next second SR and coupled to the node. The third transistor is coupled to a forward operation voltage and coupled to the node, and further outputs a forward scan start signal. The fourth transistor is coupled to a reverse operation voltage and coupled to the node, and further outputs a reverse scan start signal. | 07-26-2012 |
Hung-Chih Sun, Chu-Nan TW
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20120320044 | STEREOSCOPIC DISPLAY APPARATUS - A stereoscopic display apparatus is cooperated with a shutter apparatus. The stereoscopic display apparatus includes a display module and an infrared emitting device. The display module has a viewable area and an optical sheet. The infrared emitting device is disposed in the display module. The light emitted from the infrared emitting device passes through the optical sheet and the viewable area and be received by the shutter apparatus to control it. The stereoscopic display apparatus can reduce the cost and make the appearance of the stereoscopic display apparatus have better integrity. | 12-20-2012 |
Hung-Chih Sung, Zhubei TW
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20150204908 | ELECTRICAL TESTING MACHINE - An electrical testing machine includes a base having two parallel first rails, a platform provided on the base, a probe holder provided on the base and having a plurality of placement locations, a support provided between the first rails and having a second rail thereon, a test arm provided on the second rail and above the platform, a receiving seat provided on the test arm, and a plurality of probe sets, wherein one of the probe sets is engaged on the receiving seat, while the others are respectively provided on the placement locations. The support is movable relative to the base and the platform. The test arm is movable along with the support, and is also movable relative to the support. The receiving seat is movable or rotatable relative to the test arm. The probe set engaged on the receiving seat is movable along with the receiving seat. | 07-23-2015 |
Hung-Chih Tsai, Wongyuan Village TW
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20080254588 | METHODS FOR FORMING TRANSISTORS WITH HIGH-K DIELECTRIC LAYERS AND TRANSISTORS FORMED THEREFROM - A method for forming a semiconductor structure includes forming a gate dielectric layer over a substrate. A top surface of the gate dielectric layer is treated so as to at least partially nitridize the gate dielectric layer. The treated gate dielectric layer is thermally treated with an oxygen-containing precursor such that the at least partially nitridized gate dielectric layer has a nitrogen concentration between about 0.5 atomic percentage (at. %) and about 20 at %. | 10-16-2008 |
Hung-Chih Tsai, Daliao TW
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20090236633 | SRAM Devices Utilizing Strained-Channel Transistors and Methods of Manufacture - A novel SRAM memory cell structure and method of making the same are provided. The SRAM memory cell structure comprises strained PMOS transistors formed in a semiconductor substrate. The PMOS transistors comprise epitaxial grown source/drain regions that result in significant PMOS transistor drive current increase. An insulation layer is formed atop an STI that is used to electrically isolate adjacent PMOS transistors. The insulation layer is substantially elevated from the semiconductor substrate surface. The elevated insulation layer facilitates the formation of desirable thick epitaxial source/drain regions, and prevents the bridging between adjacent epitaxial layers due to the epitaxial layer lateral extension during the process of growing epitaxial sour/drain regions. The processing steps of forming the elevated insulation layer are compatible with a conventional CMOS process flow. | 09-24-2009 |
20100013029 | Structure and a Method of Manufacture for Low Resistance NiSix - A device and a method for forming a metal silicide is presented. A device, which includes a gate region, a source region, and a drain region, is formed on a substrate. A metal is disposed on the substrate, followed by a first anneal, forming a metal silicide on at least one of the gate region, the source region, and the drain region. The unreacted metal is removed from the substrate. The metal silicide is implanted with atoms. The implant is followed by a super anneal of the substrate. | 01-21-2010 |
