Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
Huang, Kaohsiung
Cheng-Shiou Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090212503 | Mechanical Seal - A rotating assembly of a mechanical seal includes a retainer, a pair of compression rings, a shaft sleeve, a first rotating seal ring and a second rotating seal ring. The retainer includes a plurality of spring members and a plurality of slide legs longitudinally extended in opposite directions to define limiting spaces where the compression rings are correspondingly restricted. The compression rings are located at opposite sides of the retainer between which the spring members are arranged. In assembling, the retainer, the compression rings, the first rotating seal ring and the second rotating seal ring are assembled on the shaft sleeve. Spring forces of the spring members can actuate the compression rings to push the first rotating seal ring and the second rotating seal ring in the opposite directions. | 08-27-2009 |
Chen-Hsin Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110111191 | LOW THERMAL-IMPEDANCE INSULATED METAL SUBSTRATE AND METHOD FOR MAUFACTURING THE SAME - A method for manufacturing a low thermal-impedance insulated metal substrate has steps of providing an electrical-conductive metal layer; forming a first thermal-conductive polymeric composite layer on the electrical-conductive metal layer; forming a second thermal-conductive polymeric composite layer on the first thermal-conductive polymeric composite layer; and adhere a thermal-conductive metal layer on the second thermal-conductive polymeric composite layer by hot-pressing process. Therefore, the low thermal-impedance insulated metal substrate of the present invention has lower thermal-impedance, lower coefficient of thermal expansion and higher electrical reliability. | 05-12-2011 |
Chia-Ying Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100146373 | CONFIGURABLE HIERARCHICAL COMMA-FREE REED-SOLOMON DECODING CIRCUIT AND METHOD THEREOF - The present invention discloses a configurable hierarchical comma-free Reed-Solomon decoding circuit and a method thereof. The design is based on an original hierarchical parallel architecture which not only completes a decoding process faster than conventional decoder, but also utilizes less hardware to perform various algorithms with less power consumed. The architecture of the present invention has higher decoding rate than the conventional systolic architecture by a cycle ratio of 22 to 94. Further, the present invention does not require the use of ROM to store 64 sets of codewords and uses logic gates less than one fourth of the logic gates than conventional systolic architecture. As a result, the circuit of the present invention occupies less area than the conventional architecture. The circuit of the present invention is also configurable for different applications, so it can always find an optimal compromise between speed and power consumption for various decoding requirements. | 06-10-2010 |
Chien-Chia Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090061155 | RESIN SURFACE LAYER AND METHOD OF FABRICATING THE SAME, COMPOSITE HAVING THE RESIN SURFACE LAYER AND METHOD OF FABRICATING THE SAME - A resin surface layer and a method of fabricating the same, and a composite having the resin surface layer and a method of fabricating the same are provided. The method of fabricating the resin surface layer includes: (a) providing a base, made of a resin and including a plurality of additive particles randomly distributed in the base; (b) changing the orientation of the additive particles to arrange the additive particles in a predetermined form; and (c) drying the base to make a surface of the base exhibit a visual effect of 3D texture. Thus, the visual effect of any 3D texture can be achieved by controlling the orientation of the additive particles. | 03-05-2009 |
| 20090291268 | RESIN SURFACE LAYER AND METHOD OF FABRICATING THE SAME, COMPOSITE HAVING THE RESIN SURFACE LAYER AND METHOD OF FABRICATING THE SAME - A resin surface layer and a method of fabricating the same, and a composite having the resin surface layer and a method of fabricating the same, are provided. The method of fabricating the resin surface layer includes: (a) providing a base, made of a resin and including a plurality of additive particles randomly distributed in the base, wherein the additive particles are selected from a group consisting of pigments, dyes, colorants, coloring matters, and pearl powders; (b) moving the base constantly, and providing a magnetic field generating device to generate an exterior magnetic field that has an uneven distribution of magnetic field intensity, and is applied to the base to change the orientation of the additive particles, so that the additive particles are arranged in a predetermined form; and (c) drying the base to make a surface of the base exhibit a visual effect of 3D texture. Thus, the visual effect of any 3D texture can be achieved by controlling the orientation of the additive particles. | 11-26-2009 |
