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Hun Joo Hahm

Hun Joo Hahm, Seongnam-Si KR

Patent application numberDescriptionPublished
20110026241BACKLIGHT UNIT - Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.02-03-2011

Hun Joo Hahm, Seongnam KR

Patent application numberDescriptionPublished
20090059123PLANE LIGHT SOURCE AND LCD BACKLIGHT UNIT HAVING THE SAME - There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P03-05-2009
20090072119Backlight unit and method of driving the same - Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.03-19-2009
20090294793LED PACKAGE AND METHOD OF MANUFACTURING THE SAME - Provided is an LED package including a heat radiating portion that is composed of two or more metal layers and has a cavity formed therein; a first lead that extends from one side of the heat radiating portion; a second lead that is formed in the other side of the heat radiating portion so as to be separated from the heat radiating portion; a mold portion that fixes the heat radiating portion and the first and second leads; an LED chip that is mounted in the cavity; and a first filler that is filled in the cavity so as to protect the LED chip.12-03-2009
20100053956LIGHT EMITTING MODULE - There is provided a light emitting module including: a printed circuit board; a plurality of light emitting diode chips disposed at a distance from one another on a conductive pattern formed on a top of the printed circuit board; and a connector formed on a bottom of the printed circuit board and electrically connected to the plurality of light emitting diode chips. The light emitting diode chips and the connector are optimally arranged to ensure that the light emitting module is suitably utilized as a high-density linear light source including a great number of light emitting diode chips and emits light outward with minimum loss.03-04-2010
20100134405EDGE TYPE BACKLIGHT UNIT HAVING LOCAL DIMMING FUNCTION - Disclosed is an edge type backlight unit having a local dimming function realized by adjusting the distance between a light guide plate and a plurality of optical systems disposed under the light guide plate. The edge type backlight unit includes a light guide plate guiding light emitted from a light source, and a luminance control unit including a plurality of optical systems reflecting light guided by the light guide plate and emitting the light to a liquid crystal panel, and controlling luminance by controlling the reflectance of each of the plurality of optical systems according to an input image signal.06-03-2010
20100284186PLANE LIGHT SOURCE AND LCD BACKLIGHT UNIT HAVING THE SAME - There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P11-11-2010
20110127558LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME - There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.06-02-2011

Patent applications by Hun Joo Hahm, Seongnam KR

Hun Joo Hahm, Gyeonggi-Do KR

Patent application numberDescriptionPublished
20090021932BACKLIGHT UNIT - Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.01-22-2009
20090135332Backlight unit and liquid crystal display device having the same - Provided is a backlight unit of an LCD device including a printed circuit board; a plurality of light emitting diodes (LEDs) mounted on the printed circuit board; and a bottom chassis formed with only an outer frame and having the printed circuit board housed thereon.05-28-2009
20090168399BACKLIGHT UNIT - Provided is a backlight unit including a plurality of light emitting diodes (LEDs) that emit light; a plurality of LED modules having a printed circuit board (PCB) which supports and drives the plurality of LEDs; a plurality of optical sheets that are attached to the top surfaces of the respective LED modules; and a plurality of heat radiating pads that are attached to the rear surfaces of the respective LED modules.07-02-2009
20100001306LIGHT EMITTING DIODE PACKAGE - The present invention provides a light emitting diode package which includes a lead frame with a cavity; a mold exposing the cavity and housing the lead frame; and an LED chip mounted on the cavity, wherein light passing an upper edge of the LED chip passes an upper edge of the cavity.01-07-2010

Hun Joo Hahm, Gyunggi-Do KR

Patent application numberDescriptionPublished
20090197360LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.08-06-2009