Huang, Taichung Hsien
Chien-Ping Huang, Taichung Hsien TW
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20080303111 | Sensor package and method for fabricating the same - The invention discloses a sensor package and a method for fabricating the same. The sensor package includes: a substrate with an opening; a sensor chip disposed in the opening and electrically connected to the substrate; an encapsulant filling spacing between the sensor chip and the opening so as to secure the sensor chip to the substrate; and a transparent cover attached to the substrate via an adhesive layer, wherein the adhesive layer covers the sensor chip and bonding wires and is formed with an opening for exposing sensor region of the sensor chip. Securing the sensor chip in the opening of the substrate reduces the height of the sensor package, and meanwhile the process cost is reduced by eliminating the need of formation of conductive bumps on the sensor chip or the transparent cover and eliminating the need of specially designed substrate. | 12-11-2008 |
Ching-Lin Huang, Taichung Hsien TW
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20120205215 | Clutch Device for a Needle Bar of a Sewing Machine - A clutch device used to couple/decouple a reciprocating force of a drive member to/from a needle bar in a sewing machine includes an actuating lever actuated by an electromechanical unit to be pivotable between an idle position to disengage from an actuated end of a clutch lever so as to leave a grasp end of the clutch lever in a coupled state, where the grasp end is engaged with a coupled portion disposed on a drive member, thereby transmit the reciprocating force to the needle bar, and an actuating position to be in pressing engagement with the actuated end so as to displace the grasp end to a decoupled state, where the grasp end is disengaged from the coupled portion. | 08-16-2012 |
Fu-Tang Huang, Taichung Hsien TW
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20140183755 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, which includes a carrier having a mounting area and at least a grounding pad; a substrate body having opposite first and second surfaces and a plurality of conductive vias each having a first end exposed from the first surface and a second end opposite to the first end, the substrate body being disposed on the mounting area of the carrier through the second surface thereof; a metal layer formed on the first surface of the substrate body and exposing the first ends of the conductive vias; a conductive body electrically connecting the metal layer and the grounding pad; and a semiconductor element disposed on the substrate body and electrically connected to the first ends of the conductive vias, thereby achieving an EMI shielding effect to prevent interference between electromagnetic waves or electrical signals of the substrate body and the semiconductor element. | 07-03-2014 |
20140327131 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers. | 11-06-2014 |
Harrison Huang, Taichung Hsien TW
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20080283195 | COMBINATION TYPE TAPE DISPENSER - A combination type tape dispenser includes a first member having a cutter and a first tape roll mount, and a second member having a second tape roll mount. The first member and the second member is manipulative to be combined and separated. When the first member and the second member are combined, the first member and the second member form a big tape dispenser to mount a big tape roll on the second tape roll mount and cut a tape of the big tape roll by the cutter. When the first member and the second member are separated, the first member forms a small tape dispenser to mount a small tape roll on the first tape roll mount and cut a tape of the small tape roll by the cutter. | 11-20-2008 |
20080290212 | TAPE DISPENSER WITH REEL BRAKE - A tape dispenser includes a base, an axle on the base, a tape reel fitted to the axle and a brake device. The axle has a fixing portion. The brake device has a base member with a hole complementary to the fixing portion and a friction member. The brake device fitted to the axle with the hole engaged with the fixing portion for restriction the brake device from rotation and with the friction member pressing the tape reel to provide the tape reel a friction when the tape reel rotates to provide the tape a tension for cutting off. | 11-27-2008 |
20090050729 | STRETCH FILM DISPENSER WITH BRAKE DEVICE - A stretch film dispenser includes a base, a reel and two brake devices. The reel is connected to the base for rotation. The brake devices are connected to two flexible members on an outer annular wall of the base to be pressed for braking the reel. | 02-26-2009 |
20090194629 | STRETCH FILM DISPENSER - The present invention provides a stretch film dispenser, which includes a base, a reel device, and a brake device. The reel device has a reel and a connecting member pivotally connected to the base, and the brake device is connected to the base and is fitted to the connecting member of the reel device. The base and the brake device form a holding member of the stretch film dispenser to be grasped by an operator. The present invention further provides a second reel to be fitted to the reel of the reel dispenser to dispense the stretch film rolls with different core diameter. | 08-06-2009 |
Hsiao-Chun Huang, Taichung Hsien TW