Chin-Chia Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110193445 | Inner-Roter-Type Motor and Claw-Pole Member Thereof - An inner-rotor-type motor comprises a casing, a shaft and a claw-pole member. The shaft is rotatably coupled to the casing, and coupled to a permanent magnet having a magnetism-inducing surface. The claw-pole member is coupled within the casing and has an annual portion and a plurality of salient-poles. The annual portion has an inner circumferential wall. Each salient-pole is disposed between the annual portion and a respective pole plate. Each pole plate has a first side and a second side. The first side and the second side are opposing to each other. A magnetic pole surface is formed between the first side and the second side and faces the magnetism-inducing surface of the permanent magnet. An air gap is formed between the magnetic pole surface and the magnetism-inducing surface. Each pole plate has an extension portion and a shrinking portion. The coil unit is coupled to the plurality of salient-poles. | 08-11-2011 |
Chin-Chuan Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080316685 | ELECTRONIC CASING AND METHOD OF MANUFACTURING THE SAME - An electronic casing and a method of manufacturing the same are provided. The method includes the following steps. Step (a): a metal laminate and a die of a predetermined shape are provided. The metal laminate comprises a metal top layer and a metal bottom layer that are bonded by interface atom diffusion. Step (b): the metal laminate is processed to form a casing blank by using the die, and the casing blank has at least one turning portion. Step (c): a profiler of a predetermined shape and an electromagnetic forming device are provided. Step (d): the casing blank is attached to the profiler, and the electromagnetic forming device is disposed at a position corresponding to the turning portion. Step (e): the electromagnetic forming device is activated, so that the casing blank has a shape corresponding to the predetermined shape of the profiler. | 12-25-2008 |
Ching-Ya Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20120007510 | CONTROL MODULE WITH POWER SUPPLY DETECTION AND LAMP UTILIZING THE SAME - A lamp with power supply detection includes a power supply unit, a control module and a lighting module. The power supply unit provides a direct current (DC) voltage. The control module is coupled to the power supply unit, receives and stores the DC power, and generates a control signal according to whether the DC power is terminated or regained. The lighting module is coupled to the power supply unit and the control module, receives the DC power and adjusts brightness of the lighting module according to the control signal. | 01-12-2012 |
Chun-Lin Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110069026 | TOUCH PANEL MODULE FOR PROVIDING ELECTRICALLY-STIMULATED SENSATION FEEDBACK - A touch panel module has a touch panel, a sensation feedback panel, a control unit and a stimulating signal generating circuit. The sensation feedback panel is mounted on the touch panel and has multiple stimulating circuits arranged in a matrix configuration or a non-overlap configuration. The stimulating signal generating circuit electrically connects to the stimulating circuits and the control unit. When the control unit receives a touch signal produced by the touch panel, it controls the stimulating signal generating circuit to output stimulating currents to the stimulating circuits. When a user touches the stimulating circuits, the stimulating current can flow through the user's finger to electrically stimulate nerve, thereby achieving the sensation feedback effect to notice the user that the touch panel has been pressed properly to activate desired function. | 03-24-2011 |
Chun-Wei Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100282313 | DYE-SENSITIZED SOLAR CELL USING COMPOSITE SEMICONDUCTOR MATERIAL - The invention relates to a dye-sensitized solar cell using composite semiconductor materials, said composite semiconductor materials comprising semiconductor material particles and inorganic particulates coated on the surfaces of the semiconductor material particles, wherein the composite semiconductor materials have a surface area in the range from about 15 to about 80 m | 11-11-2010 |
Chun-Yuan Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100244758 | FAN DEVICE WITH IMPROVED SPEED CONTROL MODULE AND PLURAL FAN SYSTEM CONSTRUCTED THEREBY - A fan device with improved speed control module includes a stator, a rotor, and a speed control module. The stator has a driving unit outputting currents for the stator to generate alternative magnetic fields and thus turn the rotor. The speed control module includes a control unit and a speed adjusting circuit, with the control unit generating a control command for the driving unit and further outputting a state signal for the speed adjusting circuit to control whether a PWM signal enters the control circuit or not. | 09-30-2010 |