20140099758 | SRAM Devices Utilizing Strained-Channel Transistors and Methods of Manufacture - A novel SRAM memory cell structure and method of making the same are provided. The SRAM memory cell structure comprises strained PMOS transistors formed in a semiconductor substrate. The PMOS transistors comprise epitaxial grown source/drain regions that result in significant PMOS transistor drive current increase. An insulation layer is formed atop an STI that is used to electrically isolate adjacent PMOS transistors. The insulation layer is substantially elevated from the semiconductor substrate surface. The elevated insulation layer facilitates the formation of desirable thick epitaxial source/drain regions, and prevents the bridging between adjacent epitaxial layers due to the epitaxial layer lateral extension during the process of growing epitaxial sour/drain regions. The processing steps of forming the elevated insulation layer are compatible with a conventional CMOS process flow. | 04-10-2014 |
Hung-Chih Wang, Taipei 11492 TW
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20130326103 | PORTABLE MEMORY STORAGE DEVICE - A portable memory storage device includes a housing and plural memory modules insertable into the housing. Each memory module includes a module shell, which has a module body and a positioning mechanism, and a memory member connected to the module shell. The positioning mechanism is disposed on the module body and is exposed from the housing. The positioning mechanism of a first memory module abuts against a front opening-defining edge, and the positioning mechanism of a last memory module abuts against a rear opening-defining edge, such that the plural memory modules are positioned in the housing. The memory module may be removed from the housing when the positioning mechanism is depressed. | 12-05-2013 |
Hung-Chih Wang, Kaohsiung City TW
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20120249316 | BICYCLE BRAKE LIGHT SYSTEM - A self sustaining brake light system particularly suitable for employment on a bicycle is provided. The brake light system comprises a brake arm operably disposed on a bicycle frame, a power generating unit mounted on the brake arm, and a brake light unit powered by the power generating unit. Particularly, the power generating unit includes a rolling member for establishing frictional contact with the wheel. The power generating unit is adjustably mounted on the brake arm in a pivotal manner. The brake light unit includes at least one light module, and is preferably arranged integrally on the brake arm in a conformal fashion. | 10-04-2012 |
20130094137 | DATA STORAGE DEVICE - A data storage device includes a storage module, a casing, a sliding member, and an elastic member. The storage module has a plurality of pins and memory units electrically interconnected. The casing includes a base, three sidewall members, a support member, a first abutting portion, and an accommodating region defined cooperatively by the sidewall members. At least one guide block is disposed on each of the oppositely arranged sidewall members. The first abutting portion is formed on one side of the support member. The sliding member has a second abutting portion and at least one guide rail corresponding to its respective guide block. The support member is arranged between the sliding member and the base. The elastic member is held by the first and second abutting portions on opposite ends thereof The compression and restoration of the elastic member allows the sliding member to selectively conceal the pins. | 04-18-2013 |
Hung-Chih Wang, Hsinchu City TW
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20140252623 | SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE RESISTANT TO PLASMA DAMAGE AND METHOD FOR FORMING THE SAME - A connective structure for bonding semiconductor devices and methods for forming the same are provided. The bonding structure includes an alpad structure, i.e., a thick aluminum-containing connective pad, and a substructure beneath the aluminum-containing pad that includes at least a pre-metal layer and a barrier layer. The pre-metal layer is a dense material layer and includes a density greater than the barrier layer and is a low surface roughness film. The high density pre-metal layer prevents plasma damage from producing charges in underlying dielectric materials or destroying subjacent semiconductor devices. | 09-11-2014 |
20150179565 | SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE RESISTANT TO PLASMA DAMAGE AND METHOD FOR FORMING THE SAME - A connective structure for bonding semiconductor devices and methods for forming the same are provided. The bonding structure includes an alpad structure, i.e., a thick aluminum-containing connective pad, and a substructure beneath the aluminum-containing pad that includes at least a pre-metal layer and a barrier layer. The pre-metal layer is a dense material layer and includes a density greater than the barrier layer and is a low surface roughness film. The high density pre-metal layer prevents plasma damage from producing charges in underlying dielectric materials or destroying subjacent semiconductor devices. | 06-25-2015 |
