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Hsu, Taoyuan
Cheng-Yeh Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20090137090 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device is provided. A first active region and a second active region are defined in a substrate. An electrode covering the first active region and the second active region is formed on the substrate. A first sacrificial layer is formed on the second active layer. A first work function electrode is formed on the first active layer by performing a first doping process to a portion of the electrode. The first sacrificial layer is removed. A second sacrificial layer is formed on the first active layer. | 05-28-2009 |
Chih-Ho Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080226375 | THIN KEYPAD ASSEMBLY - A thin keypad assembly with a keypad panel of a smooth surface, a mist surface or a lines layer includes an elastic layer, a carrier and a keypad layer. The elastic layer includes a plurality of support portions, and each support portion has a protrusion. The carrier is installed on a surface of the elastic layer, and the joint surface of the carrier and the elastic layer sequentially includes a ground color layer, a function color layer and a font color layer. The keypad layer has a holder disposed on a surface of the carrier, and a plurality of protruding or flat keycaps are disposed on the holder, and a smooth surface is formed on the surface of the keycap, and the surface of the holder is a mist surface, or the surfaces of both keycap and holder are a lines layer. | 09-18-2008 |
| 20090114516 | METALLIC PANEL ASSEMBLY HAVING RIPPLE LUSTER - A metallic panel assembly having a ripple luster includes an elastic layer, an adhesive layer, a metallic keypad panel, an electroplated layer and an ultraviolet curable resin layer. The elastic layer has a carrier. The carrier is provided thereon with a plurality of protrusions. The adhesive layer is provided on one side surface of the carrier. The metallic keypad panel is provided on one side surface of the adhesive layer and has a thin plate thereon. The plate is provided thereon with a first hollowed portion and a second hollowed portion. The first hollowed portion is set as a pressing region of a key, and the second hollowed portion is set as an icon on the surface of the pressing region. The electroplated layer is provided on one side surface of the metallic keypad panel and penetrates into the first hollowed portion and the second hollowed portion. The ultraviolet curable resin layer is provided on one side surface of the electroplated layer to seal and fill the first hollowed portion and the second hollowed portion. The ultraviolet curable resin layer has a carrier thereon, and one side surface of the carrier is provided with a pattern surface. When external light illuminates the pattern surface of the metallic keypad panel, the pattern surface generates a reflective effect of a ripple luster. | 05-07-2009 |
| 20110260346 | METHOD OF MANUFACTURING LIGHT GUIDE PLATE OF KEYPAD - A method of manufacturing a light guide plate containing a plurality of light-guiding micro structures comprises the steps of: preparing a mold that has a concave hole formed by a plurality of light-guiding micro structures; pouring a mixture of ultraviolet curable resins and glass microbeads into the mold; attaching a carrier onto the mixture; using a rolling tool to roll the surface of the carrier, such that the mold is filled up with the mixture uniformly, while the air among the mold, the carrier and the mixture is discharged; and finally projecting the ultraviolet light onto the ultraviolet curable resin, such that the ultraviolet curable resin can be cured at the carrier and removed from the mold, so as to form a light guide plate having a plurality of light-guiding micro structures. | 10-27-2011 |
Chih-Hsiang Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20120120359 | TRIPLE-GATE LIQUID CRYSTAL DISPLAY PANEL - A triple-gate liquid crystal display (LCD) panel includes a plurality of first monochromatic pixels, a plurality of second monochromatic pixels, and a plurality of third monochromatic pixels. The first monochromatic pixels, the second monochromatic pixels, and the third monochromatic pixels are arranged in columns and rows. The first monochromatic pixels, the second monochromatic pixels, and the third monochromatic pixels in each row are repeatedly arranged in a horizontal sequence. The horizontal sequence from left to right is the first monochromatic pixel, the second monochromatic pixel, and the third monochromatic pixel. The first monochromatic pixels in each column are not adjacent to each other, the second monochromatic pixels in each column are not adjacent to each other, and the third monochromatic pixels in each column are not adjacent to each other. | 05-17-2012 |
Chi-Hsun Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080318354 | METHOD OF FABRICATING THIN FILM TRANSISTOR AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY - A method of fabricating a thin film transistor is provided. First, a patterned dielectric layer is formed over a substrate. A metallic layer is formed over the substrate to cover the patterned dielectric layer. Thereafter, the metallic layer is planarized until the patterned dielectric layer is exposed. The remained metallic layer serves as a gate. An insulating layer is formed over the patterned dielectric layer and the gate, and then a semiconductor layer is formed over the gate insulating layer above the gate. A source and a drain are formed over the semiconductor layer. | 12-25-2008 |