De-Jhen Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100246731 | Method, Apparatus, and Computer Program Product for Decoding Signals in a Wireless Communication Environment - An apparatus for decoding a received plurality of multi-path signals to recover the data content of transmitted signals may include an integrated circuit. The integrated circuit may be configured to generate a logarithm likelihood ratio based on a received plurality of multi-path signals, where the received plurality of multi-path signals is representative of transmitted data content. The integrated circuit may be further configured to arrange coefficients of an expression generated based on the received plurality of multi-path signals and integrate the expression. The integrated circuit may be further configured to divide the integrated expression by prior information. As a result, the integrated circuit may be configured to receive the plurality of multi-path signals and decode the signals via integration. Associated methods and computer program products may also be provided. | 09-30-2010 |
Guang-Miao Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090072651 | SLOTLESS WINDING FOR ROTATING ELECTRIC MACHINE AND MANUFACTURING METHOD THEREOF - The present invention relates to a slotless winding for a rotating electric machine and a manufacturing method thereof. The slotless winding includes at least one flexible printed circuit board having at least one circuit, and one piece of flexible printed circuit board(s) is curved or a plurality of pieces of flexible printed circuit board(s) is mutually combined to form a barrel shape, thereby simplifying the procedure of manufacturing the slotless winding, improving production speed and reliability, and enabling diversified designing schemes to meet the demands of the rotating electric machine. In addition, it is not necessary for the coil winding to be cured for assembling, and assembling yield is thus enhanced. | 03-19-2009 |
Han-Fen Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110280815 | COMPOSITION FOR INHIBITING MELANIN PRODUCTION AND APPLICATION THEREOF - The present invention provides a composition for inhibiting melanin production to promote skin whitening, which is characterized by containing compounds represented by formula (I): | 11-17-2011 |
Hsiang-Cheh Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090136023 | Data Encryption Method Using Discrete Fractional Hadamard Transformation - A data encryption method using discrete fractional Hadamard transformation includes the steps of: providing a set of data; processing the data with discrete fractional Hadamard transformation to generate at least one Hadamard matrix, the Hadamard matrix having eigen vectors corresponding to eigen values; selecting order parameters from order vectors of the Hadamard matrix; designating the order parameters as a private key in data encryption. In an embodiment, a set of integers is designated to define numerators and denominators of fractions which represent the eigen values of the Hadamard matrix. | 05-28-2009 |
Hsin-Wei Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100297455 | PRECURSOR SOLUTION FOR POLYIMIDE/SILICA COMPOSITE MATERIAL, ITS MANUFACTURE METHOD, AND POLYIMIDE/SILICA COMPOSITE MATERIAL HAVING LOW VOLUME SHRINKAGE - The present invention relates to a process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, comprising adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R | 11-25-2010 |
Hsiu-Feng Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100009323 | Simulation Software System and Method of Implementing The Same - A simulation software system includes a training module, a display device and a storage device. Events of a training material, operation blocks, response blocks and response images are provided in the storage device. A method of implementing the simulation software includes the steps of: defining a first of the events via the operation block and defining a second of the events via the response block; defining a response image or a series of response images depending upon the defined events, displaying the response image in the response block; judging whether the first and the second of the events have been completely defined; generating a training module from the first and the second of the events; connecting the training module with a human-machine interface and an abnormity/error-processing module. | 01-14-2010 |
