| Patent application number | Description | Published |
|---|
| 20080277779 | Microelectronic package and method of manufacturing same - A microelectronic package comprises a substrate ( | 11-13-2008 |
| 20090034206 | WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES - An embodiment of the present invention is a technique to fabricate a package. A heat spreader (HS) array on a HS support substrate is formed. The HS array has a plurality of heat spreaders. A diced wafer supported by a wafer support substrate (WSS) is formed. The diced wafer has a plurality of thin dice. The thin dice in the diced wafer are bonded to the heat spreaders in the HS array to form HS-bonded thin dice between the HS support substrate and the WSS. | 02-05-2009 |
| 20090166852 | SEMICONDUCTOR PACKAGES WITH THERMAL INTERFACE MATERIALS - A method comprises providing a layer of nano particles between a semiconductor die and a slug; and sintering the layer of nano particles to provide thermal interface material to bond the semiconductor die to a heat spreader formed by the slug. The sintering temperature of the nano particles is around 50° C. to around 200° C. | 07-02-2009 |
| 20100320576 | Die-warpage compensation structures for thinned-die devices, and methods of assembling same - A back-side lamination (BSL) is applied after thinning a microelectronic die. The BSL is configured to be a thermal-expansion complementary structure to a metal wiring interconnect layout that is disposed on the active side of the microelectronic die. | 12-23-2010 |
| 20110147059 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same - Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed. | 06-23-2011 |
| 20110147440 | Solder in Cavity Interconnection Technology - An interconnection technology may use molded solder to define solder balls. A mask layer may be patterned to form cavities and solder paste deposited in the cavities. Upon heating, solder balls are formed. The cavity is defined by spaced walls to keep the solder ball from bridging during a bonding process. In some embodiments, the solder bumps connected to the solder balls may have facing surfaces which are larger than the facing surfaces of the solder ball. | 06-23-2011 |
| Patent application number | Description | Published |
|---|
| 20090214475 | Extractability and Bioavailability of the Natural Antioxidant Astaxanthin From a Green Alga, Haematococcus Pluvialis - As the richest source of astaxanthin, a natural antioxidant and coloring agent, the unicellular green alga, | 08-27-2009 |
| 20100021968 | NOVEL CHLORELLA SPECIES AND USES THEREFOR - The present invention relates to algal species and compositions, methods for identifying algae that produce high lipid content, possess tolerance to high CO | 01-28-2010 |
| 20100028962 | Algal Medium Chain Length Fatty Acids and Hydrocarbons - The present invention provides methods and compositions for production of algal-based medium chain fatty acids and hydrocarbons. | 02-04-2010 |
| 20100028976 | PHOTOBIOREACTOR AND USES THEREFOR - The present invention provides novel photobioreactors, modules thereof, and methods for use in culturing and harvesting algae and cyanobacteria. | 02-04-2010 |
| 20100255541 | Advanced Algal Photosynthesis-Driven Bioremediation Coupled with Renewable Biomass and Bioenergy Production - The present invention relates to algal species and compositions, methods for identifying algae that produce high lipid content, possess tolerance to high CO | 10-07-2010 |
| 20100267085 | NOVEL PSEUDOCHLOROCOCCUM SPECIES AND USES THEREFOR - The present invention relates to algal species and compositions, methods for identifying algae that produce high lipid content and possess CO | 10-21-2010 |