20160049321 | SEMICONDUCTOR BAKING APPARATUS AND OPERATION METHOD THEREOF - A semiconductor baking apparatus includes a load lock chamber, a process chamber, a transfer chamber, a first interior door, and a controller. The process chamber has a first accommodating space therein. The transfer chamber has a second accommodating space therein, and the transfer chamber is connected to the load lock chamber and the process chamber. The first interior door is between the process chamber and the transfer chamber. When the first interior door is opened, the first accommodating space is communicated with the second accommodating space. The controller is programmed to open the first interior door when the semiconductor baking apparatus idles. | 02-18-2016 |
Hung-Chih Wang, Hsin-Chu TW
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20130320539 | Method and Apparatus for Back End of Line Semiconductor Device Processing - Methods and apparatus are disclosed for the back end of line process for fabrication of integrated circuits (ICs). The inter-metal dielectric (IMD) layer between two metal layers may comprise an etching stop layer over a metal layer, a low-k dielectric layer over the etching stop layer, a dielectric hard mask layer over the low-k dielectric layer, an nitrogen free anti-reflection layer (NFARL) over the dielectric hard mask layer, and a metal-hard-mask (MHM) layer of a thickness in a range from about 180 Å to about 360 Å over the NFARL. The MHM layer thickness is optimized at the range from about 180 Å to about 360 Å to reduce the Cu pits while avoiding the photo overlay shifting issue. | 12-05-2013 |
20140084470 | Seed Layer Structure and Method - A seed layer comprises a bottom seed layer portion formed on the bottom of a via opening, a sidewall seed layer portion formed on an upper portion of the sidewall of the via opening and a corner seed layer portion formed between the bottom seed layer portion and the sidewall seed layer portion. The sidewall seed layer portion is of a first thickness. The corner seed layer portion is of a second thickness and the second thickness is greater than the first thickness. | 03-27-2014 |
Hung-Chih Wu, Hsin-Chuang TW
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20090311546 | Method for manufacturing a rubber magnet with a colored facial gum material layer and a rubber magnet thereof - A method for manufacturing a rubber magnet with a colored facial gum material layer and a rubber magnet thereof. A colored gum material layer is paved on a surface of the rubber magnet. A surfactant is added into the colored gum material layer. An identical surfactant or a surfactant with very close polarity is added into the material of the rubber magnet, whereby the surfaces of the gum material layer and the rubber magnet can tightly adhere to each other without easy peeling. In addition, antiscaling agent, wetting/spreading agent and defoaming agent are added into the gum material layer to fully wet the color and uniformly spread the color over the gum material so as to enhance the evenness of the color. | 12-17-2009 |
Hung-Chih Wu, Taipei County TW
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20090297782 | SOFT MAGNET WITH EMBOSSED STRIPE PATTERN - A soft magnet structure including a flat sheet of soft magnet. The sheet is embossed with a pattern of densely arranged stripes. The depth of the embossed stripe pattern ranges 0.1 mm and between 0.3 mm. The stripes extend in the same direction and are arranged on at least one surface of the sheet, whereby an external force or shear force is applied to the soft magnet along the stripes, the soft magnet can be torn apart in the direction of the stripes. | 12-03-2009 |
20100071842 | Magnet structure with colorable surface and a method for manufacturing the magnet - A magnet structure with colorable surface and a method for manufacturing the magnet structure. The method includes a step of disposing a colorable facial layer on a surface of the magnet. The material of the colorable facial layer is a mixture of polymer resin, good ink-absorbing material and tackifier, whereby the colorable facial layer has high adhesion to the surface of the magnet. In addition, the colorable facial layer can easily absorb an ink or a color so that the colorable facial layer can be further colored or printed with a figure. | 03-25-2010 |
Hung-Chih Yang, Hsinchu TW
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20100276724 | LIGHT-EMITTING DEVICE - The application illustrates a light-emitting device including a contact layer and a current spreading layer on the contact layer. A part of the contact layer is a rough structure and a part of the contact layer is a flat structure. A part of the current spreading layer is a rough structure and a part of the current spreading layer is a flat structure. The rough region of the contact layer and the rough region of the current spreading layer are substantially overlapped. | 11-04-2010 |