Chin-Wei Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20090320901 | CONCENTRATION PHOTOVOLTAIC CELL SYSTEM WITH LIGHT GUIDE - A concentration photovoltaic cell system with light guide includes a concentrator for focusing sunlight; a light guide located at where the sunlight is focused by the concentrator, so that the focused light is fully coupled to an input end of the light guide and propagates to an output end of the light guide; and a solar energy converter arranged at the output end of the light guide for receiving and converting the light projected from the light guide into electric energy. With the above arrangements, the solar converter may be located at a place not exposed to sunlight to avoid lowered energy conversion efficiency caused by temperature rising at photovoltaic cell chips thereof, and the use of the light guide enables increased GCR and light concentrating efficiency to enable reduced number of expensive photovoltaic cells. | 12-31-2009 |
Houng Kuo Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080211426 | Lamp Current Balancing Topologies - A method according to on embodiment may include generating AC voltage and current and a striking voltage. The method of this embodiment may also include generating striking voltage and steady-state voltage for at least two lamp loads. The method of this embodiment may also include coupling at least two lamp loads in parallel. The method of this embodiment may also include coupling current balancing circuitry to the at least two lamp loads and providing, by the current balancing circuitry simultaneous striking voltage to the at least two lamps loads. The method of this embodiment may also include balancing, by the current balancing circuitry, AC current through the at least two lamp loads. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment. | 09-04-2008 |
Hsu-Kuan Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100163299 | ELECTRONIC DEVICE AND HIGH FREQUENCY CIRCUIT BOARD THEREOF - An electronic device and a high frequency circuit board thereof are disclosed. The high frequency circuit board includes a first dielectric layer, a first signal line formed on the first dielectric layer, a second dielectric layer overlaying the first dielectric layer and covering the first signal line, and a first EMI shielding layer overlaying the second dielectric layer. The first EMI shielding layer has a gap formed thereon. The gap is formed at a position corresponding to the position of the first signal line. | 07-01-2010 |
Huang-Pin Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110068527 | WEB PRODUCT FOLDING AND STACKING MACHINE, AND WEB PRODUCT FOLDING AND STACKING METHOD USING THE MACHINE - A web product folding and stacking machine includes two folding line making rolls, two folding fingers, a first carrier unit, a stoppage unit and a holder. The folding line making rolls and the folding fingers are operated to fold up web products on a pad on the first carrier unit to form a stack of interfolded web products. When a stack of a predetermined number of interfolded web products is finished, the stoppage unit is extended out to have the finished stack of interfolded web products be carried with the holder and the stoppage unit to a predetermined location for delivery. Subject to the effect of the pad on the first carrier unit, web products are effectively folded up and stacked in a neat status. | 03-24-2011 |
Hung-Jen Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20090104547 | IMAGE SENSOR - A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines. | 04-23-2009 |
I-Jen Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080304125 | System and Method of the Optical Delay Line - This invention provides a system and a method of the optical delay line, wherein the system comprises a source and an array of mirrors, wherein the array of mirrors comprises a first reflective mirror, a second reflective mirror, a third reflective mirror, and a fourth reflective mirror. Beams from the source could be delayed because the beams are multi-reflected by the reflective mirrors. | 12-11-2008 |
Jui-Yuan Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080304238 | ELECTRONIC DEVICE HAVING PASSIVE HEAT-DISSIPATING MECHANISM - The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of the electronic component for facilitating radiating the heat from the electronic component to the ambient air via natural convection. The radiation enhancement layer is made of a ceramic material. | 12-11-2008 |
Jun-Chung Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20090293269 | Method For Selectively Processing Surface Tension Of Solder Mask Layer In Circuit Board - A method for selectively processing a surface tension of a solder mask layer in a circuit board is provided. The method conducts surface tension processing to the flip-chip area and the non-flip-chip area of the solder mask layer in the circuit board. Therefore, the underfill used in packaging configures relative contact angles at the flip-chip area and the non-flip-chip area of the solder mask layer, respectively. In such a way, the present invention is adapted to solve the difficulties of the underfill void bulb and the overflowing contamination at the same time. | 12-03-2009 |
