| Patent application number | Description | Published |
|---|
| 20080283195 | COMBINATION TYPE TAPE DISPENSER - A combination type tape dispenser includes a first member having a cutter and a first tape roll mount, and a second member having a second tape roll mount. The first member and the second member is manipulative to be combined and separated. When the first member and the second member are combined, the first member and the second member form a big tape dispenser to mount a big tape roll on the second tape roll mount and cut a tape of the big tape roll by the cutter. When the first member and the second member are separated, the first member forms a small tape dispenser to mount a small tape roll on the first tape roll mount and cut a tape of the small tape roll by the cutter. | 11-20-2008 |
| 20080290212 | TAPE DISPENSER WITH REEL BRAKE - A tape dispenser includes a base, an axle on the base, a tape reel fitted to the axle and a brake device. The axle has a fixing portion. The brake device has a base member with a hole complementary to the fixing portion and a friction member. The brake device fitted to the axle with the hole engaged with the fixing portion for restriction the brake device from rotation and with the friction member pressing the tape reel to provide the tape reel a friction when the tape reel rotates to provide the tape a tension for cutting off. | 11-27-2008 |
| 20090050729 | STRETCH FILM DISPENSER WITH BRAKE DEVICE - A stretch film dispenser includes a base, a reel and two brake devices. The reel is connected to the base for rotation. The brake devices are connected to two flexible members on an outer annular wall of the base to be pressed for braking the reel. | 02-26-2009 |
| 20090194629 | STRETCH FILM DISPENSER - The present invention provides a stretch film dispenser, which includes a base, a reel device, and a brake device. The reel device has a reel and a connecting member pivotally connected to the base, and the brake device is connected to the base and is fitted to the connecting member of the reel device. The base and the brake device form a holding member of the stretch film dispenser to be grasped by an operator. The present invention further provides a second reel to be fitted to the reel of the reel dispenser to dispense the stretch film rolls with different core diameter. | 08-06-2009 |
| Patent application number | Description | Published |
|---|
| 20090181591 | FIREPROOF KNITTING FABRIC - A fireproof knitting fabric includes an interior lining and an exterior layer. The interior lining is obtained by interweaving flame retardant fiber. The exterior layer is obtained by carburizing oxidized PAN yarn (O.X.PAN) and then interweaving the oxidized PAN yarn and the flame retardant fiber of the interior lining. The obtained fireproof knitting fabric is featured by fireproofness, thermal insulation, light weight, soft and comfortable texture. | 07-16-2009 |
| 20090243136 | METHOD OF MANUFACTURING MULTI-FUNCTIONAL YARN FIBER MATERIAL - A method of manufacturing multi-functional yarn fiber material by mixing silver ion in the range of from wt. 5% to wt. 15% and functional powder in the range of from wt. 85% to wt. 95% is provided. The functional powder is one of coconut shell charcoal powder, bamboo charcoal powder, germanium powder, titanium dioxide powder, and aluminum oxide powder so as to produce the material which is applied in many purposes such as germproof, deodorization, producing far infrared ray and anion, balancing ion, anti-ultraviolet ray, cool, and comfort. | 10-01-2009 |
| Patent application number | Description | Published |
|---|
| 20080283994 | Stacked package structure and fabrication method thereof - A stacked package structure and fabrication method thereof are disclosed, including providing a substrate having a plurality of stackable solder pads formed on surface thereof for allowing at least one semiconductor chip to be electrically connected to the substrate; forming an encapsulant for encapsulating the semiconductor chip and further exposing the stackable solder pads from the encapsulant, thus forming a lower-layer semiconductor package; forming conductive bumps on at least one stackable solder pad by means of wire bonding such that at least one upper-layer semiconductor package can be mounted via solder balls on the conductive bumps and the stackable solder pads of the lower-layer semiconductor package to form a stacked package structure, wherein, stacking height of the solder balls and the conductive bumps is greater than height of the encapsulant of the lower-layer semiconductor package, thus, when stacking fine pitch semiconductor packages or when warps occur to the upper-layer semiconductor package or the lower-layer semiconductor package, the conductive bumps can compensate for inadequate height caused by solder ball collapse or fill up gaps between the solder balls and the stackable solder pads caused by warps, thereby allowing the solder balls to be able to effectively contact and wet on the substrate of the lower-layer semiconductor package. | 11-20-2008 |
| 20090014860 | Multi-chip stack structure and fabricating method thereof - A multi-chip stack structure and a manufacturing method thereof are provided. The fabrication method includes the steps of: providing a chip carrier having a first surface and a second surface opposing thereto and at least a first chip and a second chip mounted on the first surface; electrically connecting the chips to the chip carrier by a plurality of bonding wires; and stacking at least a third chip on the first and second chips by a film deposed therebetween, wherein the third chip is stepwise stacked on the first chip and at least a part of the bonding wire connected to the second chip is covered by the film, and electrically connecting the third chip and the chip carrier by a bonding wire, thereby enabling a plurality of chips to be stacked on the chip carrier to enhance the electrical performance of electronic products. | 01-15-2009 |
| 20090140440 | MULTI-CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME - A multi-chip stack structure and a method for fabricating the same are provided. The method for fabricating a multi-chip stack structure includes disposing a first chip group comprising a plurality of first chips on a chip carrier by using a step-like manner, disposing a second chip on the first chip on top of the first chip group, electrically connecting the first chip group and the second chip to the chip carrier through bonding wires, using film over wire (FOW) to stack a third chip on the first and the second chips with an insulative film provided therebetween, wherein the insulative film covers part of the ends of the bonding wires of the first chip on the top of the first group and at least part of the second chip, and electrically connecting the third chip to the chip carrier through bonding wires, thereby preventing directly disposing on a first chip a second chip having a planar size far smaller than that of the first chip as in the prior art that increases height of the entire structure and increases the wiring bonding difficulty. | 06-04-2009 |
| 20090294959 | Semiconductor package device, semiconductor package structure, and fabrication methods thereof - A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer. | 12-03-2009 |
| Patent application number | Description | Published |
|---|
| 20100221969 | FUNCTIONAL FIBER, PREPARATION METHOD THEREOF AND FABRIC MADE OF IT - A functional fiber, preparation method thereof and the fabric made of it are provided. The preparation method includes the following steps: rolling and milling plural first polyolefine chips, constant thermoplastic elastomer (TPE) and plural functional particles into plural masterbatches in twin-screw extruder; melting and mixing the plural functional masterbatches and plural second polyolefine chips which are the same as the first polyolefine into the composite material, wherein the final content of the plural functional particles are 1-10 wt. % based on the weight of the composite material; producing fibers with the composite material by spinning, cooling, heat stretching, and heat setting. The fiber may be made into fabric. The fiber and fabric have the function of deodorization, antibiosis, mildew-proof or generating negative ion and further improve the air filtration effect. | 09-02-2010 |
| 20100227522 | IMITATING NATURAL PLANT FIBER, PREPARATION METHOD THEREOF AND FABRIC MADE OF IT - An imitating natural plant fiber, preparation method thereof and the fabric made of it are provided. The preparation method includes the following steps: rolling and milling the mixture of plural first polyolefine chips, constant thermoplastic elastomer (TPE) and plural microcapsules which encapsulate essential oil extracted from natural plant in the twin-screw extruder, thus plural masterbatches can be made; melting and mixing the above masterbatches and plural second polyolefine which is same as the first one, thus a composite can be made, wherein the final content of the microcapsules is 1-32% by weight; and producing fibers by spinning, cooling, heat stretching, and heat setting. The fiber and the fabric made of it have durable natural plant aroma. | 09-09-2010 |
