| Patent application number | Description | Published |
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| 20080245607 | AIR EXHAUST/INLET SOUND ATTENUATION MECHANISM - An attenuation mechanism for an electronic device is presented. The attenuation mechanism includes an outer member that has an inner member oriented axially within the outer member. The inner member has an axial twist that causes a line of sight blockage between an exterior and an interior of a housing of an electronic device when the attenuation mechanism is mounted through the housing, such that sound and electromagnetic radiation is attenuated without obstructing cooling air that is flowing through the housing. | 10-09-2008 |
| 20090056350 | BIMETALLIC HEAT SINK AIR DEFLECTORS FOR DIRECTED AIRFLOW FOR IMPROVED THERMAL TRANSFER AND DISSIPATION - A cooling apparatus, includes: one or more bimetallic deflectors attached to a mounting post, the mounting post configured for mating engagement with a protrusion of a heat sink, such that the one or more bimetallic deflectors are in thermal contact with the protrusion when the mounting post is engaged therewith; wherein the bimetallic deflectors are configured to deflect in response to thermal energy conducted from the protrusions so as to change a direction of airflow incident thereupon. | 03-05-2009 |
| 20090090281 | Anti-Tilt Pallet and Method for Shipping and Installing a Computer Rack Therewith - An anti-tilt pallet includes a first sub-frame and a second sub-frame. The first sub-frame has a first vertical support member, a first extension member and a second extension member. The second sub-frame has a second vertical support member, a third extension member and a fourth extension member. The first through fourth extension members each have an alignment hole therethrough. A plurality of first alignment members are disposed in the alignment holes of the first extension member and the third extension member to align the first extension member with the third extension member, and a plurality of second alignment members are disposed in the alignment holes of the second extension member and the fourth extension member to align the second extension member with the fourth extension member. A slot is configured to removably receive a weight in at least one of the first sub-frame and the second sub-frame. | 04-09-2009 |
| 20090205694 | Thermoelectric Generation Device for Energy Recovery - A thermoelectric generation device is configured for mounting on cooling tubes of a heat exchanger of a computer room air conditioning unit in a data center. A first type of Seebeck material and a second type of Seebeck material are arranged in a matrix and connected in series. An electrically insulating, but thermally conducting plate is located on either side of the device. The device is mounted physically on cooling tubes of the heat exchanger and exposed on the other side to the warm air environment. As a result of the temperature difference a voltage is generated that may be used to power an electrical load connected thereto. | 08-20-2009 |
| 20100226090 | TEMPERATURE CONTROL SYSTEM FOR AN ELECTRONIC DEVICE CABINET - An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones. | 09-09-2010 |
| 20110063796 | ENDOTHERMIC REACTION APPARATUS FOR REMOVING EXCESS HEAT IN A DATACENTER - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 03-17-2011 |
| Patent application number | Description | Published |
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| 20080218967 | Real Time Adaptive Active Fluid Flow Cooling - The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element. | 09-11-2008 |
| 20080225481 | Real Time Adaptive Active Fluid Flow Cooling - The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element. | 09-18-2008 |
| 20090078918 | Methods and Structures With Fire Retardant Spheres for Implementing Enhanced Fire Protection - A method and fire retardant structures including fire retardant spheres are provided for implementing enhanced fire protection. A selected first fire retardant material is encapsulated in microspheres. The microspheres have a predefined melting temperature within a defined temperature range. The fire retardant structure is formed of the microspheres encapsulating the selected fire retardant material and included in an article being produced. In response to a fire event, the microspheres rupture or decompose releasing the encapsulated material to provide fire suppression. Alternatively, a fire retardant structure is formed of second microspheres having predefined expansion characteristics. A layer of the second microspheres is disposed between two layers of an article being produced. In response to a thermal fire event, the microspheres expand to fill the space between the layers, providing fire suppression | 03-26-2009 |
| 20090103266 | COOLING SYSTEM EMPLOYING A HEAT EXCHANGER WITH PHASE CHANGE MATERIAL, AND METHOD OF OPERATION THEREOF - A heat exchanger for use, e.g., in a rear door of a server rack in a computer room, made up of pipes clad with a layer of a phase change material, such as a paraffin, so that latent heat is absorbed in the conversion from the solid to the liquid state. Preferably, each pipe in turn is opened by a control valve and chilled coolant flows through the pipe until the phase change material reverts back to the solid state. Then, the control valve is again closed, and the phase change material is further heated by waste heat so that it is melted once more. Preferably, the control valve for only one pipe at a time is opened, so that latent heat is being absorbed by the phase change material around all pipes but one. | 04-23-2009 |
| 20100193175 | Heat Sink Apparatus with Extendable Pin Fins - An apparatus for cooling a heat-generating component is disclosed. The apparatus includes a cooling chamber containing a liquid metal. The cooling chamber has a heat-conducting wall thermally coupled to the heat-generating component. A plurality of extendable tubes making up an array of cooling pin fins is attached to the cooling chamber. Each of the extendable tubes has a port end that opens into the cooling chamber and a sealed end that projects away from the cooling chamber. Moreover, each of the extendable tubes has an extended position when filled with liquid metal from the cooling chamber and a retracted position when emptied of the liquid metal. A pump system is included for urging the liquid metal from the cooling chamber into the plurality of extendable tubes. | 08-05-2010 |
| 20100195694 | Heat Flow Measurement Tool for a Rack Mounted Assembly of Electronic Equipment - A rack mount assembly measurement tool, for determining physical values including air flow and heat loads, includes a front assembly and a rear duct assembly that are non-intrusively and releasably mounted on the front and rear of such rack mount enclosure. Physical values are sensed at multiple vertical locations to enable a determination of overall and localized heat loads within the enclosure. Front sensor values are collected and wirelessly transmitted from the front assembly to a receiver/processor supported on the rear duct, which generates computed values that are displayed in addition to the sensed values. | 08-05-2010 |