Ing-Jer Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100117874 | BACKWARD COMPRESSION SYSTEM AND METHOD - A backward compression system and a backward compression method are provided. By using the system and the method, under limited memory space, a relationship between input data and previous data is identified in real time, the input data or previous data is encoded according to the relationship, and the order of data output is such that the encoded data is output first and the complete data is output second. When the output data is stored in circular memory and the memory gets full, the oldest encoded data is overwritten first, and the complete data is not overwritten until all the related encoded data is overwritten. Therefore, more original data can be preserved after decompression. Thus, system signals can be compressed and utilization of limited memory space can be improved. | 05-13-2010 |
| 20110023052 | COMPRESSED DATA MANAGING SYSTEM AND METHOD FOR CIRCULAR BUFFER - The invention relates to a compressed data managing system and method for circular buffer. By using the system and method of the invention, when storing the compressed data in a circular buffer and an event occurs, the hardware compression mechanism can stop immediately, without jeopardizing the decompression of the compressed data. Therefore, the system and method of the invention can overcome the following conventional problem: Conventional real-time tracers need several cycles to write the compressed data into the trace memory, which is unbeneficial to error diagnosis. Since when an error occurs, the system might enter the unstable state, this could cause that the tracers fail to write the last compressed data into the trace memory. | 01-27-2011 |
I-Yu Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090202349 | Self-Assembly Micro Fan - A self-assembly micro fan includes a body, a plurality of blades and flexible joints, with any one of the blades being connected to the body by one of the flexible joints while each flexible joint is regarded as a pivot to move the blade connected therewith to have an angle relative to a radial direction of the body. Besides, each of the flexible joints has plural link members or at least one link member and extension member to provide variable types of shape of the micro fans, so that the air driving efficiency of the self-assembly micro fan is improved. | 08-13-2009 |
| 20100231097 | Micro-Motor - A micro-motor includes a base, a rotor and a retaining member. The base includes an axle tube. The rotor includes a rotary member and a support member arranged between the rotary member and the base. The rotary member has a central hole where the axle tube of the base extends. The retaining member is mounted on the base and surrounds the rotor. One end of the retaining member, which doesn't couple to the base, extends towards the axle tube to form a retaining portion. The retaining portion is within a rotational area of the rotor in an axial direction of the axle tube. The rotor is arranged between the retaining portion and the base. Accordingly, the retaining member can retain the rotor to prevent departure of the rotor from the axle tube of the base and the central structure of the micro-motor is effectively simplified. | 09-16-2010 |
Jieh-Ren Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110126990 | Double-layered window curtain - A double-layered window curtain includes amounting seat, a window curtain unit, and a cover unit. The window curtain unit includes a curtain member mounted to the mounting seat and that has inner and outer surfaces, a driver disposed on the mounting seat, and a cord extending through the driver and connected to the curtain member on the inner surface of the curtain member. The cover unit includes a shade cloth connected to the inner surface of the curtain member and covering the cord. The curtain member and the shade cloth are together folded and unfolded by manipulation of the cord and by cooperation of the cord with the driver. | 06-02-2011 |
| 20110180221 | WINDOW BLIND ASSEMBLY - A window blind assembly includes a window blind unit, a protection unit, and a control unit. The window blind unit includes a mounting seat and a shading member that has a front surface and a rear surface. The protection unit includes a protection cord that is connected to the window blind unit, and a plurality of support rings connected to the protection cord. Select ones of the support rings are connected also to the rear surface of the shading member. The control unit includes a driver that is mounted to the mounting seat, and a cord that has a connecting segment and an extending segment. The connecting segment extends through the driver and the shading member, passes through the support rings, and is connected to the shading member of the window blind unit at a bottom end thereof. The extending segment is opposite to the connecting segment. | 07-28-2011 |