| 20110048782 | Solder Pad Structure With High Bondability To Solder Ball - A solder pad structure with a high bondability to a solder ball is provided. The present invention provides a larger contact area with the solder ball so as to increase the bondability according to the principle that the bondability is positive proportional with the contact area therebetween. The solder pad structure includes a circuit board having a solder pad opening defined by a solder resist layer surrounding a circuit layer. The circuit layer within the solder pad opening is defined as a solder pad. In such a way, after filling the solder ball into the solder pad opening, besides walls of the solder pad opening, there are an extra contact area provided by a geometric shape of the solder pad for further improving the bondability of the solder pad and the solder ball. | 03-03-2011 |
| 20110049703 | Flip-Chip Package Structure - A flip-chip (FC) package structure is provided. The FC package structure includes a substrate, a chip, a plurality of copper platforms, a plurality of copper bumps, a plating layer, a circuit layer and a solder mask layer. The copper bumps are disposed on the substrate. The copper platforms are stacked on the copper bumps. The plating layer covers the copper bumps and the copper platforms, for contacting with chip foot pads configured at a bottom of the chip. The FC package structure does not need to reserve a space for wire bonding, thus saving the area of the substrate. The copper platforms are stacked on the copper bumps, and are higher than the circuit pattern layer. Therefore, the chip is blocked up, and the gap between the chip and the substrate is enlarged, thus preventing the risk of configuring voids when filling the cladding material and improving the packaging yield. | 03-03-2011 |
| 20110061234 | Method For Fabricating Carrier Board Having No Conduction Line - A method for fabricating a carrier board having no conduction line is provided. The fabricating method includes: providing a support plate having a detachable metal layer; providing a plating current via the support plate and the detachable metal layer to plate on the detachable metal layer to in sequence configure an etching resist layer and a plating metal layer; and then gradually completing other circuit layers by a compression laminating process with the support plate providing the plating current. After the entire plating process has been completed, the support plate and the detachable metal layer are removed. | 03-17-2011 |
Kuang-Bang Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110262089 | SMALL-DIAMETER HIGH BENDING-RESISTANCE FIBER OPTIC CABLE - A small-diameter high bending-resistance fiber optic cable adapted for obtaining a high tensile-resistance and a high bending-resistance is provided. The small-diameter high bending-resistance fiber optic cable is particularly adapted for being deployed in indoor pipelines. The small-diameter high bending-resistance fiber optic cable includes at least one optical fiber core, an outer protection sheath, and a plurality of tensile-resistance members. The optical fiber core is positioned in a center of the outer protection sheath. The tensile-resistance members are uniformly distributed in the outer protection sheath. The tensile-resistance members are made of aramid yarn material. | 10-27-2011 |
Kuang-Mei Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080293932 | PHTHALOCYANINE RECORDING LAYER OF OPTICAL RECORDING MEDIA - A phthalocyanine compound of formula (I) is provided for use in a recording layer of an optical recording media. | 11-27-2008 |
Kuo-Chan Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100318814 | POWER MANAGEMENT DEVICE AND POINT OF SALES TERMINAL APPARATUS USING THEREOF - A point of sales (POS) terminal apparatus including a POS device, a peripheral device, which is controlled by the POS device, an adapter, and a power management device is provided. The adapter provides a first power signal based on a wall-outlet power signal. The power management device provides the first power signal to drive the POS device and determines whether the first power signal satisfies a predetermined condition. When the first power signal fails to satisfy the predetermined condition, the power management device generates a second power signal and drives the peripheral device with the second power signal. When the first power signal satisfies the predetermined condition, the power management device drives the peripheral device with the first power signal. | 12-16-2010 |
Ming-Tan Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100220455 | BONDING STRUCTURE OF CIRCUIT SUBSTRATE FOR INSTANT CIRCUIT INSPECTING - The present invention provides a bonding structure of circuit substrates for instant circuit inspecting. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated. | 09-02-2010 |
Pi-Lin Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110010119 | Apparatus for monitoring the maintenance of systems in a nuclear power plant - An apparatus is disclosed for monitoring the maintenance of a plant that is equipped with various systems. The apparatus includes a screening module, a classifying module, a performance criteria-setting module, an availability data module, a reliability data module, a real-time monitoring module, a performance-assessing module and a special monitoring module. | 01-13-2011 |
