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Hsiu-Ping
Hsiu-Ping Chen, Taipei City TW
| Patent application number | Description | Published |
|---|---|---|
| 20100141035 | METHOD AND APPARATUS FOR PROVIDING A POWER FACTOR CORRECTION (PFC) COMPATIBLE SOLUTION FOR NONSINUSOIDAL UNINTERRUPTIBLE POWER SUPPLY (UPS) - Methods and apparatuses for providing a solution for incompatibility between nonsinusoidal waveform uninterruptible power supply (UPS) systems and active power factor correction (PFC) loads are disclosed. An embodiment of the invention includes generating a nonsinusoidal signal waveform (e.g., a voltage waveform), to be delivered to the load, with a pulse width modulation (PWM) duty width, sampling the nonsinusoidal signal waveform to collect output signal samples, and adjusting the duty width to control the nonsinusoidal signal waveform as a function of the output signal samples to deliver a desired signal characteristic (e.g., RMS signal level) to the load. In embodiments of the invention, the output duty width is adjusted differently in cases of rising and falling power consumption, respectively, by the load. Techniques disclosed herein find broad applicability in UPS systems and inverters and improve efficiency and reliability for end users and utility providers. | 06-10-2010 |
Hsiu-Ping Lee, Tai Chung County TW
| Patent application number | Description | Published |
|---|---|---|
| 20100259949 | BACKLIGHT MODULE - A backlight module includes a frame, a reflective sheet, a light guide plate, a light source, and an optical film set. The frame defines an accommodation space, and the reflective sheet is disposed in the accommodation space. The light guide plate is disposed in the accommodation space and on one surface of the reflective sheet. The optical film set is disposed one side of the light guide plate opposite the reflective sheet. The reflective sheet is hollowed out at a position overlapping the light source to form at least one opening so as to reduce light halos. | 10-14-2010 |
Hsiu-Ping Lin, Hsin-Chu Hsien TW
| Patent application number | Description | Published |
|---|---|---|
| 20080231364 | AMPLIFYING CIRCUIT HAVING A PULL-UP CIRCUIT AND A PULL-DOWN CIRCUIT FOR INCREASING SLEW RATE - An amplifying circuit includes an operational amplifier, a pull-up circuit and a pull-down circuit. The operational amplifier generates a first pull-up signal, a first pull-down signal and an output signal, wherein the phases of the first pull-up signal and the first pull-down signal are out of phase with the output signal. The pull-up circuit includes a first controlling module for outputting a second pull-up signal according to the first pull-up signal, and a first adjusting module for adjusting the output signal according to the second pull-up signal. The pull-down circuit includes a second controlling module for outputting a second pull-down signal according to the first pull-down signal, and a second adjusting module for adjusting the output signal according to the second pull-down signal. | 09-25-2008 |
| 20090180031 | GAMMA VOLTAGE DRIVING CIRCUIT AND RELATED METHOD - A Gamma voltage driving circuit includes a setting circuit, a Gamma voltage generator, and a plurality of voltage output modules. The setting circuit respectively outputs a plurality of Gamma voltage setting signals at different time slots. The Gamma voltage generator respectively transforms the plurality of Gamma voltage setting signals into a plurality of corresponding voltage levels. The plurality of voltage output modules respectively provides voltage outputs at different time slots. Each voltage output module includes a plurality of voltage output circuits and a plurality of output control circuits. Each voltage output circuit includes a voltage selecting unit and an output buffering unit. The output control circuit controls the voltage output circuit to selectively output Gamma voltages. | 07-16-2009 |
Hsiu-Ping Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20080296880 | Method and device for protecting a motorcycle - A protecting device for a motorcycle. The protecting device may comprise a tilt-measuring module capable of measuring tilt of the motorcycle, an airbag capable of being inflated and expanding out of or to cover an outer surface of the motorcycle, a comparing module capable of comparing the tilt with a tilting limitation and generating a inflating signal if the tilt achieves or exceeds the tilting limitation and an inflation module capable of generating a gas to inflate the airbag if the inflation module receives the inflating signal. | 12-04-2008 |
| 20080300754 | Protecting systems for vehicles - A protecting system for a vehicle includes a tilt-detecting module capable of detecting a tilt condition of the vehicle, an airbag capable of being inflated and expanding to cover an outer surface of the vehicle if the airbag is inflated; and an inflation module capable of generating a gas to inflate the airbag. | 12-04-2008 |
| 20090127835 | WEARABLE AIRBAG SYSTEM AND METHOD - The present invention is related to a wearable airbag system applied for protecting a human on a vehicle. The wearable airbag system may include a wearable airbag module and a measurement module. The wearable airbag module may include an airbag configured to expand the volume of the airbag if the airbag is inflated and an inflator configured to be coupled with the airbag and generate a gas to inflate the airbag. The measurement module may be configured to measure a condition of the vehicle and control the inflator to inflate the airbag if the condition achieves or exceeds a limitation. | 05-21-2009 |
| 20090156233 | METHOD OF PROVIDING LOCATION-BASED SERVICE IN A COMMUNICATION SYSTEM - A location-based service method may include receiving a plurality of data through a first communication equipment, wherein each of the plurality of data is related to an indicator, the indicator being configured to indicate if the data is related to the location of a provider of the data, receiving a query through the first communication equipment or a second communication equipment located closely to the first communication equipment, and searching the plurality of data to find data related to the location of the provider and also related to the query to form a search result related to the query. | 06-18-2009 |
Hsiu-Ping Pearl Lin, Taipei TW
| Patent application number | Description | Published |
|---|---|---|
| 20090120808 | Device for Detecting Methanol Concentration and the Method Thereof - A device for detecting methanol concentration in an alcohol-containing solution is disclosed. The device implements an electrochemical bio-detector based on a two-enzyme system to quickly, easily and accurately measure methanol concentration in an alcohol-containing solution at a relatively low cost. A method for detecting methanol concentration in a sample using the same device is also disclosed. | 05-14-2009 |
Hsiu-Ping Wei, Dajia Town TW
| Patent application number | Description | Published |
|---|---|---|
| 20100283148 | Bump Pad Structure - An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad. | 11-11-2010 |
| 20110018128 | PACKAGE STRUCTURE AND METHOD FOR REDUCING DIELECTRIC LAYER DELAMINATION - A semiconductor package structure is provided. The structure includes a semiconductor chip having a plurality of interconnect layers formed thereover. A first passivation layer is formed over the plurality of interconnect layers. A stress buffer layer is formed over the first passivation layer. A bonding pad is formed over the stress buffer layer. A second passivation layer is formed over a portion of the bonding pad, the second passivation having at least one opening therein exposing a portion of the bonding pad. | 01-27-2011 |
| 20110079922 | INTEGRATED CIRCUIT WITH PROTECTIVE STRUCTURE, AND METHOD OF FABRICATING THE INTEGRATED CIRCUIT - A structure includes a semiconductor substrate having semiconductor devices formed on or in the substrate. An interconnecting metallization structure is formed over and connected to the devices. The interconnecting metallization structure including at least one dielectric layer. A passivation layer is deposited over the interconnecting metallization structure and the dielectric layer. At least one metal contact pad and at least one dummy metal structure are provided in the passivation layer. The contact pad is conductively coupled to at least one of the devices. The dummy metal structure is spaced apart from the contact pad and unconnected to the contact pad and the devices. | 04-07-2011 |