Jing-Yi Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080248327 | Method and system for making thin metal films - A method of forming a structure useful in all forms of deposited metals, elemental metals, metal alloys, metal compounds, metal systems, including refractory metals such as tungsten and tantalum is provided. The structure generally comprises a substrate, a first layer formed atop the substrate, and a second layer formed atop the first layer. The first layer comprises a metal, which can be chromium, gold, platinum, aluminum, nickel, or copper. The second layer comprises a metal, elemental metal, metal alloy, metal compound, or metal system comprising a refractory metal such as tungsten or tantalum. The substrate can be a silicon, quartz or glass, metal, metal oxide or nitride. | 10-09-2008 |
| 20110014400 | METHOD AND SYSTEM FOR MAKING THIN METAL FILMS - A method of forming a structure useful in all forms of deposited metals, elemental metals, metal alloys, metal compounds, metal systems, including refractory metals such as tungsten and tantalum is provided. The structure generally comprises a substrate, a first layer formed atop the substrate, and a second layer formed atop the first layer. The first layer comprises a metal, which can be chromium, gold, platinum, aluminum, nickel, or copper. The second layer comprises a metal, elemental metal, metal alloy, metal compound, or metal system comprising a refractory metal such as tungsten or tantalum. The substrate can be a silicon, quartz or glass, metal, metal oxide or nitride. | 01-20-2011 |
Jiun-Chiang Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090167428 | Combined Phase-Locked Loop and Amplitude-Locked Loop Module for Switching FM Signals - A combined PLL and ALL module for switching FM signals includes a PLL unit and an ALL unit electrically connected therewith. The PLL unit is used to initially process FM signals received from a co-channel. Outputs of the PLL unit are sent to the ALL unit and processed therein. The PLL unit and the ALL unit are controlled to process the FM signals by adjusting the ratio of second amplitude to first amplitude to closely approach a predetermined value such that the two FM signals are switched. | 07-02-2009 |
Kuo-Dong Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090101958 | TRENCH SOI-DRAM CELL AND METHOD FOR MAKING THE SAME - The present invention relates to a trench silicon-on-insulator (SOI) dynamic random access memory (DRAM) cell and a method for making the same. A source and a drain are utilized to each connect to one of two semiconductor conductive units on an external side of a main body having a plurality of semiconductor conductive units, and the semiconductor conductive units are utilized to accumulate electric charges generated from the drain so as to decrease a threshold voltage. In addition, the DRAM cell only uses one field effect transistor (FET) device ( | 04-23-2009 |
Lan Ting Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110086482 | APPARATUS AND ASSOCIATED METHOD FOR MAKING A FLOATING GATE CELL WITH INCREASED OVERLAY BETWEEN THE CONTROL GATE AND FLOATING GATE - A method for fabricating a floating gate memory device comprises using a buried diffusion oxide that is below the floating gate thereby producing an increased step height between the floating gate and the buried diffusion oxide. The increased step height can produce a higher GCR, while still allowing decreased cell size using a virtual ground array design. | 04-14-2011 |
Ming Hug Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090057501 | DISPLAY EXHIBITION FRAME - A display exhibition frame comprises a seat having two insertion holes at two sides; each insertion hole being installed with a supporting post; at least one receiving plate; each receiving plate being supported by two supporting arms; each supporting arm having a connecting hole; thus, in assembly, the supporting post passing through the connecting hole; a stud locking the supporting arm to the supporting post from the backside of the connecting hole; thus, by releasing the stud, the elevation of the supporting arm being adjustable; a display suspending frame being installed on the supporting posts; the supporting post including a first suspending frame and a second suspending frame; the first suspending frame having two through holes so as to receive the two supporting posts; the second suspending frame being a frame for locking a display; and the second suspending frame being able to be fixed to the first suspending frame. | 03-05-2009 |