Po-Nan Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110278774 | Molding apparatus and gas compression molding process - A molding apparatus has a multilayered structure with multiple die cavities, in which, one or a plurality of constraining components are each employed to pull both a stripper in a molding die and an adjacent sealing die by two ends, so as to strip the molded article and confine a distance between the two dies. Furthermore, during a molding process, a plurality of plates are each disposed between two dies. The molding apparatus is allowed to be closed gradually. After the molding, the molding apparatus is allowed to be opened gradually. When the stripper within the molding die and the sealing die both moved to be held by the two ends of the constraining components respectively, the stripper in each molding die will be pulled out by the buckle ring, thereby to strip the molded articles. Accordingly, a plurality of molded articles can be obtained in one molding operation. | 11-17-2011 |
Shao-Hua Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110294274 | METHOD OF FORMING METAL GATE STRUCTURE AND METHOD OF FORMING METAL GATE TRANSISTOR - A method of forming metal gate transistor includes providing a substrate; forming a gate dielectric layer, a work function metal layer and a polysilicon layer stacked on the substrate; forming a hard mask and a patterned photoresist on the polysilicon layer; removing the patterned photoresist, and next utilizing the hard mask as an etching mask to remove parts of the polysilicon layer and parts of the work function metal layer. Thus, a gate stack is formed. Since the patterned photoresist is removed before forming the gate stack, the gate stack is protected from damages of the photoresist-removing process. The photoresist-removing process does not attack the sidewalls of the gate stack, so a bird's beak effect of the gate dielectric layer is prevent. | 12-01-2011 |
Sheng-Yen Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110272023 | SOLAR CELL PACKAGING STRUCTURE - A lightweight, spill resistant, impact resistant and shatter resistant solar cell packaging structure practical for use in a portable product is disclosed to include a top covering layer and a bottom covering layer respectively molded from a thermoplastic polymer, and a solar cell layer formed of an array of solar cell chips and laminated in between the top covering layer and the bottom covering layer. | 11-10-2011 |
Shih-An Steve Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110248860 | SECURE DATA ENTRY DEVICE - A secure data entry device including a housing, a keypad mounted in the housing and including a plurality of selectably depressible keys, tampering alarm indication circuitry and at least one electrical conductor located in the housing in operative association with the keypad, the at least one electrical conductor being coupled to the tampering alarm indication circuitry and being arranged such that extraction of at least one of the plurality of selectably depressible keys results in at least one break in the at least one electrical conductor, which causes the tampering alarm indication circuitry to provide a tampering alarm indication. | 10-13-2011 |
Shih-Wei Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100240393 | SYSTEM AND METHOD FOR SENDING A CURRENT POSITION OF A COMMUNICATION DEVICE - A system and method for sending a current position of a communication device comprising a global positioning system detects current position of the communication device by the global positioning system when the communication device communicates with a receiving communication device, so as to acquire current position data and communication data from the communication device to the receiving communication device. The system and method further encodes and packs the current position data and the communication data, to generate a data package, and sends the data package to the receiving communication device. | 09-23-2010 |
| 20100273513 | MOBILE PHONE AND METHOD FOR SENDING MESSAGES USING THE MOBILE PHONE - A mobile phone includes a subscriber identity module (SIM) card, a SIM application toolkit (STK) driver, a STK interface and a user interface. The STK interface sends a selection command to the SIM card via the STK driver. The SIM card generates an input command according to the selection command, and sends the input command to the user interface via the STK driver. The user interface displays an input box on a display screen for receiving a user-inputted recipient phone number of a recipient mobile device according to the input command. The STK driver sends the multimedia messaging service (MMS) message to the recipient mobile device according to the recipient phone number if the message is an SMS message, and sends the short messaging service (SMS) message to the recipient mobile device according to the recipient phone number if the message is an MMS message. | 10-28-2010 |