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20140217605 | INTERCONNECTION STRUCTURE FOR PACKAGE AND FABRICATION METHOD THEREOF - An interconnection structure for a package is disclosed. The interconnection structure includes a substrate body having a conductive portion formed on a surface thereof; a first photosensitive dielectric layer formed on the surface of the substrate body and having a via for exposing the conductive potion; a conductive via formed in the via; a second photosensitive dielectric layer formed on the first photosensitive dielectric layer and having a opening for exposing the conductive via and a portion of the first photosensitive dielectric layer; and a conductive trace layer formed in the opening of the second photosensitive dielectric layer so as to be electrically connected to the conductive portion through the conductive via, thereby simplifying the fabrication process and reducing the fabrication cost and time. | 08-07-2014 |
Huang-Shan Huang, Taichung Hsien TW
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20090181591 | FIREPROOF KNITTING FABRIC - A fireproof knitting fabric includes an interior lining and an exterior layer. The interior lining is obtained by interweaving flame retardant fiber. The exterior layer is obtained by carburizing oxidized PAN yarn (O.X.PAN) and then interweaving the oxidized PAN yarn and the flame retardant fiber of the interior lining. The obtained fireproof knitting fabric is featured by fireproofness, thermal insulation, light weight, soft and comfortable texture. | 07-16-2009 |
20090243136 | METHOD OF MANUFACTURING MULTI-FUNCTIONAL YARN FIBER MATERIAL - A method of manufacturing multi-functional yarn fiber material by mixing silver ion in the range of from wt. 5% to wt. 15% and functional powder in the range of from wt. 85% to wt. 95% is provided. The functional powder is one of coconut shell charcoal powder, bamboo charcoal powder, germanium powder, titanium dioxide powder, and aluminum oxide powder so as to produce the material which is applied in many purposes such as germproof, deodorization, producing far infrared ray and anion, balancing ion, anti-ultraviolet ray, cool, and comfort. | 10-01-2009 |
Huei-Nuan Huang, Taichung Hsien TW
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20130256915 | PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package includes a packaging substrate having a die attach area, a plurality of flow-guiding blocks disposed around an outer periphery of the die attach area, a first semiconductor element mounted on the die attach area, a second semiconductor element mounted on the first semiconductor element, and an underfill formed between the packaging substrate and the second semiconductor element. During filling of the underfill between the packaging substrate and the second semiconductor element, the flow-guiding blocks can guide a portion of the underfill to flow between the first semiconductor element and the second semiconductor element such that only one dispensing process is required for the underfill to completely encapsulate all conductive bumps used for flip-chip interconnection, thereby simplifying the fabrication process and improving the production efficiency. | 10-03-2013 |
Jung-Pin Huang, Taichung Hsien TW
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20080283994 | Stacked package structure and fabrication method thereof - A stacked package structure and fabrication method thereof are disclosed, including providing a substrate having a plurality of stackable solder pads formed on surface thereof for allowing at least one semiconductor chip to be electrically connected to the substrate; forming an encapsulant for encapsulating the semiconductor chip and further exposing the stackable solder pads from the encapsulant, thus forming a lower-layer semiconductor package; forming conductive bumps on at least one stackable solder pad by means of wire bonding such that at least one upper-layer semiconductor package can be mounted via solder balls on the conductive bumps and the stackable solder pads of the lower-layer semiconductor package to form a stacked package structure, wherein, stacking height of the solder balls and the conductive bumps is greater than height of the encapsulant of the lower-layer semiconductor package, thus, when stacking fine pitch semiconductor packages or when warps occur to the upper-layer semiconductor package or the lower-layer semiconductor package, the conductive bumps can compensate for inadequate height caused by solder ball collapse or fill up gaps between the solder balls and the stackable solder pads caused by warps, thereby allowing the solder balls to be able to effectively contact and wet on the substrate of the lower-layer semiconductor package. | 11-20-2008 |
20090014860 | Multi-chip stack structure and fabricating method thereof - A multi-chip stack structure and a manufacturing method thereof are provided. The fabrication method includes the steps of: providing a chip carrier having a first surface and a second surface opposing thereto and at least a first chip and a second chip mounted on the first surface; electrically connecting the chips to the chip carrier by a plurality of bonding wires; and stacking at least a third chip on the first and second chips by a film deposed therebetween, wherein the third chip is stepwise stacked on the first chip and at least a part of the bonding wire connected to the second chip is covered by the film, and electrically connecting the third chip and the chip carrier by a bonding wire, thereby enabling a plurality of chips to be stacked on the chip carrier to enhance the electrical performance of electronic products. | 01-15-2009 |
