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Hui-Yen

Hui-Yen Huang, Hsin Chu City TW

Patent application numberDescriptionPublished
20090239319Package for a light emitting diode and a process for fabricating the same - A package for an LED, comprises a metal substrate, at least one LED chip, and an insulative housing, wherein the metal substrate has a first terminal and a second terminal, and the first terminal is formed with a recess. The at least one LED chip is arranged in the recess of the first terminal of the metal substrate, wherein the chip is electrically connected with the first terminal and the second terminal of the metal substrate. Since the insulative housing caps the chip and the metal substrate, and the LED package can be reduced in size.09-24-2009

Patent applications by Hui-Yen Huang, Hsin Chu City TW

Hui-Yen Huang, Hsinchu City TW

Patent application numberDescriptionPublished
20090050922Front and rear covering type LED package structure and method for packaging the same - A front and rear covering type LED package structure includes an insulating body, a substrate unit, at least one light-emitting element, and a package colloid. The insulating body has a receiving space. The substrate unit has two electrode pins separated from each other. Each electrode pin has one side covered by the insulating body. Each electrode pin has another side bent into a U-shape and exposed outside the insulating body in order to cover two opposite lateral sides and front and rear sides of the insulating body by a front and rear covering method. The at least one light-emitting element is received in the receiving space and electrically connected with the two electrode pins of the substrate unit. The package colloid is filled into the receiving space of the insulating body.02-26-2009
20090186434Led chip package structre with a plurality of thick guiding and a method for manufactruing the same - An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.07-23-2009

Hui-Yen Wang, Hsichih Taipei Hsien TW

Patent application numberDescriptionPublished
20100075650METHOD OF CHANGING STATUS OF INSTANT MESSAGE SOFTWARE - This invention provides a software status configuration method and a mobile communication device using the same. The mobile communication device has a real-time operation mode and a real-time usage status, respectively representing the status of the user and the usage of the mobile communication device. The mobile communication device further includes a network communication software for performing real-time communication with other contacts online. The network communication software has a user status for indicating whether the user is available for real-time communication. The software status configuration method of the present invention will configure the user status based on combinations of the current real-time operation mode and the real-time usage status.03-25-2010

Hui-Yen Wu, Zhudong Township TW

Patent application numberDescriptionPublished
20100168221PHARMACEUTICAL COMPOSITION FOR TREATING HEPATITIS B VIRUS AND HEALTH FOOD PRODUCT HAVING HEPATITIS B VIRUS INHIBITING EFFECTS - The invention provides a pharmaceutical composition for treating hepatitis B, including: an effective amount of proanthocyanidins; and a pharmaceutically acceptable carrier or salt, wherein a formula of the monomer of the proanthocyanidins is shown in the following:07-01-2010