Min-Lung Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080261390 | METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY - A method for forming metal bumps is provided. A bonding pad is first formed on the active surface of a chip and then a passivation layer is formed on the active surface of the chip and exposes the bonding pad. An under bump metallurgy is formed on the active surface of the chip to overlay the bonding pad. A layer of patterned photoresist is formed on the under bump metallurgy and exposes the portion of the under bump metallurgy on the bonding pad. A layer of copper is plated on the exposed portion of the under bump metallurgy and then a layer of solder is printed on the copper layer. Afterward the solder is reflowed to form a spherical metal bump. Finally, the photoresist layer is removed and the exposed portion of the under bump metallurgy is etched out. | 10-23-2008 |
| 20100052136 | Three-Dimensional Package and Method of Making the Same - A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder. | 03-04-2010 |
Min-Sheng Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080253153 | Active Power Conditioner - An active power conditioner includes a first power electronic switch set, a second power electronic switch set, a third power electronic switch set, an input filter and an output filter. The active power conditioner can supply a stable AC voltage to a load when a voltage variation is occurred at an AC power source by controlling either the second power electronic switch set or the third power electronic switch set via high-frequency switching, and the other power electronic switch sets that are not switched in high frequency are controlled to switch in low-frequency switching. | 10-16-2008 |
| 20080303680 | Display for Active Power Filter - A display for active power filter can be employed to show setting compensation parameters and real compensating information of the active power filter in operation in a same screen. Accordingly, the users can immediately diagnose whether resonance or other problem was appeared or not. | 12-11-2008 |
| 20090021964 | Modularized Active Power Filter - A modularized active power filter includes a control module and at least one power module. The control module automatically identifies the number of the parallel connected power modules and generates one set of PWM signals to correspondingly control the parallel connected power modules, so as to provide a final compensation current by single power module or plural power modules. Thereby, the compensation demand of a load is met. Consequently, the modularized active power filter is able to improve the flexibility of compensation capacity, shorten the time for service, be suitable for mass production, and lower the manufacturing cost. | 01-22-2009 |
Pei-Huo Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110250811 | MULTI-LAYERED MATERIAL AND A METHOD FOR MAKING THE SAME - A multi-layered material and a method for making the same are provided. The multi-layered material includes a first foamed layer, a substrate, a second foamed layer, and a surface layer. The first foamed layer has a plurality of first cells. The substrate is a fabric. The second foamed layer has a plurality of second cells. The foaming method of the second foamed layer is different from that of the first foamed layer. The size of the second cells is different from that of the first cells. The variation in size of the second cells is different from that of the first cells. The surface layer is disposed on the second foamed layer. Thus, when the multi-layered material is used as a surface cover of a ball, it can provide excellent resilience and control, and improve manufacturing efficiency. | 10-13-2011 |
| 20120021662 | LAMINATED MATERIAL AND METHOD FOR MAKING THE SAME - The present invention relates to a laminated material and a method for making the same. The laminated material includes a main layer, a surface layer and an adhesion layer. The main layer at least includes a first polymer resin. The surface layer is disposed on the main layer, the material of the surface layer is a second polymer resin, and the solid content of the second polymer resin is less than that of the first polymer resin. The adhesion layer is disposed under the main layer, and the material of the adhesion layer is thermoplastic resin which is adhesive when being heated, so that the laminated material can be directly attached to another element, thereby simplifying the process and reducing cost. | 01-26-2012 |
Ruei-Ming Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20120024369 | PHOTO-CHEMICAL SOLAR CELL WITH NANONEEDLE ELECTRODE AND METHOD MANUFACTURING THE SAME - A photo-chemical solar cell with nanoneedle electrode and a method manufacturing the same includes at least a working electrode, a counter electrode, an electrolyte layer and a photosensitized dye layer. The working electrode is an nanoneedle electrode formed from an nanoneedle semiconductor layer, wherein the nanoneedle semiconductor layer is prepared by sol-gel method at a low temperature to increase the specific surface area, adsorb more dye, increase the conductive ratio of the electrode, and thus improve the photo-current and the conversion efficiency. | 02-02-2012 |
