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| 20080237854 | METHOD FOR FORMING CONTACT PADS - First, a substrate having a conductor therein is provided. Next, a first dielectric layer is disposed on the conductor and the substrate and a first opening is formed in the first dielectric layer for exposing the conductor. A first metal layer is deposited over the surface of the first dielectric layer and into the first opening. Next, an etching stop layer and a second metal layer are deposited over the surface of the first metal layer, and a pattern transfer process is performed by using a second dielectric layer as a mask to remove a portion of the first metal layer, the etching stop layer, and the second metal layer for exposing the first dielectric layer. A passivation layer is disposed on the second metal layer and the first dielectric layer and a second opening is formed in the passivation layer to expose a portion of the second metal layer. | 10-02-2008 |
| 20080246144 | METHOD FOR FABRICATING CONTACT PADS - A method for fabricating a contact pad is disclosed. A first metal layer is disposed on a substrate for serving as a probing region. A second metal layer is disposed on the substrate thereafter to serve as an electrical connection region. Preferably, the first metal layer and the second metal layer are composed of different material and are electrically connected. The present invention uses two different metals to form a probing region and an electrical connection region of a contact pad. The probing region is used for providing a contacting surface for a test probe, whereas the electrical connection region is used for establishing an electrical connection in the later bumping or wire bonding process. By providing a contact pad having two different regions, the present invention is able to achieve probing process while prevent the surface of the contact pad from being damaged by the contact of test probes. | 10-09-2008 |
| 20080303177 | BONDING PAD STRUCTURE - A bonding pad structure including a bonding pad and a passivation layer is described. The bonding pad is disposed on a chip. The passivation layer covers the bonding pad. In addition, the passivation layer has a first opening exposing a bonding region of the bonding pad and a second opening exposing a probing region of the bonding pad, respectively. | 12-11-2008 |
| 20090033346 | GROUP PROBING OVER ACTIVE AREA PADS ARRANGEMENT - A group probing over active area (POAA) pads arrangement includes a chip having a set of bonding pads, at least a first set of probing pads and a second set of probing pads. Each of the first set of probing pads and the second set of probing pads are electrically connected to one of the corresponding bonding pads, respectively. And each of the first set of probing pads and the second set of probing pads are interlaced in a diagonal line pattern. According to a concept of grouping and interlacing the probing pads, each bonding pad obtains at least two probing pads. Therefore times of test probing performed on each probing pad are reduced and repeated probe's pressures toward inter metal dielectric (IMD) layers underneath the probing pads are consequently reduced. | 02-05-2009 |
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| 20100288345 | QUANTUM DOT THIN FILM SOLAR CELL - A quantum dot thin film solar cell is provided, which at least includes a first electrode layer, an optical active layer, and a second electrode layer sequentially deposited on a substrate. A plurality of quantum dots is formed in the optical active layer. Since the plurality of quantum dots and the optical active layer are formed through co-sputtering, an interface adhesion between the plurality of quantum dots and the optical active layer is good in this quantum dot thin film solar cell. | 11-18-2010 |
| 20110120540 | QUANTUM DOT DYE-SENSITIZED SOLAR CELL - A quantum dot dye-sensitized solar cell (QDDSSC) including an anode, a cathode, and an electrolyte between the anode and the cathode is provided. The anode includes a semiconductor electrode layer adsorbed with a dye, a plurality of quantum dots distributed within the semiconductor electrode layer, and a plurality of metal nanoparticles distributed within the semiconductor electrode layer. Because the absorption spectra of the quantum dots, the dye, and the semiconductor electrode layer cover the infrared (IR), visible, and ultraviolet (UV) regions of the solar spectrum, IR to UV light in the solar spectrum can be effectively absorbed, and accordingly the conversion efficiency of the solar cell can be improved. Moreover, the metal nanoparticles can increase the light utilization efficiency. | 05-26-2011 |
| 20110303528 | METHOD AND APPARATUS FOR SPUTTERING FILM CONTAINING HIGH VAPOR PRESSURE MATERIAL - A method and an apparatus for sputtering a film containing high vapor pressure material are provided. The apparatus includes a chamber, a sputtering gun installed in the chamber, a complex target disposed on the sputtering gun, and a substrate holder. The complex target includes a main target and a plurality of pellets, and a material of the pellets is at least one high vapor pressure material that is a material with a vapor pressure greater than 1×10 | 12-15-2011 |
| 20120001550 | MAGNETIC MODUE OF ELECTRON CYCLOTRON RESONANCE AND ELECTRON CYCLOTRON RESONANCE APPARATUS USING THE SAME - The present invention provides a magnetic module for electron cyclotron resonance (ECR) and ECR apparatus using the magnetic module, wherein the magnetic module comprises a plurality of layers of supporting ring and a plurality of magnetic pillars. Each of the supporting rings has an outer surface and an inner surface and has a plurality of through holes radially disposed inside the supporting ring. The plurality of pillars are respectively embedded into the plurality of through holes of each supporting ring and magnetic fields of the magnetic pillars in each two adjacent supporting ring are respectively opposite to each other. The ECR apparatus of the present invention is capable of being operated under lower pressure environment for forming a single atom layer on a substrate. | 01-05-2012 |