20120007042 | LIGHT EMITTING DEVICE WITH A SINGLE QUANTUM WELL ROD - A light emitting device comprising a first semiconductor layer, a second semiconductor layer and a quantum well layer, wherein the first semiconductor layer and the second semiconductor layer are disposed on the opposite sides of the quantum well layer, the quantum well layer comprising a plurality of quantum well rods which are separated from each other, and each of the quantum well rods has only one quantum well. | 01-12-2012 |
20130082238 | LIGHT-EMITTING DEVICE - Disclosed is a light-emitting device, comprising: a first multi-quantum well structure comprising a plurality of first well layers and a first barrier layer stacked alternately, wherein the energy gap of the first barrier layer is larger than that of any one of the first well layers; a second multi-quantum well structure comprising a plurality of second well layers and a second barrier layer stacked alternately, wherein the energy gap of the second barrier layer is larger than that of any one of the second well layers; and a third barrier layer disposed between the first multi-quantum well structure and the second multi-quantum well structure, and the third barrier layer connected with the first well layer and the second well layer, wherein the energy gap of the third barrier layer is larger than that of any one of the first well layers and the second well layers, and the thickness of the third barrier layer is larger than that of any one of the first barrier layer and the second barrier layer. | 04-04-2013 |
20130320296 | LIGHT EMITTING DEVICE WITH QCSE-REVERSED AND QCSE-FREE MULTI QUANTUM WELL STRUCTURE - A light-emitting device comprises a semiconductor stacked structure, the semiconductor stacked structure comprising a p-type semiconductor layer, a n-type semiconductor layer and an multiple quantum well structure between the p-type semiconductor layer and the n-type semiconductor layer, wherein the multiple quantum well structure comprises a first multiple quantum well structure near the n-type semiconductor layer and a second multiple quantum well structure near the p-type semiconductor layer, wherein the first multiple quantum well structure has positive interface bound charge and the second multiple quantum well structure has zero interface bound charge. | 12-05-2013 |
20130334555 | OPTOELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - An optoelectronic device comprising: a substrate; and a transition stack formed on the substrate comprising one first transition layer formed on the substrate having a first hollow component formed inside the first transition layer and a second transition layer formed on the first transition layer having a second hollow component formed inside the second transition layer wherein the first hollow component and the second hollow component having a volume respectively, and the volume of the first hollow component is different with the second hollow component and the material of the transition stack comprises at least two element. | 12-19-2013 |
20140183581 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - A light-emitting device comprises a substrate; a first semiconductor layer formed on the substrate; a light-emitting layer on the first semiconductor layer; and a second semiconductor layer having a rough surface formed on the light-emitting layer, wherein the rough surface comprises a plurality of cavities randomly distributed on the rough surface, and one of the plurality of cavities has a substantially hexagonal shape viewed from top and a curved sidewall viewed from cross-section. | 07-03-2014 |
20140319559 | LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF - A light-emitting device includes: a light-emitting stack having an upper surface having a first surface roughness less than 0.2 nm; and an as-cut wafer comprising an irregularly uneven surface facing the light-emitting stack and having a second surface roughness greater than 0.5 μm. | 10-30-2014 |
20160043277 | LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF - An LED manufacturing method includes steps of: providing a substrate including a first surface; forming a first portion of a first semiconductor layer on the first surface in a first atmosphere including a first carrier gas; and forming a second portion of the first semiconductor layer on the first portion in a second atmosphere including a second carrier gas; wherein a plurality of first cavities is formed on a surface of the first portion during forming the first portion; and wherein the plurality of first cavities is transformed to a plurality of second cavities during forming the second portion, and one of the second cavities includes a first inclined surface and a second inclined surface above the first inclined surface. | 02-11-2016 |