Shin-Ping Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100006331 | Printed Circuit Board With Embedded Semiconductor Component and Method for Fabricating the Same - A printed circuit board having a semiconductor component embedded therein and a method of fabricating the same are proposed, including: providing a circuit board body having a through hole, a first surface and an opposing second surface both provided with a core circuit layer thereon; forming on the first surface a first dielectric layer with a dielectric-layer opening for exposing part of the first surface; forming a first circuit layer on the first dielectric layer, and forming first conductive vias in the first dielectric layer; fixing in position to the through hole a semiconductor chip having an active surface with electrode pads thereon; forming in the dielectric-layer opening a third dielectric layer for covering the active surface of the semiconductor chip; forming a third circuit layer on the third dielectric layer, and forming third conductive vias in the third dielectric layer. The printed circuit board thus fabricated is warpage-free. | 01-14-2010 |
Shu-Rong Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110192235 | DIGITAL DISPLAY MODULE FOR A TORSION WRENCH - A digital display module for a torsion wrench includes a housing sleeved on a shank of the torsion wrench. A microprocessor is disposed in the housing and includes a normal display model and an inverted display model therein, wherein the normal display model is provided for right-handed operator and the inverted display model is provided for left-handed operator. Multiple function keys are arranged on the periphery of the housing for selecting display models and inputting data. A display screen is mounted on the periphery of the housing and electrically connected to the microprocessor. The display screen is divided into a first display zone for showing numeral and a second display zone for showing scale ratio. A sensor is mounted on a torsion unit of the torsion wrench and electrically connected to the microprocessor for sensing the operating torsion and transmitting torsion data to the microprocessor. | 08-11-2011 |
Su-Chiung Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20080231406 | SURFACE MOUNT MAGNETIC DEVICE - A surface mount magnetic device includes a magnetic core assembly, a winding coil and an extension region. The magnetic core assembly includes a first magnetic part and a second magnetic part. The second magnetic part has a first surface and a second surface. The first surface of the second magnetic part is connected to second magnetic part such that a receptacle is formed between the first magnetic part and the second magnetic part. The winding coil is partially accommodated within the receptacle and includes at least two pins, wherein the pins are attached on the second surface of the second magnetic part. The extension region is integrally formed on the second surface of the second magnetic part. | 09-25-2008 |
Tien-Chu Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20100045688 | Dynamic Image Control Device Using Coincident Blank Insertion Signals - An image control device has display signals and blank insertion (BI) signals. Polarities of the display signals and those of the BI signals are coincident. Thus, BI signals are displayed in a way of 1+2 line inversion and differences of response times are eliminated to avoid affecting MPRT | 02-25-2010 |
Wen-Bi Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20090002002 | Electrical Testing System - Electrical testing system which is mainly used for testing double-sided printed board (DSB) (having terminals which are electrically connected with each other are separately provided on the two sides, respectively) is provided. The system includes a test board which is electrically contacted with the PCB, a test fixture which supports the test board and the PCB, testing probes which output an electrical signal, and a sensor which receives the electrical signal through the PCB and the test board. When the PCB is mounted on the test board, the electrical signal outputted from the testing probes sequentially is transmitted to the test board through the PCB, and based upon whether the sensor receives the electrical signal to thereby determine whether the terminals on the PCB corresponding to the testing probes are under the open circuit or the short circuit condition. | 01-01-2009 |
Wen-Fa Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110122113 | GATE DRIVING METHOD AND CIRCUIT FOR LIQUID CRYSTAL DISPLAY - A gate driving method for a liquid crystal display (LCD) and a gate driver thereof are provided. The LCD has a plurality of scan lines. The method starts by generating a gate driving signal. A correction signal is superposed to the gate driving signal to generate a corrected gate driving signal and to reduce a high voltage level of the gate driving signal, wherein a polarity of the correction signal is opposite to a polarity of the gate driving signal. The corrected gate driving signal is then outputted to drive one of the corresponding scan lines. | 05-26-2011 |
Yao-Tung Hsu, Taoyuan TW
| Patent application number | Description | Published |
|---|---|---|
| 20110103423 | Apparatus for Measuring the Temperature Coefficient of a Concentrator Photovoltaic Module - Disclosed is an apparatus for measuring temperature coefficients of a concentrator photovoltaic module. The apparatus includes a solar simulator for providing a radiant source, a environment chamber, a concentrator photovoltaic module, a temperature control unit for controlling the temperature of environment chamber, a circuit-voltage curve measurement unit for measuring current-voltage characteristics of a photovoltaic device and a reference cell for measuring the irradiation of the solar simulator. | 05-05-2011 |