Sheng-Ku Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110243687 | SPECIAL-SHAPED RIVETING PIN FOR STEPLESS SPEED CHANGE CLUTCH - A special-shaped riveting pin for a stepless speed change clutch includes a transmission plate and actuating blocks, which are firmly combined together by the special-shaped riveting pin. The transmission plate is bored with a non-round riveting hole while the special-shaped riveting pin is formed with a non-round riveting portion to be correspondingly riveted with the non-round riveting hole. Thus, the actuating blocks and the transmission plate can firmly combined together for reinforcing the riveting pin so that the stepless speed change clutch can be used for a vehicle engine that outputs comparatively large torsion. | 10-06-2011 |
Shih-Huang Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090098521 | TISSUE MIMICKING PHANTOM - A tissue mimicking phantom is disclosed, in which the tissue-mimicking phantom comprises: at least an upper gelatin layer, each configured with at least a sunken area; at least a lower gelatin layer, each disposed beneath the at least one upper gelatin layer while being configured with at least a microchannel network having blood-mimicking fluid flowing therein; and at least a micro-heater. By the use of the sunken area of the at least one upper gelatin layer to simulate shapes and depths of different trauma wounds, the healing of anyone of the trauma wounds can be accessed clinically through a physical properties test while subjecting the trauma wound under different negative pressures and different dressings. | 04-16-2009 |
Szu-Wei Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110159235 | COMPOSITE FIBER HAVING ELASTOMER AND METHOD FOR MAKING THE SAME, AND A SUBSTRATE HAVING THE COMPOSITE FIBER AND METHOD FOR MAKING THE SAME - A composite fiber having elastomer and method for making the same, and a substrate having the composite fiber and method for making the same are provided. The composite fiber includes a first composition and a second composition. The first composition is thermoplastic non-elastomer, and the second composition is thermoplastic elastomer (TPE). The second composition is in an amount of 5 to 70 weight % of the composite fiber. The first composition and the second composition are alternately distributed in a circumference of a cross-section of the composite fiber, and the length of the second composition is less than 50% of the total length of the circumference. The TPE can be dispersed uniformly and increase the adhesion between fibers, and the segmented fiber cross-section thereof further prevents the TPE from becoming too adhesive and affecting the processing during the fabrication of fibers and non-woven fabric substrates. Therefore, the non-woven fabric substrate or artificial leather made from the composite fiber has excellent textile feeling and physical properties. | 06-30-2011 |
Tai-Chi Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100224344 | Vibration Proof Structure Of Fan - A vibration proof structure of a fan is provided. The vibration proof structure includes a frame, a plurality of buffer members, and a plurality of rigid rods. The frame is adapted for assembling with a blade assembly. The buffer members are assembled to the frame. The rigid rods are assembled inside the buffer members, respectively. Each of the rigid rods comprises an axially penetrated through hole. After the fan is secured to the object to which the fan is desired to be assembled, the vibration caused in the operation of the fan can be effectively absorbed by the buffer members, and thus the noises can be eliminated. | 09-09-2010 |
Tai Yuan Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20090091036 | Wafer structure with a buffer layer - A wafer structure with a buffer layer is provided. The wafer structure comprises a wafer which has at least one pad formed thereon, a passivation layer formed on the wafer for partially exposing the at least one pad, a buffer layer formed on the passivation layer and the pad, and an under bump metallurgy (UBM) formed on the buffer layer. The buffer layer comprises a thickness-increased inner buffering member made from aluminum and located between the UBM and the pad to enhance the shock-absorbing ability of the wafer in a drop test to avoid the conductive bump bonded to a substrate coming off or cracking. The invention can also enhance the bonding between the conductive bump and the UBM. The buffer layer may further comprise an outer buffering member made of polyimide, coated on the passivation layer and partially arranged between the UBM and the passivation layer. | 04-09-2009 |
| 20100007004 | WAFER AND SEMICONDUCTOR PACKAGE - A wafer defines a plurality of chips arranged in array manner. Each chip includes at least one aluminum pad and a middle material. The middle material covers the aluminum pad and is mounted on the aluminum pad. | 01-14-2010 |