20090140440 | MULTI-CHIP STACK STRUCTURE AND METHOD FOR FABRICATING THE SAME - A multi-chip stack structure and a method for fabricating the same are provided. The method for fabricating a multi-chip stack structure includes disposing a first chip group comprising a plurality of first chips on a chip carrier by using a step-like manner, disposing a second chip on the first chip on top of the first chip group, electrically connecting the first chip group and the second chip to the chip carrier through bonding wires, using film over wire (FOW) to stack a third chip on the first and the second chips with an insulative film provided therebetween, wherein the insulative film covers part of the ends of the bonding wires of the first chip on the top of the first group and at least part of the second chip, and electrically connecting the third chip to the chip carrier through bonding wires, thereby preventing directly disposing on a first chip a second chip having a planar size far smaller than that of the first chip as in the prior art that increases height of the entire structure and increases the wiring bonding difficulty. | 06-04-2009 |
20090294959 | Semiconductor package device, semiconductor package structure, and fabrication methods thereof - A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer. | 12-03-2009 |
20140192832 | ELECTRO-OPTICAL MODULE - An electro-optical module is provided, which includes: a substrate having a first surface with a groove and an opposite second surface; a plurality of support members disposed on the first surface of the substrate; at least an electro-optical element having opposite active and non-active surfaces and disposed in the groove of the substrate via the non-active surface thereof; an interposer disposed on the first surface of the substrate and the electro-optical element for electrically connecting the electro-optical element to the substrate, wherein the interposer has a through hole corresponding in position to the active surface of the electro-optical element; and a transparent plate disposed over the first surface of the substrate and the interposer through the support members and having a lens portion corresponding in position to the through hole of the interposer, thereby reducing signal losses, improving alignment precision, and achieving preferred thermal dissipation and EMI shielding effects. | 07-10-2014 |
Kuang-Wei Huang, Taichung Hsien TW
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20130320463 | PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF - A package structure includes: a substrate having a plurality of first conductive pads and a plurality of second conductive pads; an MEMS element disposed on the substrate; a cover member disposed on the MEMS element and having a metal layer formed thereon; a plurality of bonding wires electrically connected to the MEMS element and the second conductive pads of the substrate; a plurality of first wire segments, each having one end electrically connected to a corresponding one of the first conductive pads; and an encapsulant formed on the substrate and encapsulating the MEMS element, the cover member, the first wire segments and the bonding wires, wherein the other end of each of the first wire segments is exposed from the encapsulant. Compared with the prior art, the package structure of the present invention has improved overall yield and functionality. | 12-05-2013 |
20130341739 | PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEM ELEMENT AND METHOD OF FABRICATION THE SAME - A package structure is provided, including: a substrate having a ground pad and an MEMS element; a lid disposed on the substrate for covering the MEMS element; a wire segment electrically connected to the ground pad; an encapsulant encapsulating the lid and the wire segment; and a circuit layer formed on the encapsulant and electrically connected to the wire segment and the lid so as to commonly ground the substrate and the lid, thereby releasing accumulated electric charges on the lid so as to improve the reliability of the MEMS system and reduce the number of I/O connections. | 12-26-2013 |
Ming-Hui Huang, Taichung Hsien TW
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20090000449 | Tightening device for positioning a worktable of a machine tool relative to a base - A tightening device for positioning a worktable of a machine tool to a base includes a saddle member disposed on the base, and a positioning carrier member carrying the worktable and movable relative to an abutment wall of the saddle member. An elongate adjusting member has a force-delivering end spaced apart from the abutment wall, and a middle threaded segment threadedly engaged with the positioning carrier member such that the force-delivering end is movable towards or away from the abutment wall. A force transmitting member is loosely connected to the positioning carrier member, and is configured such that a spiral force resulting from a screw-in movement is taken up by a proximate end thereof from the force-delivering end, and is transformed to a translation force that moves a distal end thereof to tightly engage the abutment wall. | 01-01-2009 |
