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Hualong Pan
Hualong Pan, Hamilton CA
| Patent application number | Description | Published |
|---|---|---|
| 20090142482 | Methods of Printing Conductive Silver Features - A method of forming a conductive ink silver features on a substrate by printing a silver compound solution and a hydrazine compound reducing agent solution on the surface of a substrate with a printhead. The silver compound solution and the hydrazine compound reducing agent solution are mixed just before, during, or following the printing of both solutions on the surface of the substrate, and the silver compound is then reduced to form conductive silver ink features on the substrate. | 06-04-2009 |
| 20090148600 | Metal Nanoparticles Stabilized With a Carboxylic Acid-Organoamine Complex - Metal nanoparticles with a stabilizer complex of a carboxylic acid-amine on a surface thereof is formed by reducing a metal carboxylate in the presence of an organoamine and a reducing agent compound. The metal carboxylate may include a carboxyl group having at least four carbon atoms, and the amine may include an organo group having from 1 to about 20 carbon atoms. | 06-11-2009 |
| 20090181183 | Stabilized Metal Nanoparticles and Methods for Depositing Conductive Features Using Stabilized Metal Nanoparticles - A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180° C. to form conductive features on the substrate. | 07-16-2009 |
| 20110034668 | ELECTRONIC DEVICES - An electronic device, such as a thin film transistor containing a semiconductor of the Formula: | 02-10-2011 |
Hualong Pan, Skokie, IL US
| Patent application number | Description | Published |
|---|---|---|
| 20100307594 | Conjugated Polymers and Their Use in Optoelectronic Devices - Disclosed are certain polymeric compounds and their use as organic semiconductors in organic and hybrid optical, optoelectronic, and/or electronic devices such as photovoltaic cells, light emitting diodes, light emitting transistors, and field effect transistors. The disclosed compounds can provide improved device performance, for example, as measured by power conversion efficiency, fill factor, open circuit voltage, field-effect mobility, on/off current ratios, and/or air stability when used in photovoltaic cells or transistors. The disclosed compounds can have good solubility in common solvents enabling device fabrication via solution processes. | 12-09-2010 |
Hualong Pan, Ottawa CA
| Patent application number | Description | Published |
|---|---|---|
| 20090242878 | OPTIMIZATION OF NEW POLYMER SEMICONDUCTORS FOR BETTER MOBILITY AND PROCESSIBALITY - In accordance with the invention, there are polymers (II) having the formula: | 10-01-2009 |
| 20090256138 | ORGANIC THIN FILM TRANSISTOR - Organic thin film transistors with improved mobility are disclosed. The semiconducting layer comprises a semiconductor material of Formula (I): | 10-15-2009 |
| 20090256139 | THIN-FILM TRANSISTORS - A thin film transistor having a semiconducting layer with improved flexibility and/or mobility is disclosed. The semiconducting layer comprises a semiconducting polymer and insulating polymer. Methods for forming and using such thin-film transistors are also disclosed. | 10-15-2009 |
| 20100038714 | DEVICE AND PROCESS INVOLVING PINHOLE UNDERCUT AREA - An electronic device fabrication method including: (a) providing a dielectric region and a lower electrically conductive region, wherein the dielectric region includes a plurality of pinholes each with an entry and an exit; and (b) depositing an etchant for the lower electrically conductive region into the pinholes that undercuts the pinholes to create for a number of the pinholes an overhanging surface of the dielectric region around the exit facing an undercut area of the lower electrically conductive region wider than the exit. | 02-18-2010 |