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| 20110057636 | Method for Reducing Energy Loss in DC-DC Converter and Related Control Device and DC-DC Converter - A method for reducing energy loss in a DC-DC converter comprises detecting an output current of the DC-DC converter to generate a sensing signal, adjusting a frequency of an oscillation signal, comparing a reference signal and a feedback signal of the DC-DC converter to generate a comparison result, comparing the comparison result and the oscillation signal to generate a PWM signal, and determining whether an input end of the DC-DC converter is electrically connected to an output end of the DC-DC converter according to the PWM signal. | 03-10-2011 |
| 20110080755 | Power Supply with Synchronized Clocks and Related DC-DC Converter - A power supply with synchronized clocks includes a transformer for transforming an AC input voltage into a DC input voltage, a delay unit for delaying phase of a standard clock signal to generate a plurality of synchronization clock signals, a major DC-DC converter for adjusting voltage level and phase of the DC input voltage according to one of the plurality of synchronization clock signals to generate a major output voltage, and a plurality of parallel DC-DC converters each for adjusting voltage level and phase of the major output voltage according to one of the plurality of synchronization clock signals to generate a minor output voltage. | 04-07-2011 |
| 20110095741 | Control Device for DC-DC Converter and Related DC-DC Converter - A control device for a DC-DC converter includes a PWM controller for generating a PWM signal to a switch module of the DC-DC converter according to a feedback signal of the DC-DC converter, a logic circuit for generating a selection signal according to a magnitude of an output current of the DC-DC converter, and a multiplexer coupled to a plurality of voltages for selecting one of the plurality of voltages to be a supply voltage according to the selection signal. | 04-28-2011 |
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| 20090167285 | RESONANCE CIRCUIT FOR USE IN H-BRIDGE DC-DC CONVERTER - The present invention discloses a resonance circuit for use in an H-bridge DC-DC converter, the resonance circuit comprising: an H-bridge converter, capable of converting unstable DC power into stable DC power; a first resonance circuit, disposed on a buck side of the H-bridge converter for reducing the turn-off loss of a first active switching element; and a second resonance circuit, disposed on a boost side of the H-bridge converter for reducing the turn-on loss of a second active switching element. The H-bridge converter comprises: a first active switching element and a second active switching element; a coupled inductor with dual windings capable of storing energy; and a first passive switching element and a second passive switching element. The first resonance circuit comprises: a first inductor, a second inductor, a first auxiliary inductor, a first passive switching element, a second passive switching element and a first auxiliary capacitor, wherein the second inductor comprises a primary winding and an auxiliary winding. The second resonance circuit comprises: a second auxiliary inductor, a third active switching element, a first auxiliary inductor, a first passive switching element, a fourth passive switching element, a third capacitor, a fourth capacitor and a second auxiliary capacitor. | 07-02-2009 |
| 20090168460 | APPARATUS FOR CONTROLLING H-BRIDGE DC-AC INVERTER - The present invention discloses an apparatus for controlling an H-bridge DC-AC inverter, comprising an H-bridge DC-DC converting circuit capable of converting unstable DC power into stable DC power and a full-bridge DC-AC inverting circuit capable of inverting DC power output from the H-bridge DC-DC converting circuit into AC power. The H-bridge DC-DC converting circuit comprises: a first active switching element and a second active switching element; an inductor capable of storing energy; a first passive switching element and a second passive switching element; and a first capacitor and a second capacitor. The full-bridge DC-AC inverting circuit comprises: a third active switching element, a fourth active switching element, a fifth active switching element and a sixth active switching element; an output inductor; and an output capacitor. | 07-02-2009 |
| 20100142233 | POWER CONVERSION DEVICE AND CONTROL METHOD THEREOF - A power conversion device is provided for converting a DC voltage to an alternating current corresponding to an AC voltage according to the AC voltage, which includes a power conversion unit and an output unit. The power conversion unit converts the DC voltage to a high-frequency current having two envelops corresponding to the waveform of the AC voltage. The output unit includes an inductive circuit, a full-wave rectifying circuit, an inverter circuit and a filter circuit. The inductive circuit provides two induced currents according to the high-frequency current, wherein one induced current and the high-frequency current are in phase, and the other induced current and the high-frequency current are in antiphase. The full-wave rectifying circuit full-wave rectifies the two induced currents. The inverter circuit alternatively transfers the two full-wave rectified induced currents, and thus output an output current. The filter circuit filters the output current to provide the alternating current. | 06-10-2010 |
| 20110103107 | RESONANCE CIRCUIT FOR DC-LINK VOLTAGE CONTROL IN DC-TO-AC INVERTER - The present disclosure relates to a resonance circuit for DC-link voltage control in a DC-to-AC inverter. The resonance circuit comprises two active switches. Before the active switches of the DC-to-AC inverter are turned on, a DC-link voltage is isolated by the active switches and the active switches of the DC-to-AC inverter are discharged by the resonance circuit to zero voltage at both ends. Then, the active switches of the DC-to-AC inverter are turned on again after the DC-link voltage is charged by the resonance circuit until the DC-link voltage restores to a normal voltage value. Hence, the active switches of the DC-to-AC inverter achieve zero-voltage switching. Not only the switching loss can be reduced to enhance the conversion efficiency, but also the electro-magnetic interference as well as the RF interference due to dynamic transient changes of the voltage (dv/dt) and of the current (di/dt) can be lowered. | 05-05-2011 |