Ming-Traise Huang, Taichung Hsien TW
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20090243136 | METHOD OF MANUFACTURING MULTI-FUNCTIONAL YARN FIBER MATERIAL - A method of manufacturing multi-functional yarn fiber material by mixing silver ion in the range of from wt. 5% to wt. 15% and functional powder in the range of from wt. 85% to wt. 95% is provided. The functional powder is one of coconut shell charcoal powder, bamboo charcoal powder, germanium powder, titanium dioxide powder, and aluminum oxide powder so as to produce the material which is applied in many purposes such as germproof, deodorization, producing far infrared ray and anion, balancing ion, anti-ultraviolet ray, cool, and comfort. | 10-01-2009 |
Pin-Cheng Huang, Taichung Hsien TW
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20140073087 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE - A method of fabricating a semiconductor package is provided, including: providing a substrate having opposite first and second surfaces and a plurality of conductive through holes penetrating the first and second surfaces, disposing the substrate on a first carrier through the second surface thereof, and keeping the first carrier flat and free of warpage; attaching at least a first semiconductor chip to the first surface of the substrate and electrically connecting the first semiconductor chip and the substrate; removing the first carrier; and attaching the substrate to a packaging substrate through the second surface thereof and electrically connecting the substrate and the packaging substrate, thereby preventing the semiconductor package from warpage, increasing product yield, reducing fabrication cost, and improving thermal dissipation. | 03-13-2014 |
20140118019 | METHOD OF TESTING A SEMICONDUCTOR STRUCTURE - A method of testing a semiconductor structure is provided, including providing at least a semiconductor structure having an interposer and a semiconductor element disposed on the interposer; disposing the semiconductor structure on a carrier having a supporting portion, with the interposer being supported by the supporting portion; and performing a test process. The semiconductor structure has been tested for its electrical performance prior to packaging, thereby eliminating the necessity for a conductive pathway to pass through an inner circuit of an package substrate. Therefore, the testing process is accelerated and the time is save. | 05-01-2014 |
Steve Huang, Taichung Hsien TW
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20080291659 | Table Having Luminescent Device - A table comprises a tabletop penetrable by light, at least one pedestal supporting the tabletop from a surface and a luminescent panel including a side attached to an underside of the tabletop. The light produced by luminescent panel can pass through the tabletop. | 11-27-2008 |
Te-Li Huang, Taichung Hsien TW
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20100267308 | Building block system - A building block system includes sphere assemblies of four predetermined shapes. Each of the predetermined shapes is formed by two or more spheres. To play with the building block system, the sphere assemblies totally include fourteen spheres are to be posed vertically or horizontally to form a three-layer pyramid on a square seat region composed of nine spherical recesses. | 10-21-2010 |
Tina Huang, Taichung Hsien TW
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20100221969 | FUNCTIONAL FIBER, PREPARATION METHOD THEREOF AND FABRIC MADE OF IT - A functional fiber, preparation method thereof and the fabric made of it are provided. The preparation method includes the following steps: rolling and milling plural first polyolefine chips, constant thermoplastic elastomer (TPE) and plural functional particles into plural masterbatches in twin-screw extruder; melting and mixing the plural functional masterbatches and plural second polyolefine chips which are the same as the first polyolefine into the composite material, wherein the final content of the plural functional particles are 1-10 wt. % based on the weight of the composite material; producing fibers with the composite material by spinning, cooling, heat stretching, and heat setting. The fiber may be made into fabric. The fiber and fabric have the function of deodorization, antibiosis, mildew-proof or generating negative ion and further improve the air filtration effect. | 09-02-2010 |
20100227522 | IMITATING NATURAL PLANT FIBER, PREPARATION METHOD THEREOF AND FABRIC MADE OF IT - An imitating natural plant fiber, preparation method thereof and the fabric made of it are provided. The preparation method includes the following steps: rolling and milling the mixture of plural first polyolefine chips, constant thermoplastic elastomer (TPE) and plural microcapsules which encapsulate essential oil extracted from natural plant in the twin-screw extruder, thus plural masterbatches can be made; melting and mixing the above masterbatches and plural second polyolefine which is same as the first one, thus a composite can be made, wherein the final content of the microcapsules is 1-32% by weight; and producing fibers by spinning, cooling, heat stretching, and heat setting. The fiber and the fabric made of it have durable natural plant aroma. | 09-09-2010 |