Tsung Chieh Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100019549 | EASY-ASSEMBLED CHAIR - An easy-assembled chair comprises a frame body having a seat frame; a cushion; the backside of the cushion having at least one recess; at least one through hole being formed in the recess; a back pad; a lower edge of the back pad being formed with at least one protruding sheet; at least one hook being installed at the protruding sheet; a combining device for combined handles or a table plate to legs of the seat frame of the frame body. The hook of the protruding sheet passes through the through hole of the recess of the cushion to hook the back rod of the seat frame. The frame body has supporting rods; and a rear side of the seat frame has a back rod; the hooks of the back pad can hook the back rod so as to secure the back pad to the frame body. | 01-28-2010 |
Wen-Pin Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20110193209 | SEMICONDUCTOR PACKAGE - The present invention relates to a semiconductor package, comprising a carrier, a semiconductor device, a first wire and a second wire. The carrier has a first electrically connecting portion and a second electrically connecting portion. The semiconductor device has a plurality of pads. The first wire electrically connects one of the pads of the semiconductor device and the first electrically connecting portion of the carrier, and the first wire has a first length. The second wire electrically connects one of the pads of the semiconductor device and the second electrically connecting portion of the carrier, and the second wire has a second length. The second length is larger than the first length, and the diameter of the second wire is larger than that of the first wire. Thus, the material usage for the wire is reduced, and the manufacturing cost is reduced. | 08-11-2011 |
Wen-Shian Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080252300 | Detecting device - A detecting device for detecting the electrical connection between several first pads and second pads of a package substrate is provided. The first and the second pads are disposed on two opposite sides of the package substrate. The detecting device includes a socket unit, several first detecting components and several second detecting components. The socket unit is disposed on and coupled to the first pads. The first detecting components are disposed on and coupled to the socket unit. The second detecting components are disposed under and coupled to the second pads. The socket unit and the second detecting components are disposed on two opposite sides of the package substrate. While detecting, the first detecting components, the socket unit, the first pads, the second pads and the second detecting components are electrically connected sequentially, so as to determine whether the first pads are respectively and electrically connected to the second pads. | 10-16-2008 |
Yao-Ting Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20080232077 | CONVERSION SUBSTRATE FOR A LEADFRAME AND THE METHOD FOR MAKING THE SAME - The present invention relates to a conversion substrate for a leadframe and the method for making the same. The conversion substrate comprises a core layer, a first copper layer, a first metal plating layer and a first brown/black oxide layer. The first copper layer is on a first surface of the core layer, and has a plurality of discontinuous sections. The first metal plating layer is on the first copper layer, and has a plurality of discontinuous sections. The first brown/black oxide layer is on the first copper layer, so as to protect the first copper layer. Thus, the polymeric solder mask is not used in the conversion substrate of the present invention, so that the metal plating layer will not be polluted, and the yield rate can be raised. | 09-25-2008 |
Yung-Fa Huang, Kaohsiung TW
| Patent application number | Description | Published |
|---|---|---|
| 20100109159 | BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS - A bumped chip is revealed, including a chip, a UBM layer, an Ag bump, and a creeping-resist layer. The chip has a bonding pad and a passivation layer covering one surface of the chip and exposing the bonding pad. The UBM layer is disposed on the bonding pad and covers the passivation layer at the peripheries of the opening. The Ag bump is disposed on the UBM layer to form as a pillar bump having a top surface and a pillar sidewall. The creeping-resist layer is formed at least on the pillar sidewall to fully encapsulate the Ag bump. Therefore, the disclosed bumped chip will have no Ag-creeping due to exerting stresses nor changing of joint heights under high temperature environment to meet the bumping requirements of lead-free, high reliability, and lower cost. | 05-06-2010 |